Chun Zhang
Affiliations:- Xilinx, San Jose, CA, USA
- Missouri University of Science and Technology, Rolla, MO, USA
- Nanyang Technological University, School of Electrical and Electronic Engineering, Singapore
- Fudan University, State Key Lab of ASIC and System, Shanghai, China (PhD 2011)
According to our database1,
Chun Zhang authored at least 19 papers
between 2010 and 2016.
Collaborative distances:
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Timeline
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Bibliography
2016
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2016
2014
IEEE Trans. Very Large Scale Integr. Syst., 2014
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2014
Proceedings of the IEEE/ACM International Conference on Computer-Aided Design, 2014
Proceedings of the Design, Automation & Test in Europe Conference & Exhibition, 2014
2013
Benchmarking for research in power delivery networks of three-dimensional integrated circuits.
Proceedings of the International Symposium on Physical Design, 2013
Novel crack sensor for TSV-based 3D integrated circuits: design and deployment perspectives.
Proceedings of the IEEE/ACM International Conference on Computer-Aided Design, 2013
Proceedings of the IEEE/ACM International Conference on Computer-Aided Design, 2013
3D reconfigurable power switch network for demand-supply matching between multi-output power converters and many-core microprocessors.
Proceedings of the Design, Automation and Test in Europe, 2013
Thermal-reliable 3D clock-tree synthesis considering nonlinear electrical-thermal-coupled TSV model.
Proceedings of the 18th Asia and South Pacific Design Automation Conference, 2013
2012
IEICE Electron. Express, 2012
Design of low power 3D hybrid memory by non-volatile CBRAM-crossbar with block-level data-retention.
Proceedings of the International Symposium on Low Power Electronics and Design, 2012
Proceedings of the 2012 Design, Automation & Test in Europe Conference & Exhibition, 2012
2011
Proceedings of the ACM/SIGDA 19th International Symposium on Field Programmable Gate Arrays, 2011
Design exploration of 3D stacked non-volatile memory by conductive bridge based crossbar.
Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011
2010
IEICE Trans. Fundam. Electron. Commun. Comput. Sci., 2010
Proceedings of the 2010 International Conference on Computer-Aided Design, 2010
Proceedings of the ACM/SIGDA 18th International Symposium on Field Programmable Gate Arrays, 2010