Philippe Godignon

Orcid: 0000-0002-9273-9819

According to our database1, Philippe Godignon authored at least 23 papers between 2001 and 2023.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

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Bibliography

2023
Full-SiC Single-Chip Buck and Boost MOSFET-JBS Converters for Ultimate Efficient Power Vertical Integration.
Proceedings of the 30th International Conference on Mixed Design of Integrated Circuits and System, 2023

2021
60-700 K CTAT and PTAT Temperature Sensors with 4H-SiC Schottky Diodes.
Sensors, 2021

2017
High-Voltage 4H-SiC Power MOSFETs With Boron-Doped Gate Oxide.
IEEE Trans. Ind. Electron., 2017

2016
Power cycling analysis method for high-voltage SiC diodes.
Microelectron. Reliab., 2016

2015
SiC Integrated Circuit Control Electronics for High-Temperature Operation.
IEEE Trans. Ind. Electron., 2015

Failure analysis of ESD-stressed SiC MESFET.
Microelectron. Reliab., 2015

Experimental analysis of planar edge terminations for high voltage 4H-SiC devices.
Proceedings of the 45th European Solid State Device Research Conference, 2015

2014
Analysis of an ESD failure mechanism on a SiC MESFET.
Microelectron. Reliab., 2014

Temperature effects on the ruggedness of SiC Schottky diodes under surge current.
Microelectron. Reliab., 2014

Study of surface weak spots on SiC Schottky Diodes under specific operating regimes by Infrared Lock-in sensing.
Proceedings of the 44th European Solid State Device Research Conference, 2014

A positive impact of low proton irradiation energy on oxynitride gate 4H-SiC MOSFETs.
Proceedings of the 44th European Solid State Device Research Conference, 2014

2013
4H-SiC MESFET specially designed and fabricated for high temperature integrated circuits.
Proceedings of the European Solid-State Device Research Conference, 2013

High temperature-low temperature coefficient analog voltage reference integrated circuit implemented with SiC MESFETs.
Proceedings of the ESSCIRC 2013, 2013

2012
Wafer scale and reliability investigation of thin HfO<sub>2</sub>·AlGaN/GaN MIS-HEMTs.
Microelectron. Reliab., 2012

Enhanced power cycling capability of SiC Schottky diodes using press pack contacts.
Microelectron. Reliab., 2012

High voltage low Ron in-situ SiN/Al0.35GaN0.65/GaN-on-Si power HEMTs operation up to 300°C.
Proceedings of the 2012 European Solid-State Device Research Conference, 2012

2011
SiC Schottky Diodes for Harsh Environment Space Applications.
IEEE Trans. Ind. Electron., 2011

2008
Behaviour of 1.2 kV SiC JBS diodes under repetitive high power stress.
Microelectron. Reliab., 2008

2007
Coupled electro-thermal simulation of a DC/DC converter.
Microelectron. Reliab., 2007

Manufacturing and full characterization of silicon carbide-based multi-sensor micro-probes for biomedical applications.
Microelectron. J., 2007

2004
Self-heating experimental study of 600V PT-IGBTs under low dissipation energies.
Microelectron. J., 2004

IGBT gate driver IC with full-bridge output stage using a modified standard CMOS process.
Microelectron. J., 2004

2001
The electron irradiation effects on silicon gate dioxide used for power MOS devices.
Microelectron. Reliab., 2001


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