Geert Van der Plas

According to our database, Geert Van der Plas authored at least 110 papers between 1994 and 2023.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2023

Impact of gate-level clustering on automated system partitioning of 3D-ICs.

Quentin Delhaye, Eric Beyne, Joël Goossens, Geert Van der Plas, Dragomir Milojevic

Microelectron. J., September, 2023

Towards Chip-Package-System Co-optimization of Thermally-limited System-On-Chips (SOCs).

Subrat Mishra, Sankatali Venkateswarlu, Bjorn Vermeersch, Moritz Brunion, Melina Lofrano, Dawit Burusie Abdi, Herman Oprins, Dwaipayan Biswas, Odysseas Zografos, Gaspard Hiblot, Geert Van der Plas, Pieter Weckx, Geert Hellings, James Myers, Francky Catthoor, Julien Ryckaert

Proceedings of the IEEE International Reliability Physics Symposium, 2023

NimbleAI: Towards Neuromorphic Sensing-Processing 3D-integrated Chips.

Xabier Iturbe, Nassim Abderrahmane, Jaume Abella, Sergi Alcaide, Eric Beyne, Henri-Pierre Charles, Christelle Charpin-Nicolle, Lars Chittka, Angélica Dávila, Arne Erdmann, Carles Estrada, Ander Fernández, Anna Fontanelli, José Flich, Gianluca Furano, Alejandro Hernán Gloriani, Erik Isusquiza, Radu Grosu, Carles Hernández, Daniele Ielmini, David Jackson, Maha Kooli, Nicola Lepri, Bernabé Linares-Barranco, Jean-Loup Lachese, Eric Laurent, Menno Lindwer, Frank Linsenmaier, Mikel Luján, Karel Masarík, Nele Mentens, Orlando Moreira, Chinmay Nawghane, Luca Peres, Jean-Philippe Noel, Arash Pourtaherian, Christoph Posch, Peter Priller, Zdenek Prikryl, Felix Resch, Oliver Rhodes, Todor P. Stefanov, Moritz Storring, Michele Taliercio, Rafael Tornero, Marcel D. van de Burgwal, Geert Van der Plas, Elisa Vianello, Pavel Zaykov

Proceedings of the Design, Automation & Test in Europe Conference & Exhibition, 2023

Design Enablement of 3-Dies Stacked 3D-ICs Using Fine-Pitch Hybrid-Bonding and TSVs.

Mohamed Naeim, Hanqi Yang, Pinhong Chen, Rong Bao, Antoine Dekeyser, Giuliano Sisto, Moritz Brunion, Rongmei Chen, Geert Van der Plas, Eric Beyne, Dragomir Milojevic

Proceedings of the IEEE International 3D Systems Integration Conference, 2023

2022

84%-Efficiency Fully Integrated Voltage Regulator for Computing Systems Enabled by 2.5-D High-Density MIM Capacitor.

Hesheng Lin, Dimitrios Velenis, Philip Nolmans, Xiao Sun, Francky Catthoor, Rudy Lauwereins, Geert Van der Plas, Eric Beyne

IEEE Trans. Very Large Scale Integr. Syst., 2022

Efficient Backside Power Delivery for High-Performance Computing Systems.

Hesheng Lin, Geert Van der Plas, Xiao Sun, Dimitrios Velenis, Francky Catthoor, Rudy Lauwereins, Eric Beyne

IEEE Trans. Very Large Scale Integr. Syst., 2022

Scaled FinFETs Connected by Using Both Wafer Sides for Routing via Buried Power Rails.

Anabela Veloso, Anne Jourdain, D. Radisic, Rongmei Chen, G. Arutchelvan, B. O'Sullivan, Hiroaki Arimura, Michele Stucchi, An De Keersgieter, M. Hosseini, T. Hopf, K. D'Have, S. Wang, E. Dupuy, G. Mannaert, Kevin Vandersmissen, S. Iacovo, P. Marien, S. Choudhury, F. Schleicher, F. Sebaai, Y. Oniki, X. Zhou, A. Gupta, Tom Schram, B. Briggs, C. Lorant, E. Rosseel, Andriy Hikavyy, Roger Loo, J. Geypen, D. Batuk, G. T. Martinez, J. P. Soulie, Katia Devriendt, B. T. Chan, S. Demuynck, Gaspard Hiblot, Geert Van der Plas, Julien Ryckaert, Gerald Beyer, E. Dentoni Litta, Eric Beyne, Naoto Horiguchi

Proceedings of the IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits 2022), 2022

Enabling Active Backside Technology for ESD and LU Reliability in DTCO/STCO.

Kateryna Serbulova, S.-H. Chen, Geert Hellings, Anabela Veloso, Anne Jourdain, Dimitri Linten, J. De Boeck, Guido Groeseneken, Julien Ryckaert, Geert Van der Plas, Eric Beyne, Eugenio Dentoni Litta, Naoto Horiguchi

Proceedings of the IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits 2022), 2022

(Why do we need) Wireless Heterogeneous Integration (anyway?).

