Guruprasad Katti

According to our database1, Guruprasad Katti authored at least 7 papers between 2009 and 2015.

Collaborative distances:
  • Dijkstra number2 of four.
  • Erdős number3 of four.

Timeline

Legend:

Book 
In proceedings 
Article 
PhD thesis 
Other 

Links

On csauthors.net:

Bibliography

2015
Fabrication and Assembly of Cu-RDL-Based 2.5-D Low-Cost Through Silicon Interposer (LC-TSI).
IEEE Des. Test, 2015

2012
Capacitance Measurements of Two-Dimensional and Three-Dimensional IC Interconnect Structures by Quasi-Static C-V Technique.
IEEE Trans. Instrum. Meas., 2012

2011
Design Issues and Considerations for Low-Cost 3-D TSV IC Technology.
IEEE J. Solid State Circuits, 2011

2010

Verifying electrical/thermal/thermo-mechanical behavior of a 3D stack - Challenges and solutions.
Proceedings of the IEEE Custom Integrated Circuits Conference, 2010

2009
3-D Technology Assessment: Path-Finding the Technology/Design Sweet-Spot.
Proc. IEEE, 2009

3D Stacked IC demonstrator using Hybrid Collective Die-to-Wafer bonding with copper Through Silicon Vias (TSV).
Proceedings of the IEEE International Conference on 3D System Integration, 2009


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