- Stanford University, USA
According to our database1, Krishna Saraswat authored at least 18 papers between 1995 and 2020.
IEEE Fellow 1989, "For contributions to metallization and interconnects for VLSI.".
Legend:Book In proceedings Article PhD thesis Other
Proceedings of the 2020 Device Research Conference, 2020
3D-stacked Strained SiGe/Ge Gate-All-Around (GAA) Structure Fabricated by 3D Ge Condensation.
Proceedings of the Device Research Conference, 2019
Keynote 1: The road to resilient computing in autonomous driving is paved with redundancy.
Proceedings of the IEEE International Reliability Physics Symposium, 2018
50GHz Ge waveguide electro-absorption modulator integrated in a 220nm SOI photonics platform.
Proceedings of the Optical Fiber Communications Conference and Exhibition, 2015
Physical vs. Virtual Express Topologies with Low-Swing Links for Future Many-Core NoCs.
Proceedings of the NOCS 2010, 2010
Performance comparison of cu/low-k, carbon nanotube, and optics for on-chip and off-chip interconnects.
Proceedings of the 11th International Workshop on System-Level Interconnect Prediction (SLIP 2009), 2009
Proceedings of the International Symposium on Circuits and Systems (ISCAS 2008), 2008
Modeling of the performance of carbon nanotube bundle, cu/low-k and optical on-chip global interconnects.
Proceedings of the Ninth International Workshop on System-Level Interconnect Prediction (SLIP 2007), 2007
Proceedings of the Sixth International Workshop on System-Level Interconnect Prediction (SLIP 2004), 2004
Performance Limitations of Devices and Interconnects and Possible Alternatives for Nanoelectronics.
Proceedings of the 5th International Symposium on Quality of Electronic Design (ISQED 2004), 2004
Power estimation in global interconnects and its reduction using a novel repeater optimization methodology.
Proceedings of the 39th Design Automation Conference, 2002
Proc. IEEE, 2001
3-D ICs: a novel chip design for improving deep-submicrometer interconnect performance and systems-on-chip integration.
Proc. IEEE, 2001
Reliability Studies on Multilevel Interconnection with Intermetal Dielectric Air Gaps.
Microelectron. Reliab., 2001
Compact Modeling and SPICE-Based Simulation for Electrothermal Analysis of Multilevel ULSI Interconnects.
Proceedings of the 2001 IEEE/ACM International Conference on Computer-Aided Design, 2001
Proceedings of the Second IEEE/ACM International Workshop on System-Level Interconnect Prediction (SLIP 2000), 2000
Proceedings of the 37th Conference on Design Automation, 2000
Flexible Relation: An Approach for Integrating Data from Multiple, Possibly Inconsistent Databases.
Proceedings of the Eleventh International Conference on Data Engineering, 1995