Bernard Previtali

According to our database, Bernard Previtali authored at least 9 papers between 2011 and 2022.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2022

A novel 3D 1T1R RRAM architecture for memory-centric Hyperdimensional Computing.

T. Dubreuil, P. Amari, S. Barraud, Joris Lacord, Eduardo Esmanhotto, Valentina Meli, S. Martin, Niccolo Castellani, Bernard Previtali, François Andrieu

Proceedings of the IEEE International Memory Workshop, 2022

2021

Wafer-scale fabrication of biologically sensitive Si nanowire FET: from pH sensing to electrical detection of DNA hybridization.

R. Midahuen, Bernard Previtali, C. Fontelaye, G. Nonglaton, V. Stambouli, Sylvain Barraud

Proceedings of the 51st IEEE European Solid-State Device Research Conference, 2021

2017

Guidelines for intermediate back end of line (BEOL) for 3D sequential integration.

Claire Fenouillet-Béranger, S. Beaurepaire, Fabien Deprat, Alexandre Ayres De Sousa, Laurent Brunet, Perrine Batude, Olivier Rozeau, François Andrieu, Paul Besombes, M.-P. Samson, Bernard Previtali, F. Nemouchi, G. Rodriguez, Philippe Rodriguez, R. Famulok, Nils Rambal, Viorel Balan, Z. Saghi, V. Jousseaume, Charles-Antoine Guérin, F. Ibars, F. Proud, D. Nouguier, David Ney, V. Delaye, H. Dansas, X. Federspiel, Maud Vinet

Proceedings of the 47th European Solid-State Device Research Conference, 2017

2016

Recent advances in 3D VLSI integration.

Claire Fenouillet-Béranger, Perrine Batude, Laurent Brunet, Vincent Mazzocchi, Cao-Minh Vincent Lu, Fabien Deprat, Jessy Micout, M.-P. Samson, Bernard Previtali, Paul Besombes, Nils Rambal, François Andrieu, Olivier Billoint, Melanie Brocard, Sébastien Thuries, Gerald Cibrario, Maud Vinet

Proceedings of the International Conference on IC Design and Technology, 2016

Opportunities brought by sequential 3D CoolCube™ integration.

Maud Vinet, Perrine Batude, Claire Fenouillet-Béranger, Laurent Brunet, Vincent Mazzocchi, Cao-Minh Vincent Lu, Fabien Deprat, Jessy Micout, Bernard Previtali, Paul Besombes, Nils Rambal, François Andrieu, Olivier Billoint, Melanie Brocard, Sébastien Thuries, Guillaume Berhault, Cristiano Lopes Dos Santos, Gerald Cibrario, Fabien Clermidy, Daniel Gitlin, Olivier Faynot

Proceedings of the 46th European Solid-State Device Research Conference, 2016

2014

FDSOI bottom MOSFETs stability versus top transistor thermal budget featuring 3D monolithic integration.

Claire Fenouillet-Béranger, Bernard Previtali, Perrine Batude, F. Nemouchi, Mikaël Cassé, Xavier Garros, L. Tosti, Nils Rambal, Dominique Lafond, H. Dansas, L. Pasini, Laurent Brunet, Fabien Deprat, M. Gregoire, M. Mellier, Maud Vinet

Proceedings of the 44th European Solid State Device Research Conference, 2014

2012

Scaling of Trigate nanowire (NW) MOSFETs Down to 5 nm Width: 300 K transition to Single Electron Transistor, challenges and opportunities.

Veeresh Deshpande, Sylvain Barraud, Xavier Jehl, Romain Wacquez, Maud Vinet, Remi Coquand, B. Roche, B. Voisin, François Triozon, C. Vizioz, L. Tosti, Bernard Previtali, P. Perreau, T. Poiroux, Marc Sanquer, Olivier Faynot

Proceedings of the 2012 European Solid-State Device Research Conference, 2012

2011

Mass Production of Silicon MOS-SETs: Can We Live with Nano-Devices' Variability?

Xavier Jehl, B. Roche, Marc Sanquer, B. Voisin, Romain Wacquez, Veeresh Deshpande, Bernard Previtali, Maud Vinet, J. Verduijn, Giuseppe Carlo Tettamanzi, Sven Rogge, D. Kotekar-Patil, Matthias Ruoff, D. Kern, D. A. Wharam, M. Belli, Enrico Prati, Marco Fanciulli

Proceedings of the 2nd European Future Technologies Conference and Exhibition, 2011

3D monolithic integration.

Perrine Batude, Maud Vinet, Arnaud Pouydebasque, Cyrille Le Royer, Bernard Previtali, Claude Tabone, Jean-Michel Hartmann, Loic Sanchez, Laurence Baud, Veronique Carron, Alain Toffoli, Fabienne Allain, Vincent Mazzocchi, Dominique Lafond, Simon Deleonibus, Olivier Faynot

Proceedings of the International Symposium on Circuits and Systems (ISCAS 2011), 2011