Yasuhiro Take

According to our database, Yasuhiro Take authored at least 26 papers between 2011 and 2017.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of three.

2017

An image sensor/processor 3D stacked module featuring ThruChip interfaces.

Masayuki Ikebe, Tetsuya Asai, Masafumi Mori, Toshiyuki Itou, Daisuke Uchida, Yasuhiro Take, Tadahiro Kuroda, Masato Motomura

Proceedings of the 22nd Asia and South Pacific Design Automation Conference, 2017

2016

Efficient 3-D Bus Architectures for Inductive-Coupling ThruChip Interfaces.

Takahiro Kagami, Hiroki Matsutani, Michihiro Koibuchi, Yasuhiro Take, Tadahiro Kuroda, Hideharu Amano

IEEE Trans. Very Large Scale Integr. Syst., 2016

Motion-vector estimation and cognitive classification on an image sensor/processor 3D stacked system featuring ThruChip interfaces.

Tetsuya Asai, Masafumi Mori, Toshiyuki Itou, Yasuhiro Take, Masayuki Ikebe, Tadahiro Kuroda, Masato Motomura

Proceedings of the ESSCIRC Conference 2016: 42^nd European Solid-State Circuits Conference, 2016

Analytical thruchip inductive coupling channel design optimization.

Li-Chung Hsu, Junichiro Kadomoto, So Hasegawa, Atsutake Kosuge, Yasuhiro Take, Tadahiro Kuroda

Proceedings of the 21st Asia and South Pacific Design Automation Conference, 2016

2015

Relay Transmission Thruchip Interface with Low-Skew 3D Clock Distribution Network.

Yasuhiro Take, Tadahiro Kuroda

IEICE Trans. Electron., 2015

Through Chip Interface Based Three-Dimensional FPGA Architecture Exploration.

Li-Chung Hsu, Masato Motomura, Yasuhiro Take, Tadahiro Kuroda

IEICE Trans. Electron., 2015

A Study of Physical Design Guidelines in ThruChip Inductive Coupling Channel.

Li-Chung Hsu, Junichiro Kadomoto, So Hasegawa, Atsutake Kosuge, Yasuhiro Take, Tadahiro Kuroda

IEICE Trans. Fundam. Electron. Commun. Comput. Sci., 2015

Image sensor/digital logic 3D stacked module featuring inductive coupling channels for high speed/low-noise image transfer.

Masayuki Ikebe, Daisuke Uchida, Yasuhiro Take, Makito Someya, Satoshi Chikuda, Kento Matsuyama, Tetsuya Asai, Tadahiro Kuroda, Masato Motomura

Proceedings of the Symposium on VLSI Circuits, 2015

Circuit and package design for 44GB/s inductive-coupling DRAM/SoC interface.

Akira Okada, Abdul Raziz Junaidi, Yasuhiro Take, Atsutake Kosuge, Tadahiro Kuroda

Proceedings of the 20th Asia and South Pacific Design Automation Conference, 2015

Design and analysis for ThruChip design for manufacturing (DFM).

Li-Chung Hsu, Yasuhiro Take, Atsutake Kosuge, So Hasegawa, Junichiro Kadamoto, Tadahiro Kuroda

Proceedings of the 20th Asia and South Pacific Design Automation Conference, 2015

2014

3D NoC with Inductive-Coupling Links for Building-Block SiPs.

Yasuhiro Take, Hiroki Matsutani, Daisuke Sasaki, Michihiro Koibuchi, Tadahiro Kuroda, Hideharu Amano

IEEE Trans. Computers, 2014

A 352Gb/s inductive-coupling DRAM/SoC interface using overlapping coils with phase division multiplexing and ultra-thin fan-out wafer level package.

Abdul Raziz Junaidi, Yasuhiro Take, Tadahiro Kuroda

Proceedings of the Symposium on VLSI Circuits, 2014

Low-latency wireless 3D NoCs via randomized shortcut chips.

Hiroki Matsutani, Michihiro Koibuchi, Ikki Fujiwara, Takahiro Kagami, Yasuhiro Take, Tadahiro Kuroda, Paul Bogdan, Radu Marculescu, Hideharu Amano

Proceedings of the Design, Automation & Test in Europe Conference & Exhibition, 2014

2013

A Scalable 3D Heterogeneous Multicore with an Inductive ThruChip Interface.

