Dae-Young Lee

Orcid: 0000-0002-6790-5731

Affiliations:
  • SK Telecom, Network Research and Development Center, Seongnam, Korea
  • Samsung Electronics, Samsung Research, DMC Research and Development Center, 6G Research Team, Advanced Communications Center, Korea
  • University of Michigan, Department of Electrical Engineering and Computer Science, Ann Arbor, MI, USA (PhD 2012)


According to our database1, Dae-Young Lee authored at least 10 papers between 2009 and 2025.

Collaborative distances:
  • Dijkstra number2 of four.
  • Erdős number3 of four.

Timeline

Legend:

Book  In proceedings  Article  PhD thesis  Dataset  Other 

Links

Online presence:

On csauthors.net:

Bibliography

2025
A Scalable 16-Element and 45.5 dBm-EIRP D-Band CMOS Phased-Array Transceiver Integrated With Antenna-in-Package for 6G Communications.
IEEE Access, 2025

2024
A D-Band Variable Gain Low Noise Amplifier in a 28-nm CMOS Process for 6G Wireless Communications.
IEEE Trans. Circuits Syst. II Express Briefs, January, 2024

2019
A 60-GHz 3.0-Gb/s Spectrum Efficient BPOOK Transceiver for Low-Power Short-Range Wireless in 65-nm CMOS.
IEEE J. Solid State Circuits, 2019

2018
A Low-Power Pulse-Shaped Duobinary ASK Modulator for IEEE 802.11ad Compliant 60GHz Transmitter in 65nm CMOS.
IEICE Trans. Electron., 2018

A 28-GHz Fractional-N Frequency Synthesizer with Reference and Frequency Doublers for 5G Mobile Communications in 65nm CMOS.
IEICE Trans. Electron., 2018

2015
A 28-GHz fractional-N frequency synthesizer with reference and frequency doublers for 5G cellular.
Proceedings of the ESSCIRC Conference 2015, 2015

2014
A 12.5-Gb/s near-GND transceiver for wire-line UHD video interfaces.
Proceedings of the IEEE International Symposium on Circuits and Systemss, 2014

2011
Wireless wafer-level testing of integrated circuits via capacitively-coupled channels.
Proceedings of the 14th IEEE International Symposium on Design and Diagnostics of Electronic Circuits & Systems, 2011

A 900 Mbps single-channel capacitive I/O link for wireless wafer-level testing of integrated circuits.
Proceedings of the IEEE Asian Solid-State Circuits Conference, 2011

2009
Contactless testing: Possibility or pipe-dream?
Proceedings of the Design, Automation and Test in Europe, 2009


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