Teng Yang

Orcid: 0000-0003-0976-8780

According to our database1, Teng Yang authored at least 23 papers between 2014 and 2023.

Collaborative distances:
  • Dijkstra number2 of four.
  • Erdős number3 of four.

Timeline

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Links

On csauthors.net:

Bibliography

2023
Joint Contextual Representation Model-Informed Interpretable Network With Dictionary Aligning for Hyperspectral and LiDAR Classification.
IEEE Trans. Circuits Syst. Video Technol., November, 2023

2022
Depth-inspired Label Mining for Unsupervised RGB-D Salient Object Detection.
Proceedings of the MM '22: The 30th ACM International Conference on Multimedia, Lisboa, Portugal, October 10, 2022

Research and Implementation of the Early-late Gate Bit Synchronization Algorithm in the Non-coherent Spread Spectrum System.
Proceedings of the International Symposium on Networks, Computers and Communications, 2022

Reinforcement Learning based Optimal Tracking Control for Hypersonic Flight Vehicle: A Model Free Approach.
Proceedings of the 20th IEEE International Conference on Industrial Informatics, 2022

2021
Cooperative Transmission of Wireless Information and Energy in Anti-Eavesdropping UAV Relay Network.
IEEE Trans. Green Commun. Netw., 2021

2019
A Multi-index Examination Cheating Detection Method Based on Neural Network.
Proceedings of the 31st IEEE International Conference on Tools with Artificial Intelligence, 2019

2018
<i>In~Situ</i> and In-Field Technique for Monitoring and Decelerating NBTI in 6T-SRAM Register Files.
IEEE Trans. Very Large Scale Integr. Syst., 2018

An Area-Efficient Microprocessor-Based SoC With an Instruction-Cache Transformable to an Ambient Temperature Sensor and a Physically Unclonable Function.
IEEE J. Solid State Circuits, 2018

Recent advances in in-situ and in-field aging monitoring and compensation for integrated circuits: Invited paper.
Proceedings of the IEEE International Reliability Physics Symposium, 2018

2017
Computation collaboration in ultra dense network integrated with mobile edge computing.
Proceedings of the 28th IEEE Annual International Symposium on Personal, 2017

Compact and voltage-scalable sensor for accurate thermal sensing in dynamic thermal management.
Proceedings of the IEEE 60th International Midwest Symposium on Circuits and Systems, 2017

A technique to transform 6T-SRAM arrays into robust analog PUF with minimal overhead.
Proceedings of the IEEE International Symposium on Circuits and Systems, 2017

RGB-T SLAM: A flexible SLAM framework by combining appearance and thermal information.
Proceedings of the 2017 IEEE International Conference on Robotics and Automation, 2017

An area-efficient microcontroller with an instruction-cache transformable to an ambient temperature sensor and a physically unclonable function.
Proceedings of the 2017 IEEE Custom Integrated Circuits Conference, 2017

2016
Register file circuits and post-deployment framework to monitor aging effects in field.
Proceedings of the ESSCIRC Conference 2016: 42<sup>nd</sup> European Solid-State Circuits Conference, 2016

2015
Compact and Supply-Voltage-Scalable Temperature Sensors for Dense On-Chip Thermal Monitoring.
IEEE J. Solid State Circuits, 2015

Real-time information capturing and integration framework of the internet of manufacturing things.
Int. J. Comput. Integr. Manuf., 2015

Real-time information driven intelligent navigation method of assembly station in unpaced lines.
Comput. Ind. Eng., 2015

14.7 In-situ techniques for in-field sensing of NBTI degradation in an SRAM register file.
Proceedings of the 2015 IEEE International Solid-State Circuits Conference, 2015

2014
A Deep Graph Embedding Network Model for Face Recognition.
CoRR, 2014

Multi-agent based real-time production scheduling method for radio frequency identification enabled ubiquitous shopfloor environment.
Comput. Ind. Eng., 2014

16.4 0.6-to-1.0V 279μm<sup>2</sup>, 0.92μW temperature sensor with less than +3.2/-3.4°C error for on-chip dense thermal monitoring.
Proceedings of the 2014 IEEE International Conference on Solid-State Circuits Conference, 2014

Ameliorated joint synchronization and localization for 3D underwater sensor networks.
Proceedings of the 2014 IEEE/CIC International Conference on Communications in China, 2014


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