Noriyuki Miura, Yusuke Koizumi, Yasuhiro Take, Hiroki Matsutani, Tadahiro Kuroda, Hideharu Amano, Ryuichi Sakamoto, Mitaro Namiki, Kimiyoshi Usami, Masaaki Kondo, Hiroshi Nakamura

IEEE Micro, 2013

Vertical Link On/Off Regulations for Inductive-Coupling Based Wireless 3-D NoCs.

Hao Zhang, Hiroki Matsutani, Yasuhiro Take, Tadahiro Kuroda, Hideharu Amano

IEICE Trans. Inf. Syst., 2013

3D clock distribution using vertically/horizontally-coupled resonators.

Yasuhiro Take, Noriyuki Miura, Hiroki Ishikuro, Tadahiro Kuroda

Proceedings of the 2013 IEEE International Solid-State Circuits Conference, 2013

A scalable 3D heterogeneous multi-core processor with inductive-coupling thruchip interface.

Noriyuki Miura, Yusuke Koizumi, Eiichi Sasaki, Yasuhiro Take, Hiroki Matsutani, Tadahiro Kuroda, Hideharu Amano, Ryuichi Sakamoto, Mitaro Namiki, Kimiyoshi Usami, Masaaki Kondo, Hiroshi Nakamura

Proceedings of the 2013 IEEE Hot Chips 25 Symposium (HCS), 2013

Demonstration of a heterogeneous multi-core processor with 3-D inductive coupling links.

Yusuke Koizumi, Noriyuki Miura, Yasuhiro Take, Hiroki Matsutani, Tadahiro Kuroda, Hideharu Amano, Ryuichi Sakamoto, Mitaro Namiki, Kimiyoshi Usami, Masaaki Kondo, Hiroshi Nakamura

Proceedings of the 23rd International Conference on Field programmable Logic and Applications, 2013

A case for wireless 3D NoCs for CMPs.

Hiroki Matsutani, Paul Bogdan, Radu Marculescu, Yasuhiro Take, Daisuke Sasaki, Hao Zhang, Michihiro Koibuchi, Tadahiro Kuroda, Hideharu Amano

Proceedings of the 18th Asia and South Pacific Design Automation Conference, 2013

2012

Simultaneous 6-Gb/s Data and 10-mW Power Transmission Using Nested Clover Coils for Noncontact Memory Card.

Andrzej Radecki, Yuxiang Yuan, Noriyuki Miura, Iori Aikawa, Yasuhiro Take, Hiroki Ishikuro, Tadahiro Kuroda

IEEE J. Solid State Circuits, 2012

CMA-Cube: A scalable reconfigurable accelerator with 3-D wireless inductive coupling interconnect.

Yusuke Koizumi, Eiichi Sasaki, Hideharu Amano, Hiroki Matsutani, Yasuhiro Take, Tadahiro Kuroda, Ryuichi Sakamoto, Mitaro Namiki, Kimiyoshi Usami, Masaaki Kondo, Hiroshi Nakamura

Proceedings of the 22nd International Conference on Field Programmable Logic and Applications (FPL), 2012

Simultaneous data and power transmission using nested clover coils.

Yasuhiro Take, Hayun Chung, Noriyuki Miura, Tadahiro Kuroda

Proceedings of the 17th Asia and South Pacific Design Automation Conference, 2012

Vertical Link On/Off Control Methods for Wireless 3-D NoCs.

Hao Zhang, Hiroki Matsutani, Yasuhiro Take, Tadahiro Kuroda, Hideharu Amano

Proceedings of the Architecture of Computing Systems - ARCS 2012 - 25th International Conference, Munich, Germany, February 28, 2012

2011

A 30 Gb/s/Link 2.2 Tb/s/mm ² Inductively-Coupled Injection-Locking CDR for High-Speed DRAM Interface.

Yasuhiro Take, Noriyuki Miura, Tadahiro Kuroda

IEEE J. Solid State Circuits, 2011

A vertical bubble flow network using inductive-coupling for 3-D CMPs.

Hiroki Matsutani, Yasuhiro Take, Daisuke Sasaki, Masayuki Kimura, Yuki Ono, Yukinori Nishiyama, Michihiro Koibuchi, Tadahiro Kuroda, Hideharu Amano

Proceedings of the NOCS 2011, 2011

A 2.7Gb/s/mm² 0.9pJ/b/chip 1coil/channel ThruChip interface with coupled-resonator-based CDR for NAND Flash memory stacking.

Noriyuki Miura, Yasuhiro Take, Mitsuko Saito, Yoichi Yoshida, Tadahiro Kuroda

Proceedings of the IEEE International Solid-State Circuits Conference, 2011