Michaël Peeters, S. Sinha, Xiao Sun, Claude Desset, Giuseppe Gramegna, John Slabbekoorn, Pieter Bex, N. Pinho, Tomas Webers, Dimitrios Velenis, A. Miller, Nadine Collaert, Geert Van der Plas, Eric Beyne, M. Huynen, R. Broucke

Proceedings of the IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits 2022), 2022

Backside PDN and 2.5D MIMCAP to Double Boost 2D and 3D ICs IR-Drop beyond 2nm Node.

Rongmei Chen, Giuliano Sisto, Michele Stucchi, Anne Jourdain, Kenichi Miyaguchi, Pieter Schuddinck, P. Woeltgens, H. Lin, Naveen Kakarla, Anabela Veloso, Dragomir Milojevic, Odysseas Zografos, Pieter Weckx, Geert Hellings, Geert Van der Plas, Julien Ryckaert, Eric Beyne

Proceedings of the IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits 2022), 2022

Opportunities of Chip Power Integrity and Performance Improvement through Wafer Backside (BS) Connection: Invited Paper.

Rongmei Chen, Giuliano Sisto, Odysseas Zografos, Dragomir Milojevic, Pieter Weckx, Geert Van der Plas, Eric Beyne

Proceedings of the 24th ACM/IEEE Workshop on System Level Interconnect Pathfinding, 2022

2021

Design and Technology Solutions for 3D Integrated High Performance Systems.

Geert Van der Plas, Eric Beyne

Proceedings of the 2021 Symposium on VLSI Circuits, Kyoto, Japan, June 13-19, 2021, 2021

Design And Sign-off Methodologies For Wafer-To-Wafer Bonded 3D-ICs At Advanced Nodes (invited).

Giuliano Sisto, Rongmei Chen, Richard Chou, Geert Van der Plas, Eric Beyne, Rod Metcalfe, Dragomir Milojevic

Proceedings of the ACM/IEEE International Workshop on System Level Interconnect Prediction, 2021

2019

Comparative Analysis of the Degradation Mechanisms in Logic and I/O FinFET Devices Induced by Plasma Damage.

Gaspard Hiblot, Yefan Liu, Geert Hellings, Geert Van der Plas

Proceedings of the IEEE International Reliability Physics Symposium, 2019

Process Complexity and Cost Considerations of Multi-Layer Die Stacks.

Dimitrios Velenis, Joeri De Vos, Soon-Wook Kim, Jaber Derakhshandeh, Pieter Bex, Giovanni Capuz, Samuel Suhard, Kenneth June Rebibis, Stefaan Van Huylenbroeck, Erik Jan Marinissen, Alain Phommahaxay, Andy Miller, Gerald Beyer, Geert Van der Plas, Eric Beyne

Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019

Design Enablement of Fine Pitch Face-to-Face 3D System Integration using Die-by-Die Place & Route.

Giuliano Sisto, Peter Debacker, Rongmei Chen, Geert Van der Plas, Richard Chou, Eric Beyne, Dragomir Milojevic

Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019

2018

A study on substrate noise coupling among TSVs in 3D chip stack.

Yuuki Araga, Makoto Nagata, Joeri De Vos, Geert Van der Plas, Eric Beyne

IEICE Electron. Express, 2018

TSV process-induced MOS reliability degradation.

Yunlong Li, Michele Stucchi, Stefaan Van Huylenbroeck, Geert Van der Plas, Gerald Beyer, Eric Beyne, Kristof Croes

Proceedings of the IEEE International Reliability Physics Symposium, 2018

2016

High-density and low-leakage novel embedded 3D MIM capacitor on Si interposer.

C. Roda Neve, Mikael Detalle, Philip Nolmans, Yunlong Li, Joeri De Vos, Geert Van der Plas, Gerald Beyer, Eric Beyne

Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016

2015

Active-lite interposer for 2.5 & 3D integration.

Geert Hellings, Mirko Scholz, Mikael Detalle, Dimitrios Velenis, Muriel de Potter de ten Broeck, C. Roda Neve, Y. Li, Stefaan Van Huylenbroeck, Shih-Hung Chen, Erik Jan Marinissen, Antonio La Manna, Geert Van der Plas, Dimitri Linten, Eric Beyne, Aaron Thean

Proceedings of the Symposium on VLSI Circuits, 2015

Thermal experimental and modeling analysis of high power 3D packages.

Herman Oprins, Vladimir Cherman, Geert Van der Plas, F. L. T. Maggioni, Joeri De Vos, Eric Beyne

Proceedings of the 2015 International Conference on IC Design & Technology, 2015

Through silicon via to FinFET noise coupling in 3-D integrated circuits.

A. Rouhi Najaf Abadi, W. Guo, X. Sun, K. Ben Ali, Jean-Pierre Raskin, Martin Rack, C. Roda Neve, M. Choi, V. Moroz, Geert Van der Plas, Ingrid De Wolf, Eric Beyne, Philippe P. Absil

Proceedings of the 2015 International Conference on IC Design & Technology, 2015

Processing active devices on Si interposer and impact on cost.

