Dae-Young Lee
Orcid: 0000-0002-6790-5731Affiliations:
- SK Telecom, Network Research and Development Center, Seongnam, Korea
- Samsung Electronics, Samsung Research, DMC Research and Development Center, 6G Research Team, Advanced Communications Center, Korea
- University of Michigan, Department of Electrical Engineering and Computer Science, Ann Arbor, MI, USA (PhD 2012)
According to our database1,
Dae-Young Lee authored at least 10 papers
between 2009 and 2025.
Collaborative distances:
Collaborative distances:
Timeline
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Bibliography
2025
A Scalable 16-Element and 45.5 dBm-EIRP D-Band CMOS Phased-Array Transceiver Integrated With Antenna-in-Package for 6G Communications.
IEEE Access, 2025
2024
A D-Band Variable Gain Low Noise Amplifier in a 28-nm CMOS Process for 6G Wireless Communications.
IEEE Trans. Circuits Syst. II Express Briefs, January, 2024
2019
A 60-GHz 3.0-Gb/s Spectrum Efficient BPOOK Transceiver for Low-Power Short-Range Wireless in 65-nm CMOS.
IEEE J. Solid State Circuits, 2019
2018
A Low-Power Pulse-Shaped Duobinary ASK Modulator for IEEE 802.11ad Compliant 60GHz Transmitter in 65nm CMOS.
IEICE Trans. Electron., 2018
A 28-GHz Fractional-N Frequency Synthesizer with Reference and Frequency Doublers for 5G Mobile Communications in 65nm CMOS.
IEICE Trans. Electron., 2018
2015
A 28-GHz fractional-N frequency synthesizer with reference and frequency doublers for 5G cellular.
Proceedings of the ESSCIRC Conference 2015, 2015
2014
Proceedings of the IEEE International Symposium on Circuits and Systemss, 2014
2011
Wireless wafer-level testing of integrated circuits via capacitively-coupled channels.
Proceedings of the 14th IEEE International Symposium on Design and Diagnostics of Electronic Circuits & Systems, 2011
A 900 Mbps single-channel capacitive I/O link for wireless wafer-level testing of integrated circuits.
Proceedings of the IEEE Asian Solid-State Circuits Conference, 2011
2009
Proceedings of the Design, Automation and Test in Europe, 2009