Marleen H. van der Veen

According to our database, Marleen H. van der Veen authored at least 6 papers between 2014 and 2022.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2022

Assessment of critical Co electromigration parameters.

O. Varela Pedreira, Melina Lofrano, Houman Zahedmanesh, Philippe J. Roussel, Marleen H. van der Veen, Veerle Simons, Emmanuel Chery, Ivan Ciofi, Kris Croes

Proceedings of the IEEE International Reliability Physics Symposium, 2022

2021

Reliability of a DME Ru Semidamascene scheme with 16 nm wide Airgaps.

Alicja Lesniewska, Olalla Varela Pedreira, Melina Lofrano, Gayle Murdoch, Marleen H. van der Veen, Anish Dangol, Naoto Horiguchi, Zsolt Tökei, Kris Croes

Proceedings of the IEEE International Reliability Physics Symposium, 2021

2020

Metal reliability mechanisms in Ruthenium interconnects.

Olalla Varela Pedreira, Michele Stucchi, Anshul Gupta, Victor Vega-Gonzalez, Marleen van der Veen, Stephane Lariviere, Christopher J. Wilson, Zsolt Tökei, Kristof Croes

Proceedings of the 2020 IEEE International Reliability Physics Symposium, 2020

Dielectric Reliability Study of 21 nm Pitch Interconnects with Barrierless Ru Fill.

Alicja Lesniewska, Philippe J. Roussel, Davide Tierno, Victor Vega-Gonzalez, Marleen H. van der Veen, Patrick Verdonck, Nicolas Jourdan, Christopher J. Wilson, Zsolt Tökei, Kris Croes

Proceedings of the 2020 IEEE International Reliability Physics Symposium, 2020

2017

Doped GeSe materials for selector applications.

Naga Sruti Avasarala, Bogdan Govoreanu, Karl Opsomer, Wouter Devulder, Sergiu Clima, Christophe Detavernier, Marleen van der Veen, Jan Van Houdt, Marc Henys, Ludovic Goux, Gouri Sankar Kar

Proceedings of the 47th European Solid-State Device Research Conference, 2017

2014

Cu seeding using electroless deposition on Ru liner for high aspect ratio through-Si vias.

Fumihiro Inoue, Harold Philipsen, Marleen H. van der Veen, Kevin Vandersmissen, Stefaan Van Huylenbroeck, Herbert Struyf, Tetsu Tanaka

Proceedings of the 2014 International 3D Systems Integration Conference, 2014