Dimitrios Velenis, Mikael Detalle, Geert Hellings, Mirko Scholz, Erik Jan Marinissen, Geert Van der Plas, Antonio La Manna, Andy Miller, Dimitri Linten, Eric Beyne

Proceedings of the 2015 International 3D Systems Integration Conference, 2015

2014

Chip-Package Interaction in 3D stacked IC packages using Finite Element Modelling.

Bart Vandevelde, Andrej Ivankovic, B. Debecker, Melina Lofrano, Kris Vanstreels, Wei Guo, Vladimir Cherman, Marcel Gonzalez, Geert Van der Plas, Ingrid De Wolf, Eric Beyne, Zsolt Tokei

Microelectron. Reliab., 2014

Comparative study of 3D stacked IC and 3D interposer integration: Processing and assembly challenges.

Joeri De Vos, Vladimir Cherman, Mikael Detalle, Teng Wang, Abdellah Salahouelhadj, Robert Daily, Geert Van der Plas, Eric Beyne

Proceedings of the 2014 International 3D Systems Integration Conference, 2014

Analysis of 3D interconnect performance: Effect of the Si substrate resistivity.

X. Sun, Geert Van der Plas, Mikael Detalle, Eric Beyne

Proceedings of the 2014 International 3D Systems Integration Conference, 2014

2013

Session 15 overview: Data converter techniques.

Michael H. Perrott, Geert Van der Plas

Proceedings of the 2013 IEEE International Solid-State Circuits Conference, 2013

Design issues in heterogeneous 3D/2.5D integration.

Dragomir Milojevic, Pol Marchal, Erik Jan Marinissen, Geert Van der Plas, Diederik Verkest, Eric Beyne

Proceedings of the 18th Asia and South Pacific Design Automation Conference, 2013

2012

A 6-Bit 50-MS/s Threshold Configuring SAR ADC in 90-nm Digital CMOS.

Pierluigi Nuzzo, Claudio Nani, Costantino Armiento, Alberto L. Sangiovanni-Vincentelli, Jan Craninckx, Geert Van der Plas

IEEE Trans. Circuits Syst. I Regul. Pap., 2012

RF-to-Baseband Digitization in 40 nm CMOS With RF Bandpass ΔΣ Modulator and Polyphase Decimation Filter.

Ewout Martens, André Bourdoux, Aïssa Couvreur, Robert Fasthuber, Peter Van Wesemael, Geert Van der Plas, Jan Craninckx, Julien Ryckaert

IEEE J. Solid State Circuits, 2012

3D chip package interaction thermo-mechanical challenges: Proximity effects of Through Silicon vias and μ-bumps.

Wei Guo, Geert Van der Plas, Andrej Ivankovic, Geert Eneman, Vladimir Cherman, Bart De Wachter, Abdelkarim Mercha, Mario Gonzalez, Yann Civale, Augusto Redolfi, Thibault Buisson, A. Jourdan, Bart Vandevelde, Kenneth J. Rebibis, Ingrid De Wolf, Antonio La Manna, Gerald Beyer, Eric Beyne, Bart Swinnen

Proceedings of the IEEE International Conference on IC Design & Technology, 2012

2011

Low-Power ADCs for Bio-Medical Applications.

Jan Craninckx, Geert Van der Plas

Proceedings of the Bio-Medical CMOS ICs, 2011

Fine grain thermal modeling and experimental validation of 3D-ICs.

Herman Oprins, Adi Srinivasan, Miroslav Cupák, Vladimir Cherman, Cristina Torregiani, Michele Stucchi, Geert Van der Plas, Paul Marchal, Bart Vandevelde, E. Cheng

Microelectron. J., 2011

Design Issues and Considerations for Low-Cost 3-D TSV IC Technology.

Geert Van der Plas, Paresh Limaye, Igor Loi, Abdelkarim Mercha, Herman Oprins, Cristina Torregiani, Steven Thijs, Dimitri Linten, Michele Stucchi, Guruprasad Katti, Dimitrios Velenis, Vladimir Cherman, Bart Vandevelde, Veerle Simons, Ingrid De Wolf, Riet Labie, Dan Perry, Stephane Bronckers, Nikolaos Minas, Miro Cupac, Wouter Ruythooren, Jan Van Olmen, Alain Phommahaxay, Muriel de Potter de ten Broeck, Ann Opdebeeck, Michal Rakowski, Bart De Wachter, Morin Dehan, Marc Nelis, Rahul Agarwal, Antonio Pullini, Federico Angiolini, Luca Benini, Wim Dehaene, Youssef Travaly, Eric Beyne, Paul Marchal

IEEE J. Solid State Circuits, 2011

An analytical compact model for estimation of stress in multiple Through-Silicon Via configurations.

Geert Eneman, J. Cho, V. Moroz, Dragomir Milojevic, M. Choi, Kristin De Meyer, Abdelkarim Mercha, Eric Beyne, Thomas Hoffmann, Geert Van der Plas

Proceedings of the Design, Automation and Test in Europe, 2011

3D heterogeneous system integration: application driver for 3D technology development.

