Kenny Cheng-Hsiang Hsieh
According to our database1,
Kenny Cheng-Hsiang Hsieh
authored at least 9 papers
between 2015 and 2025.
Collaborative distances:
Collaborative distances:
Timeline
Legend:
Book In proceedings Article PhD thesis Dataset OtherLinks
On csauthors.net:
Bibliography
2025
36.1 A 32Gb/s 10.5Tb/s/mm 0.6pJ/b UCIe-Compliant Low-Latency Interface in 3nm Featuring Matched-Delay for Dynamic Clock Gating.
Proceedings of the IEEE International Solid-State Circuits Conference, 2025
4.6 A 0.8V, 31ppm/°C, -40dB DC-to-GHz Power-Supply-Rejection Standard-Vth Core-MOS-Only Voltage Reference with a 294µm<sup>2</sup>Area.
Proceedings of the IEEE International Solid-State Circuits Conference, 2025
2024
A 0.296pJ/bit 17.9Tb/s/mm<sup>2</sup> Die-to-Die Link in 5nm/6nm FinFET on a 9μm-Pitch 3D Package Achieving 10.24Tb/s Bandwidth at 16Gb/s PAM-4.
Proceedings of the IEEE Symposium on VLSI Technology and Circuits 2024, 2024
3.8 A 0.65V 900µm² BEoL RC-Based Temperature Sensor with ±1°C Inaccuracy from -25°C to 125°C.
Proceedings of the IEEE International Solid-State Circuits Conference, 2024
2020
IEEE J. Solid State Circuits, 2020
2019
A 7nm 4GHz Arm<sup>®</sup>-core-based CoWoS<sup>®</sup> Chiplet Design for High Performance Computing.
Proceedings of the 2019 Symposium on VLSI Circuits, Kyoto, Japan, June 9-14, 2019, 2019
A 56Gb/s PAM-4 Receiver with Voltage Pre-Shift CTLE and 10-Tap DFE of Tap-1 Speculation in 7nm FinFET.
Proceedings of the 2019 Symposium on VLSI Circuits, Kyoto, Japan, June 9-14, 2019, 2019
2016
A 16nm 256-bit wide 89.6GByte/s total bandwidth in-package interconnect with 0.3V swing and 0.062pJ/bit power in InFO package.
Proceedings of the 2016 IEEE Hot Chips 28 Symposium (HCS), 2016
2015
Proceedings of the 2015 IEEE Custom Integrated Circuits Conference, 2015