Guruprasad Katti

According to our database, Guruprasad Katti authored at least 7 papers between 2009 and 2015.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2015

Fabrication and Assembly of Cu-RDL-Based 2.5-D Low-Cost Through Silicon Interposer (LC-TSI).

Guruprasad Katti, S. W. Ho, Li Hong Yu, Songbai Zhang, Rahul Dutta, Roshan Weerasekera, Ka-Fai Chang, Jong-Kai Lin, Srinivasa Rao Vempati, Surya Bhattacharya

IEEE Des. Test, 2015

2012

Capacitance Measurements of Two-Dimensional and Three-Dimensional IC Interconnect Structures by Quasi-Static C-V Technique.

Michele Stucchi, Dimitrios Velenis, Guruprasad Katti

IEEE Trans. Instrum. Meas., 2012

2011

Design Issues and Considerations for Low-Cost 3-D TSV IC Technology.

Geert Van der Plas, Paresh Limaye, Igor Loi, Abdelkarim Mercha, Herman Oprins, Cristina Torregiani, Steven Thijs, Dimitri Linten, Michele Stucchi, Guruprasad Katti, Dimitrios Velenis, Vladimir Cherman, Bart Vandevelde, Veerle Simons, Ingrid De Wolf, Riet Labie, Dan Perry, Stephane Bronckers, Nikolaos Minas, Miro Cupac, Wouter Ruythooren, Jan Van Olmen, Alain Phommahaxay, Muriel de Potter de ten Broeck, Ann Opdebeeck, Michal Rakowski, Bart De Wachter, Morin Dehan, Marc Nelis, Rahul Agarwal, Antonio Pullini, Federico Angiolini, Luca Benini, Wim Dehaene, Youssef Travaly, Eric Beyne, Paul Marchal

IEEE J. Solid State Circuits, 2011

2010

Design issues and considerations for low-cost 3D TSV IC technology.

Geert Van der Plas, Paresh Limaye, Abdelkarim Mercha, Herman Oprins, Cristina Torregiani, Steven Thijs, Dimitri Linten, Michele Stucchi, Guruprasad Katti, Dimitrios Velenis, Domae Shinichi, Vladimir Cherman, Bart Vandevelde, Veerle Simons, Ingrid De Wolf, Riet Labie, Dan Perry, Stephane Bronckers, Nikolaos Minas, Miro Cupac, Wouter Ruythooren, Jan Van Olmen, Alain Phommahaxay, Muriel de Potter de ten Broeck, Ann Opdebeeck, Michal Rakowski, Bart De Wachter, Morin Dehan, Marc Nelis, Rahul Agarwal, Wim Dehaene, Youssef Travaly, Pol Marchal, Eric Beyne

Proceedings of the IEEE International Solid-State Circuits Conference, 2010

Verifying electrical/thermal/thermo-mechanical behavior of a 3D stack - Challenges and solutions.

Geert Van der Plas, Steven Thijs, Dimitri Linten, Guruprasad Katti, Paresh Limaye, Abdelkarim Mercha, Michele Stucchi, Herman Oprins, Bart Vandevelde, Nikolaos Minas, Miro Cupac, Morin Dehan, Marc Nelis, Rahul Agarwal, Wim Dehaene, Youssef Travaly, Eric Beyne, Paul Marchal

Proceedings of the IEEE Custom Integrated Circuits Conference, 2010

2009

3-D Technology Assessment: Path-Finding the Technology/Design Sweet-Spot.

Paul Marchal, Bruno Bougard, Guruprasad Katti, Michele Stucchi, Wim Dehaene, Antonis Papanikolaou, Diederik Verkest, Bart Swinnen, Eric Beyne

Proc. IEEE, 2009

3D Stacked IC demonstrator using Hybrid Collective Die-to-Wafer bonding with copper Through Silicon Vias (TSV).

Jan Van Olmen, Jan Coenen, Wim Dehaene, Kristin De Meyer, Cedric Huyghebaert, Anne Jourdain, Guruprasad Katti, Abdelkarim Mercha, Michal Rakowski, Michele Stucchi, Youssef Travaly, Eric Beyne, Bart Swinnen

Proceedings of the IEEE International Conference on 3D System Integration, 2009