Eric Beyne, Pol Marchal, Geert Van der Plas

Proceedings of the 48th Design Automation Conference, 2011

DRAM-on-logic Stack - Calibrated thermal and mechanical models integrated into PathFinding flow.

Dragomir Milojevic, Herman Oprins, Julien Ryckaert, Paul Marchal, Geert Van der Plas

Proceedings of the 2011 IEEE Custom Integrated Circuits Conference, 2011

Analysis of microbump induced stress effects in 3D stacked IC technologies.

Andrej Ivankovic, Geert Van der Plas, V. Moroz, M. Choi, Vladimir Cherman, Abdelkarim Mercha, Paul Marchal, Marcel Gonzalez, Geert Eneman, Wenqi Zhang, Thibault Buisson, Mikael Detalle, Antonio La Manna, Diederik Verkest, Gerald Beyer, Eric Beyne, Bart Vandevelde, Ingrid De Wolf, Dirk Vandepitte

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

In-tier diagnosis of power domains in 3D TSV ICs.

Yuuki Araga, Makoto Nagata, Geert Van der Plas, Jaemin Kim, Nikolaos Minas, Pol Marchal, Youssef Travaly, Michael Libois, Antonio La Manna, Wenqi Zhang, Eric Beyne

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

2010

Substrate Noise Coupling Mechanisms in Lightly Doped CMOS Transistors.

Stephane Bronckers, Geert Van der Plas, Gerd Vandersteen, Yves Rolain

IEEE Trans. Instrum. Meas., 2010

A 2.6 mW 6 bit 2.2 GS/s Fully Dynamic Pipeline ADC in 40 nm Digital CMOS.

Bob Verbruggen, Jan Craninckx, Maarten Kuijk, Piet Wambacq, Geert Van der Plas

IEEE J. Solid State Circuits, 2010

A Single-Bit 500 kHz-10 MHz Multimode Power-Performance Scalable 83-to-67 dB DR CTΔΣ for SDR in 90 nm Digital CMOS.

Pieter Crombez, Geert Van der Plas, Michiel Steyaert, Jan Craninckx

IEEE J. Solid State Circuits, 2010

Multirate Cascaded Discrete-Time Low-Pass ΔΣ Modulator for GSM/Bluetooth/UMTS.

Lynn Bos, Gerd Vandersteen, Pieter Rombouts, Arnd Geis, Alonso Morgado, Yves Rolain, Geert Van der Plas, Julien Ryckaert

IEEE J. Solid State Circuits, 2010

A 2.6mW 6b 2.2GS/s 4-times interleaved fully dynamic pipelined ADC in 40nm digital CMOS.

Bob Verbruggen, Jan Craninckx, Maarten Kuijk, Piet Wambacq, Geert Van der Plas

Proceedings of the IEEE International Solid-State Circuits Conference, 2010

Design issues and considerations for low-cost 3D TSV IC technology.

Geert Van der Plas, Paresh Limaye, Abdelkarim Mercha, Herman Oprins, Cristina Torregiani, Steven Thijs, Dimitri Linten, Michele Stucchi, Guruprasad Katti, Dimitrios Velenis, Domae Shinichi, Vladimir Cherman, Bart Vandevelde, Veerle Simons, Ingrid De Wolf, Riet Labie, Dan Perry, Stephane Bronckers, Nikolaos Minas, Miro Cupac, Wouter Ruythooren, Jan Van Olmen, Alain Phommahaxay, Muriel de Potter de ten Broeck, Ann Opdebeeck, Michal Rakowski, Bart De Wachter, Morin Dehan, Marc Nelis, Rahul Agarwal, Wim Dehaene, Youssef Travaly, Pol Marchal, Eric Beyne

Proceedings of the IEEE International Solid-State Circuits Conference, 2010

3D integration: Circuit design, test, and reliability challenges.

Nikolaos Minas, Ingrid De Wolf, Erik Jan Marinissen, Michele Stucchi, Herman Oprins, Abdelkarim Mercha, Geert Van der Plas, Dimitrios Velenis, Pol Marchal

Proceedings of the 16th IEEE International On-Line Testing Symposium (IOLTS 2010), 2010

A 100kHz-10MHz BW, 78-to-52dB DR, 4.6-to-11mW flexible SC ΣΔ modulator in 1.2-V 90-nm CMOS.

Alonso Morgado, Rocío del Río, José M. de la Rosa, Lynn Bos, Julien Ryckaert, Geert Van der Plas

Proceedings of the 36th European Solid-State Circuits Conference, 2010

Verifying electrical/thermal/thermo-mechanical behavior of a 3D stack - Challenges and solutions.

