Clair Webb

According to our database, Clair Webb authored at least 5 papers between 2002 and 2013.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of three.

2013

How to reduce power in 3D IC designs: A case study with OpenSPARC T2 core.

Moongon Jung, Taigon Song, Yang Wan, Young-Joon Lee, Debabrata Mohapatra, Hong Wang, Greg Taylor, Devang Jariwala, Vijay Pitchumani, Patrick Morrow, Clair Webb, Paul Fischer, Sung Kyu Lim

Proceedings of the IEEE 2013 Custom Integrated Circuits Conference, 2013

2009

Process, Temperature, and Supply-Noise Tolerant 45nm Dense Cache Arrays With Diffusion-Notch-Free (DNF) 6T SRAM Cells and Dynamic Multi-Vcc Circuits.

Muhammad M. Khellah, Nam-Sung Kim, Yibin Ye, Dinesh Somasekhar, Tanay Karnik, Nitin Borkar, Gunjan Pandya, Fatih Hamzaoglu, Tom Coan, Yih Wang, Kevin Zhang, Clair Webb, Vivek De

IEEE J. Solid State Circuits, 2009

2006

Die Stacking (3D) Microarchitecture.

Bryan Black, Murali Annavaram, Ned Brekelbaum, John DeVale, Lei Jiang, Gabriel H. Loh, Don McCaule, Patrick Morrow, Donald W. Nelson, Daniel Pantuso, Paul Reed, Jeff Rupley, Sadasivan Shankar, John Paul Shen, Clair Webb

Proceedings of the 39th Annual IEEE/ACM International Symposium on Microarchitecture (MICRO-39 2006), 2006

2004

3D Processing Technology and Its Impact on iA32 Microprocessors.

Bryan Black, Donald Nelson, Clair Webb, Nick Samra

Proceedings of the 22nd IEEE International Conference on Computer Design: VLSI in Computers & Processors (ICCD 2004), 2004

2002

A burn-in tolerant dynamic circuit technique.

Atila Alvandpour, Ram Krishnamurthy, Shekhar Borkar, A. Rahman, Clair Webb

Proceedings of the IEEE 2002 Custom Integrated Circuits Conference, 2002