Davide Cornigli

According to our database, Davide Cornigli authored at least 6 papers between 2018 and 2025.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of five.

2025

A Novel D2 Plasma Treatment for Defect Passivation: From Modeling to Process Optimization.

Sara Vecchi, Vikram Bhosle, Andrea Palmieri, Davide Cornigli, Fabrizio Buscemi, Andrea Padovani, Deven Raj, Andrew Cockburn, Lucien Date, Gaurav Thareja, Federico Nardi, Luca Larcher

Proceedings of the IEEE International Reliability Physics Symposium, 2025

Impact of Al-based Dipole Formation on Gate Stack Integrity and Reliability.

Bruno Coppolelli, Davide Cornigli, Zheyuan Chen, Andrea Padovani, Sara Vecchi, Yanliu Dang, Luc Thomas, Luca Vandelli, Jianxin Lei, Naomi Yoshida, Renu Whig, Federico Nardi, Gaurav Thareja, Luca Larcher, Milan Pesic

Proceedings of the IEEE International Reliability Physics Symposium, 2025

2024

Characterization and Multiscale Modeling of TDDB in State-of-the-art BEOL.

Andrea Palmieri, Mahdi Tavakoli, Chi Ching, Wenkai Zheng, Shi You, Xiaodong Zhang, Davide Cornigli, Michael Haverty, Navneet Singh, Luca Larcher, Monika Jamieson, Ajay Bhatnagar, Alexander Jansen, Max Gage, Jianshe Tang, Sameer Deshpande, Brian Brown, Arun Srivatsa, Mehul Naik, Bo Xie, Jerry Gelatos, Joung Joo Lee, Xianmin Tang, Gaurav Thareja, Milan Pesic

Proceedings of the IEEE International Reliability Physics Symposium, 2024

Low-PBTS defect-engineered high-mobility metal-oxide BEOL transistors.

Bastien Beltrando, Bruno Coppolelli, Jung-Bae Kim, Yang Ho Bae, Stephen Weeks, Lisa Enman, Ghazal Saheli, Davide Cornigli, Stuart Brinkley, Mark Saly, Luca Larcher, Dong Kil Yim, Milan Pesic

Proceedings of the IEEE International Reliability Physics Symposium, 2024

2019

Characterization and Modeling of BTI in SiC MOSFETs.

Davide Cornigli, Andrea Natale Tallarico, Susanna Reggiani, Claudio Fiegna, Enrico Sangiorgi, Luis Sanchez, Carlos Valdivieso, Giuseppe Consentino, Felice Crupi

Proceedings of the 49th European Solid-State Device Research Conference, 2019

2018

Electrical characterization of epoxy-based molding compounds for next generation HV ICs in presence of moisture.

Davide Cornigli, Susanna Reggiani, Antonio Gnudi, Elena Gnani, Giorgio Baccarani, Davide Fabiani, Dhanoop Varghese, Enis Tuncer, S. Krishnan, Luu Nguyen

Microelectron. Reliab., 2018