Geert Van der Plas, Steven Thijs, Dimitri Linten, Guruprasad Katti, Paresh Limaye, Abdelkarim Mercha, Michele Stucchi, Herman Oprins, Bart Vandevelde, Nikolaos Minas, Miro Cupac, Morin Dehan, Marc Nelis, Rahul Agarwal, Wim Dehaene, Youssef Travaly, Eric Beyne, Paul Marchal

Proceedings of the IEEE Custom Integrated Circuits Conference, 2010

2009

Experimental Analysis of the Coupling Mechanisms Between a 4 GHz PPA and a 5-7 GHz LC -VCO.

Stephane Bronckers, Gerd Vandersteen, Ludwig De Locht, Michael Libois, Geert Van der Plas, Yves Rolain

IEEE Trans. Instrum. Meas., 2009

A Methodology to Predict the Impact of Substrate Noise in Analog/RF Systems.

Stephane Bronckers, Karen Scheir, Geert Van der Plas, Gerd Vandersteen, Yves Rolain

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2009

A 2.2 mW 1.75 GS/s 5 Bit Folding Flash ADC in 90 nm Digital CMOS.

Bob Verbruggen, Jan Craninckx, Maarten Kuijk, Piet Wambacq, Geert Van der Plas

IEEE J. Solid State Circuits, 2009

A 2.4 GHz Low-Power Sixth-Order RF Bandpass ΔΣ Converter in CMOS.

Julien Ryckaert, Jonathan Borremans, Bob Verbruggen, Lynn Bos, Costantino Armiento, Jan Craninckx, Geert Van der Plas

IEEE J. Solid State Circuits, 2009

A Low-Power Reduced Kick-Back Comparator with Improved Calibration for High-Speed Flash ADCs.

Guy Torfs, Zhisheng Li, Johan Bauwelinck, Xin Yin, Jan Vandewege, Geert Van der Plas

IEICE Trans. Electron., 2009

Architectural Exploration and Design of Time-Interleaved SAR Arrays for Low-Power and High Speed A/D Converters.

Sergio Saponara, Pierluigi Nuzzo, Claudio Nani, Geert Van der Plas, Luca Fanucci

IEICE Trans. Electron., 2009

A multirate 3.4-to-6.8mW 85-to-66dB DR GSM/bluetooth/UMTS cascade DT ΔΣM in 90nm digital CMOS.

Lynn Bos, Gerd Vandersteen, Julien Ryckaert, Pieter Rombouts, Yves Rolain, Geert Van der Plas

Proceedings of the IEEE International Solid-State Circuits Conference, 2009

A single bit 6.8mW 10MHz power-optimized continuous-time ΔΣ with 67dB DR in 90nm CMOS.

Pieter Crombez, Geert Van der Plas, Michiel Steyaert, Jan Craninckx

Proceedings of the 35th European Solid-State Circuits Conference, 2009

Automated Pathfinding tool chain for 3D-stacked integrated circuits: Practical case study.

Dragomir Milojevic, Trevor E. Carlson, Kris Croes, Riko Radojcic, Diana F. Ragett, Dirk Seynhaeve, Federico Angiolini, Geert Van der Plas, Paul Marchal

Proceedings of the IEEE International Conference on 3D System Integration, 2009

Evaluation of energy-recovering interconnects for low-power 3D stacked ICs.

Panagiotis Asimakopoulos, Geert Van der Plas, Alexandre Yakovlev, Paul Marchal

Proceedings of the IEEE International Conference on 3D System Integration, 2009

2008

Noise Analysis of Regenerative Comparators for Reconfigurable ADC Architectures.

Pierluigi Nuzzo, Fernando De Bernardinis, Pierangelo Terreni, Geert Van der Plas

IEEE Trans. Circuits Syst. I Regul. Pap., 2008

A 150 MS/s 133 µW 7 bit ADC in 90 nm Digital CMOS.

Geert Van der Plas, Bob Verbruggen

IEEE J. Solid State Circuits, 2008

Advanced Planar Bulk and Multigate CMOS Technology: Analog-Circuit Benchmarking up to mm-Wave Frequencies.

Piet Wambacq, Abdelkarim Mercha, Karen Scheir, Bob Verbruggen, Jonathan Borremans, Vincent De Heyn, Steven Thijs, Dimitri Linten, Geert Van der Plas, Bertrand Parvais, Morin Dehan, Stefaan Decoutere, Charlotte Soens, Nadine Collaert, Malgorzata Jurczak

Proceedings of the 2008 IEEE International Solid-State Circuits Conference, 2008

A 2.2mW 5b 1.75GS/s Folding Flash ADC in 90nm Digital CMOS.

Bob Verbruggen, Jan Craninckx, Maarten Kuijk, Piet Wambacq, Geert Van der Plas

Proceedings of the 2008 IEEE International Solid-State Circuits Conference, 2008

A 150MS/s 133μW 7b ADC in 90nm digital CMOS Using a Comparator-Based Asynchronous Binary-Search sub-ADC.

Geert Van der Plas, Bob Verbruggen

Proceedings of the 2008 IEEE International Solid-State Circuits Conference, 2008

An 820μW 9b 40MS/s Noise-Tolerant Dynamic-SAR ADC in 90nm Digital CMOS.

