Liang-Chia Cheng

According to our database1, Liang-Chia Cheng authored at least 17 papers between 2008 and 2017.

Collaborative distances:
  • Dijkstra number2 of four.
  • Erdős number3 of four.

Timeline

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Links

On csauthors.net:

Bibliography

2017
Ping-Pong Mesh: A New Resonant Clock Design for Surge Current and Area Overhead Reduction.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2017

Thermal modeling and design on smartphones with heat pipe cooling technique.
Proceedings of the 2017 IEEE/ACM International Conference on Computer-Aided Design, 2017

2016
On the Optimal Threshold Voltage Computation of On-Chip Noise Sensors.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2016

Selective body biasing for post-silicon tuning of sub-threshold designs: A semi-infinite programming approach with Incremental Hypercubic Sampling.
Integr., 2016

2015
Selective Body Biasing for Post-Silicon Tuning of Sub-Threshold Designs: An Adaptive Filtering Approach.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2015

2014
Separate Clock Network Voltage for Correcting Random Errors in ULV Clocked Storage Cells.
IEEE Trans. Circuits Syst. II Express Briefs, 2014

Methodology of exploring ESL/RTL many-core platforms for developing embedded parallel applications.
Proceedings of the 27th IEEE International System-on-Chip Conference, 2014

Incremental transient simulation of power grid.
Proceedings of the International Symposium on Physical Design, 2014

Variation aware optimal threshold voltage computation for on-chip noise sensors.
Proceedings of the IEEE/ACM International Conference on Computer-Aided Design, 2014

2013
Power delivery network design for wiring and TSV resource minimization in TSV-based 3-D ICs.
Proceedings of the 2013 International Symposium on VLSI Design, Automation, and Test, 2013

A 0.48V 0.57nJ/pixel video-recording SoC in 65nm CMOS.
Proceedings of the 2013 IEEE International Solid-State Circuits Conference, 2013

Benchmarking for research in power delivery networks of three-dimensional integrated circuits.
Proceedings of the International Symposium on Physical Design, 2013

Cost-Effective TAP-Controlled Serialized Compressed Scan Architecture for 3D Stacked ICs.
Proceedings of the 22nd Asian Test Symposium, 2013

Back-End-of-Line Defect Analysis for Rnv8T Nonvolatile SRAM.
Proceedings of the 22nd Asian Test Symposium, 2013

2012
Reliable Power Delivery System Design for Three-Dimensional Integrated Circuits (3D ICs).
Proceedings of the IEEE Computer Society Annual Symposium on VLSI, 2012

Capturing the phantom of the power grid - on the runtime adaptive techniques for noise reduction.
Proceedings of the 17th Asia and South Pacific Design Automation Conference, 2012

2008
Impact of Capacitance Correlation on Yield Enhancement of Mixed-Signal/Analog Integrated Circuits.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2008


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