Yoshisato Yokoyama

Orcid: 0000-0001-8552-4070

According to our database1, Yoshisato Yokoyama authored at least 10 papers between 2014 and 2024.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

Legend:

Book 
In proceedings 
Article 
PhD thesis 
Dataset
Other 

Links

On csauthors.net:

Bibliography

2024
15.3 A 3nm FinFET 4.3GHz 21.1Mb/mm2 Double-Pumping 1-Read and 1-Write Pseudo-2-Port SRAM with Folded-Bitline Multi-Bank Architecture.
Proceedings of the IEEE International Solid-State Circuits Conference, 2024

2023
Disturbance Aware Dynamic Power Reduction in Synchronous 2RW Dual-Port 8T SRAM by Self-Adjusting Wordline Pulse Timing.
IEEE J. Solid State Circuits, 2023

2021
Cost-Effective Test Screening Method on 40-nm Embedded SRAMs for Low-Power MCUs.
IEEE Trans. Very Large Scale Integr. Syst., 2021

2020
A 29.2 Mb/mm<sup>2</sup> Ultra High Density SRAM Macro using 7nm FinFET Technology with Dual-Edge Driven Wordline/Bitline and Write/Read-Assist Circuit.
Proceedings of the IEEE Symposium on VLSI Circuits, 2020

2019
A Cost Effective Test Screening Circuit for embedded SRAM with Resume Standby on 110-nm SoC/MCU.
Proceedings of the IEEE Asian Solid-State Circuits Conference, 2019

2018
40-nm 64-kbit Buffer/Backup SRAM with 330 nW Standby Power at 65°C Using 3.3 V IO MOSs for PMIC less MCU in IoT Applications.
Proceedings of the IEEE Asian Solid-State Circuits Conference, 2018

2017
A dynamic power reduction in synchronous 2RW 8T dual-port SRAM by adjusting wordline pulse timing with same/different row access mode.
Proceedings of the IEEE Asian Solid-State Circuits Conference, 2017

2015
A cost effective test screening method on 40-nm 4-Mb embedded SRAM for low-power MCU.
Proceedings of the IEEE Asian Solid-State Circuits Conference, 2015

2014
40nm Ultra-low leakage SRAM at 170 deg.C operation for embedded flash MCU.
Proceedings of the Fifteenth International Symposium on Quality Electronic Design, 2014

40 nm Dual-port and two-port SRAMs for automotive MCU applications under the wide temperature range of -40 to 170°C with test screening against write disturb issues.
Proceedings of the IEEE Asian Solid-State Circuits Conference, 2014


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