Alicja Lesniewska

According to our database1, Alicja Lesniewska authored at least 11 papers between 2015 and 2023.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of five.

Timeline

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Bibliography

2023
Towards accurate temperature prediction in BEOL for reliability assessment (Invited).
Proceedings of the IEEE International Reliability Physics Symposium, 2023

2022
First demonstration of Two Metal Level Semi-damascene Interconnects with Fully Self-aligned Vias at 18MP.
Proceedings of the IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits 2022), 2022

Degradation mechanisms in Germanium Electro-Absorption Modulators.
Proceedings of the IEEE International Reliability Physics Symposium, 2022

2021
Reliability of a DME Ru Semidamascene scheme with 16 nm wide Airgaps.
Proceedings of the IEEE International Reliability Physics Symposium, 2021

2020
Dielectric Reliability Study of 21 nm Pitch Interconnects with Barrierless Ru Fill.
Proceedings of the 2020 IEEE International Reliability Physics Symposium, 2020

2019
Role of Defects in the Reliability of HfO2/Si-Based Spacer Dielectric Stacks for Local Interconnects.
Proceedings of the IEEE International Reliability Physics Symposium, 2019

Accelerated Device Degradation of High-Speed Ge Waveguide Photodetectors.
Proceedings of the IEEE International Reliability Physics Symposium, 2019

2018

Insights into metal drift induced failure in MOL and BEOL.
Proceedings of the IEEE International Reliability Physics Symposium, 2018

Method to assess the impact of LER and spacing variation on BEOL dielectric reliability using 2D-field simulations for <20nm spacing.
Proceedings of the IEEE International Reliability Physics Symposium, 2018

2015
Intrinsic reliability of local interconnects for N7 and beyond.
Proceedings of the IEEE International Reliability Physics Symposium, 2015


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