Vito Giannini, Pierluigi Nuzzo, Vincenzo Chironi, Andrea Baschirotto, Geert Van der Plas, Jan Craninckx

Proceedings of the 2008 IEEE International Solid-State Circuits Conference, 2008

Mixed-Signal Design Space Exploration of Time-Interleaved A/D Converters for Ultra-Wide Band Applications.

Pierluigi Nuzzo, Claudio Nani, Sergio Saponara, Luca Fanucci, Geert Van der Plas

Proceedings of the Design, Automation and Test in Europe, 2008

2007

The Potential of FinFETs for Analog and RF Circuit Applications.

Piet Wambacq, Bob Verbruggen, Karen Scheir, Jonathan Borremans, Morin Dehan, Dimitri Linten, Vincent De Heyn, Geert Van der Plas, Abdelkarim Mercha, Bertrand Parvais, Cedric Gustin, Vaidyanathan Subramanian, Nadine Collaert, Malgorzata Jurczak, Stefaan Decoutere

IEEE Trans. Circuits Syst. I Regul. Pap., 2007

A CMOS Ultra-Wideband Receiver for Low Data-Rate Communication.

Julien Ryckaert, Marian Verhelst, Mustafa Badaroglu, Stefano D'Amico, Vincent De Heyn, Claude Desset, Pierluigi Nuzzo, Bart van Poucke, Piet Wambacq, Andrea Baschirotto, Wim Dehaene, Geert Van der Plas

IEEE J. Solid State Circuits, 2007

A 0.65-to-1.4 nJ/Burst 3-to-10 GHz UWB All-Digital TX in 90 nm CMOS for IEEE 802.15.4a.

Julien Ryckaert, Geert Van der Plas, Vincent De Heyn, Claude Desset, Bart van Poucke, Jan Craninckx

IEEE J. Solid State Circuits, 2007

A 0.65-to-1.4nJ/burst 3-to-10GHz UWB Digital TX in 90nm CMOS for IEEE 802.15.4a.

Julien Ryckaert, Geert Van der Plas, Vincent De Heyn, Claude Desset, Geert Vanwijnsberghe, Bart van Poucke, Jan Craninckx

Proceedings of the 2007 IEEE International Solid-State Circuits Conference, 2007

A 65fJ/Conversion-Step 0-to-50MS/s 0-to-0.7mW 9b Charge-Sharing SAR ADC in 90nm Digital CMOS.

Jan Craninckx, Geert Van der Plas

Proceedings of the 2007 IEEE International Solid-State Circuits Conference, 2007

Scalable Gate-Level Models for Power and Timing Analysis.

Mustafa Badaroglu, Geert Van der Plas, Piet Wambacq, Stéphane Donnay, Georges G. E. Gielen, Hugo De Man

Proceedings of the International Symposium on Circuits and Systems (ISCAS 2007), 2007

A fast start-up 3GHz-10GHz digitally controlled oscillator for UWB impulse radio in 90nm CMOS.

Vincent De Heyn, Geert Van der Plas, Julien Ryckaert, Jan Craninckx

Proceedings of the 33rd European Solid-State Circuits Conference, 2007

A switchable low-area 2.4-and-5 GHz dual-band LNA in digital CMOS.

Jonathan Borremans, Piet Wambacq, Geert Van der Plas, Yves Rolain, Maarten Kuijk

Proceedings of the 33rd European Solid-State Circuits Conference, 2007

Interactive presentation: Simulation methodology and experimental verification for the analysis of substrate noise on LC-VCO's.

Stephane Bronckers, Charlotte Soens, Geert Van der Plas, Gerd Vandersteen, Yves Rolain

Proceedings of the 2007 Design, Automation and Test in Europe Conference and Exposition, 2007

2006

SWAN: high-level simulation methodology for digital substrate noise generation.

Mustafa Badaroglu, Geert Van der Plas, Piet Wambacq, Stéphane Donnay, Georges G. E. Gielen, Hugo De Man

IEEE Trans. Very Large Scale Integr. Syst., 2006

Evolution of substrate noise generation mechanisms with CMOS technology scaling.

Mustafa Badaroglu, Piet Wambacq, Geert Van der Plas, Stéphane Donnay, Georges G. E. Gielen, Hugo J. De Man

IEEE Trans. Circuits Syst. I Regul. Pap., 2006

Clock-skew-optimization methodology for substrate-noise reduction with supply-current folding.

Mustafa Badaroglu, Kris Tiri, Geert Van der Plas, Piet Wambacq, Ingrid Verbauwhede, Stéphane Donnay, Georges G. E. Gielen, Hugo De Man

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2006

Modeling of Substrate Noise Generation, Isolation, and Impact for an LC-VCO and a Digital Modem on a Lightly-Doped Substrate.

Charlotte Soens, Geert Van der Plas, Mustafa Badaroglu, Piet Wambacq, Stéphane Donnay, Yves Rolain, Maarten Kuijk

IEEE J. Solid State Circuits, 2006

Analog-Digital Partitioning for Low-Power UWB Impulse Radios under CMOS Scaling.

