Yang Wan

According to our database, Yang Wan authored at least 12 papers between 2011 and 2023.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of three.

2023

Variable-Utility-Aware Manufacturing Service Collaboration Optimization Toward Industrial Internet Platforms.

Yongping Zhang, Ying Cheng, Haoyu Wang, Yang Wan, Feng Xiang, Fei Tao

IEEE Trans. Syst. Man Cybern. Syst., October, 2023

Dynamic Correlation between the Chinese and the US Financial Markets: From Global Financial Crisis to COVID-19 Pandemic.

Jianxu Liu, Yang Wan, Songze Qu, Ruihan Qing, Songsak Sriboonchitta

Axioms, January, 2023

2022

Evolution Assessment of Mining Subsidence Characteristics Using SBAS and PS Interferometry in Sanshandao Gold Mine, China.

Jia Liu, Fengshan Ma, Guang Li, Jie Guo, Yang Wan, Yewei Song

Remote. Sens., 2022

A Case Study on Ground Subsidence and Backfill Deformation Induced by Multi-Stage Filling Mining in a Steeply Inclined Ore Body.

Guang Li, Yang Wan, Jie Guo, Fengshan Ma, Haijun Zhao, Zhiqing Li

Remote. Sens., 2022

2021

CSI Fingerprinting Localization With Low Human Efforts.

Xinyu Tong, Yang Wan, Qianru Li, Xiaohua Tian, Xinbing Wang

IEEE/ACM Trans. Netw., 2021

Determining rigid body motion from accelerometer data through the square-root of a negative semi-definite tensor, with applications in mild traumatic brain injury.

Yang Wan, Alice Lux-Fawzi, Haneesh Kesari

CoRR, 2021

2019

Batch Localization Based on OFDMA Backscatter.

Xinyu Tong, Fengyuan Zhu, Yang Wan, Xiaohua Tian, Xinbing Wang

Proc. ACM Interact. Mob. Wearable Ubiquitous Technol., 2019

The successive node snapping scheme for an evolving branched curve in 2D and 3D.

Yang Wan, Tianju Xue, Yongxing Shen

Comput. Aided Des., 2019

2014

On Enhancing Power Benefits in 3D ICs: Block Folding and Bonding Styles Perspective.

Moongon Jung, Taigon Song, Yang Wan, Yarui Peng, Sung Kyu Lim

Proceedings of the 51st Annual Design Automation Conference 2014, 2014

2013

Transient modeling of TSV-wire electromigration and lifetime analysis of power distribution network for 3D ICs.

Xin Zhao, Yang Wan, Michael Scheuermann, Sung Kyu Lim

Proceedings of the IEEE/ACM International Conference on Computer-Aided Design, 2013

How to reduce power in 3D IC designs: A case study with OpenSPARC T2 core.

Moongon Jung, Taigon Song, Yang Wan, Young-Joon Lee, Debabrata Mohapatra, Hong Wang, Greg Taylor, Devang Jariwala, Vijay Pitchumani, Patrick Morrow, Clair Webb, Paul Fischer, Sung Kyu Lim

Proceedings of the IEEE 2013 Custom Integrated Circuits Conference, 2013

2011

Topic-level social network search.

Jie Tang, Sen Wu, Bo Gao, Yang Wan

Proceedings of the 17th ACM SIGKDD International Conference on Knowledge Discovery and Data Mining, 2011