Patrick Verdonck

According to our database1, Patrick Verdonck authored at least 2 papers between 2015 and 2020.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

Legend:

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PhD thesis 
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Links

On csauthors.net:

Bibliography

2020
Dielectric Reliability Study of 21 nm Pitch Interconnects with Barrierless Ru Fill.
Proceedings of the 2020 IEEE International Reliability Physics Symposium, 2020

2015
Impact of oxide liner properties on TSV Cu pumping and TSV stress.
Proceedings of the IEEE International Reliability Physics Symposium, 2015


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