Mustafa Badaroglu, Claude Desset, Julien Ryckaert, Vincent De Heyn, Geert Van der Plas, Piet Wambacq, Bart van Poucke

EURASIP J. Wirel. Commun. Netw., 2006

A 16mA UWB 3-to-5GHz 20Mpulses/s Quadrature Analog Correlation Receiver in 0.18µm CMOS.

Julien Ryckaert, Mustafa Badaroglu, Vincent De Heyn, Geert Van der Plas, Pierluigi Nuzzo, Andrea Baschirotto, Stefano D'Amico, Claude Desset, Hans Suys, Michael Libois, Bart van Poucke, Piet Wambacq, Bert Gyselinckx

Proceedings of the 2006 IEEE International Solid State Circuits Conference, 2006

A 0.16pJ/Conversion-Step 2.5mW 1.25GS/s 4b ADC in a 90nm Digital CMOS Process.

Geert Van der Plas, Stefaan Decoutere, Stéphane Donnay

Proceedings of the 2006 IEEE International Solid State Circuits Conference, 2006

A 10.6mW/0.8pJ power-scalable 1GS/s 4b ADC in 0.18mum CMOS with 5.8GHz ERBW.

Pierluigi Nuzzo, Geert Van der Plas, Fernando De Bernardinis, Liesbet Van der Perre, Bert Gyselinckx, Pierangelo Terreni

Proceedings of the 43rd Design Automation Conference, 2006

2005

Ultra-wide-band transmitter for low-power wireless body area networks: design and evaluation.

Julien Ryckaert, Claude Desset, Andrew Fort, Mustafa Badaroglu, Vincent De Heyn, Piet Wambacq, Geert Van der Plas, Stéphane Donnay, Bart van Poucke, Bert Gyselinckx

IEEE Trans. Circuits Syst. I Regul. Pap., 2005

Digital ground bounce reduction by supply current shaping and clock frequency Modulation.

Mustafa Badaroglu, Piet Wambacq, Geert Van der Plas, Stéphane Donnay, Georges G. E. Gielen, Hugo De Man

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2005

Performance degradation of LC-tank VCOs by impact of digital switching noise in lightly doped substrates.

Charlotte Soens, Geert Van der Plas, Piet Wambacq, Stéphane Donnay, Maarten Kuijk

IEEE J. Solid State Circuits, 2005

Simulation Methodology for Analysis of Substrate Noise Impact on Analog / RF Circuits Including Interconnect Resistance.

Charlotte Soens, Geert Van der Plas, Piet Wambacq, Stéphane Donnay

Proceedings of the 2005 Design, 2005

Substrate noise immune design of an LC-tank VCO using sensitivity functions.

Charlotte Soens, Geert Van der Plas, Piet Wambacq, Stéphane Donnay

Proceedings of the IEEE 2005 Custom Integrated Circuits Conference, 2005

2004

A gradient-error and edge-effect tolerant switching scheme for a high-accuracy DAC.

Jurgen Deveugele, Geert Van der Plas, Michiel Steyaert, Georges G. E. Gielen, Willy M. C. Sansen

IEEE Trans. Circuits Syst. I Regul. Pap., 2004

Digital circuit capacitance and switching analysis for ground bounce in ICs with a high-ohmic substrate.

Mustafa Badaroglu, Geert Van der Plas, Piet Wambacq, Lakshmanan Balasubramanian, Kris Tiri, Ingrid Verbauwhede, Stéphane Donnay, Georges G. E. Gielen, Hugo J. De Man

IEEE J. Solid State Circuits, 2004

Performance degradation of an LC-tank VCO by impact of digital switching noise.

Charlotte Soens, Geert Van der Plas, Piet Wambacq, Stéphane Donnay

Proceedings of the 33rd European Solid-State Circuits Conference, 2004

A 14-bit 130-MHz CMOS current-steering DAC with adjustable INL.

Tao Chen, Peter Geens, Geert Van der Plas, Wim Dehaene, Georges G. E. Gielen

Proceedings of the 33rd European Solid-State Circuits Conference, 2004

Digital Ground Bounce Reduction by Phase Modulation of the Clock.

Mustafa Badaroglu, Piet Wambacq, Geert Van der Plas, Stéphane Donnay, Georges G. E. Gielen, Hugo De Man

Proceedings of the 2004 Design, 2004

High-level simulation of substrate noise in high-ohmic substrates with interconnect and supply effects.

Geert Van der Plas, Mustafa Badaroglu, Gerd Vandersteen, Petr Dobrovolný, Piet Wambacq, Stéphane Donnay, Georges G. E. Gielen, Hugo De Man

Proceedings of the 41th Design Automation Conference, 2004

Impact of technology scaling on substrate noise generation mechanisms [mixed signal ICs].

