Cedric Huyghebaert

According to our database, Cedric Huyghebaert authored at least 7 papers between 2009 and 2021.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2021

Graphene electro-absorption modulators integrated at wafer-scale in a CMOS fab.

Cheng Han Wu, Steven Brems, Didit Yudistira, Daire Cott, A. Milenin, Kevin Vandersmissen, A. Maestre, A. Centeno, Joris Van Campenhout, Cedric Huyghebaert, Marianna Pantouvaki

Proceedings of the 2021 Symposium on VLSI Circuits, Kyoto, Japan, June 13-19, 2021, 2021

2019

4-Channel C-Band WDM Transmitter Based on 10 GHz Graphene-Silicon Electro-Absorption Modulators.

Chiara Alessandri, Inge Asselberghs, Peter De Heyn, Steven Brems, Cedric Huyghebaert, Joris Van Campenhout, Dries Van Thourhout, Marianna Pantouvaki

Proceedings of the Optical Fiber Communications Conference and Exhibition, 2019

2018

Broadband 20 Gbit/s Graphene-Si Electro-Absorption Modulator.

Chiara Alessandri, Inge Asselberghs, Yoojin Ban, Steven Brems, Cedric Huyghebaert, Joris Van Campenhout, Dries Van Thourhout, Marianna Pantouvaki

Proceedings of the European Conference on Optical Communication, 2018

2017

WS2 transistors on 300 mm wafers with BEOL compatibility.

Tom Schram, Quentin Smets, Benjamin Groven, M. H. Heyne, E. Kunnen, A. Thiam, Katia Devriendt, Annelies Delabie, Dennis Lin, M. Lux, Daniele Chiappe, I. Asselberghs, S. Brus, Cedric Huyghebaert, S. Sayan, A. Juncker, Matty Caymax, Iuliana P. Radu

Proceedings of the 47th European Solid-State Device Research Conference, 2017

Tunneling transistors based on MoS2/MoTe2 Van der Waals heterostructures.

Yashwanth Balaji, Quentin Smets, Cesar J. Lockhart de la Rosa, Anh Khoa Augustin Lu, Daniele Chiappe, Tarun Agarwal, Dennis Lin, Cedric Huyghebaert, Iuliana P. Radu, Dan Mocuta, Guido Groeseneken

Proceedings of the 47th European Solid-State Device Research Conference, 2017

2015

Hybrid graphene-silicon photonics devices.

Dries Van Thourhout, Yingtao Hu, Marianna Pantouvaki, Koen Alexander, Bart Kuyken, Steven Brems, Inge Asselberghs, Cedric Huyghebaert, Chiara Alessandri, Philippe Absil, Joris Van Campenhout

Proceedings of the European Conference on Optical Communication, 2015

2009

3D Stacked IC demonstrator using Hybrid Collective Die-to-Wafer bonding with copper Through Silicon Vias (TSV).

Jan Van Olmen, Jan Coenen, Wim Dehaene, Kristin De Meyer, Cedric Huyghebaert, Anne Jourdain, Guruprasad Katti, Abdelkarim Mercha, Michal Rakowski, Michele Stucchi, Youssef Travaly, Eric Beyne, Bart Swinnen

Proceedings of the IEEE International Conference on 3D System Integration, 2009