Mustafa Badaroglu, Piet Wambacq, Geert Van der Plas, Stéphane Donnay, Georges G. E. Gielen, Hugo De Man

Proceedings of the IEEE 2004 Custom Integrated Circuits Conference, 2004

2003

Digital circuit capacitance and switching analysis for ground bounce in ICs with a high-ohmic substrate.

Mustafa Badaroglu, Lakshmanan Balasubramanian, Kris Tiri, Vincent Gravot, Piet Wambacq, Geert Van der Plas, Stéphane Donnay, Georges G. E. Gielen, Hugo De Man

Proceedings of the ESSCIRC 2003, 2003

2002

CYCLONE: automated design and layout of RF LC-oscillators.

Carl De Ranter, Geert Van der Plas, Michiel Steyaert, Georges G. E. Gielen, Willy M. C. Sansen

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2002

A layout synthesis methodology for array-type analog blocks.

Geert Van der Plas, Jan Vandenbussche, Georges G. E. Gielen, Willy M. C. Sansen

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2002

2001

AMGIE-A synthesis environment for CMOS analog integrated circuits.

Geert Van der Plas, Geert Debyser, Francky Leyn, Koen Lampaert, Jan Vandenbussche, Georges G. E. Gielen, Willy M. C. Sansen, Petar Veselinovic, Domine Leenaerts

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2001

A Layout-Aware Synthesis Methodology for RF Circuits.

Peter J. Vancorenland, Geert Van der Plas, Michiel Steyaert, Georges G. E. Gielen, Willy M. C. Sansen

Proceedings of the 2001 IEEE/ACM International Conference on Computer-Aided Design, 2001

2000

CYCLONE: automated design and layout of RF LC-oscillators.

Carl De Ranter, Bram De Muer, Geert Van der Plas, Peter J. Vancorenland, Michiel Steyaert, Georges G. E. Gielen, Willy M. C. Sansen

Proceedings of the 37th Conference on Design Automation, 2000

Systematic design of a 14-bit 150-MS/s CMOS current-steering D/A converter.

Geert Van der Plas, Jan Vandenbussche, Walter Daems, Antal van den Bosch, Georges G. E. Gielen, Willy M. C. Sansen

Proceedings of the 37th Conference on Design Automation, 2000

1999

A 14-bit intrinsic accuracy Q² random walk CMOS DAC.

Geert Van der Plas, Jan Vandenbussche, Willy Sansen, Michel S. J. Steyaert, Georges G. E. Gielen

IEEE J. Solid State Circuits, 1999

Statistical behavioral modeling for A/D-converters.

Geert Van der Plas, Jan Vandenbussche, Wim Verhaegen, Georges G. E. Gielen, Willy Sansen

Proceedings of the 6th IEEE International Conference on Electronics, Circuits and Systems, 1999

1998

Behavioral model for D/A converters as VSI virtual components.

Jan Vandenbussche, Geert Van der Plas, Georges G. E. Gielen, Michiel Steyaert, Willy Sansen

Proceedings of the IEEE 1998 Custom Integrated Circuits Conference, 1998

Mondriaan: a tool for automated layout synthesis of array-type analog blocks.

Geert Van der Plas, Jan Vandenbussche, Georges G. E. Gielen, Willy Sansen

Proceedings of the IEEE 1998 Custom Integrated Circuits Conference, 1998

A 12 bit 200 MHz low glitch CMOS D/A converter.

Anne Van den Bosch, Marc Borremans, Jan Vandenbussche, Geert Van der Plas, Augusto Manuel Marques, José Bastos, Michiel Steyaert, Georges G. E. Gielen, Willy Sansen

Proceedings of the IEEE 1998 Custom Integrated Circuits Conference, 1998

1997

Automated test pattern generation for analog integrated circuits.

Wim Verhaegen, Geert Van der Plas, Georges G. E. Gielen

Proceedings of the 15th IEEE VLSI Test Symposium (VTS'97), 1997

1996

ADMIRE: advanced mixed signal design environment.

Philippe Reynaert, Ludwig Callewaert, Georges G. E. Gielen, Geert Debyser, Koen Lampaert, Francky Leyn, Geert Van der Plas, Willy Sansen, Birger Schneider, René Bloch, Dave Orton, Steve Boardman, Jeremy Stent, Jean-François Agaësse, Jörg-Olliver Fischer-Binder, Jukka Riihiaho, Kari Tukkiniemi

Proceedings of Third International Conference on Electronics, Circuits, and Systems, 1996

1995

An analogue module generator for mixed analogue/digital asic design.

Georges G. E. Gielen, Geert Debyser, Koen Lampaert, Francky Leyn, Koen Swings, Geert Van der Plas, Willy Sansen, Domine Leenaerts, Petar Veselinovic, W. van Bokhoven

Int. J. Circuit Theory Appl., 1995

1994

A CMOS 18 THzΩ 248 Mb/s transimpedance amplifier and 155 Mb/s LED-driver for low cost optical fiber links.

Mark Ingels, Geert Van der Plas, Jan Crols, Michiel Steyaert

IEEE J. Solid State Circuits, December, 1994