X. Perpiñà

According to our database1, X. Perpiñà authored at least 25 papers between 2004 and 2019.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of five.



In proceedings 
PhD thesis 



On csauthors.net:


Solid-State Relay Solutions for Induction Cooking Applications Based on Advanced Power Semiconductor Devices.
IEEE Trans. Industrial Electronics, 2019

Short-Circuit Study in Medium-Voltage GaN Cascodes, p-GaN HEMTs, and GaN MISHEMTs.
IEEE Trans. Industrial Electronics, 2017

Functional and Consumption Analysis of Integrated Circuits Supplied by Inductive Power Transfer by Powering Modulation and Lock-In Infrared Imaging.
IEEE Trans. Industrial Electronics, 2015

Characterization of phase change material systems using a thermal test device.
Microelectronics Journal, 2015

Comparison of temperature limits for Trench silicon IGBT technologies for medium power applications.
Microelectronics Reliability, 2014

Temperature effects on the ruggedness of SiC Schottky diodes under surge current.
Microelectronics Reliability, 2014

Electro-thermal characterization of a differential temperature sensor in a 65 nm CMOS IC: Applications to gain monitoring in RF amplifiers.
Microelectronics Journal, 2014

Study of surface weak spots on SiC Schottky Diodes under specific operating regimes by Infrared Lock-in sensing.
Proceedings of the 44th European Solid State Device Research Conference, 2014

Thermal resistance investigations on new leadframe-based LED packages and boards.
Microelectronics Reliability, 2013

Design methodologies for reliability of SSL LED boards.
Microelectronics Reliability, 2013

Design for reliability of solid state lighting systems.
Microelectronics Reliability, 2012

Thermal cycling analysis of high temperature die-attach materials.
Microelectronics Reliability, 2012

Study of layout influence on ruggedness of NPT-IGBT devices by physical modelling.
Microelectronics Reliability, 2012

Enhanced power cycling capability of SiC Schottky diodes using press pack contacts.
Microelectronics Reliability, 2012

DC temperature measurements for power gain monitoring in RF power amplifiers.
Proceedings of the 2012 IEEE International Test Conference, 2012

Analysis of Clamped Inductive Turnoff Failure in Railway Traction IGBT Power Modules Under Overload Conditions.
IEEE Trans. Industrial Electronics, 2011

Long-Term Reliability of Railway Power Inverters Cooled by Heat-Pipe-Based Systems.
IEEE Trans. Industrial Electronics, 2011

SiC Schottky Diodes for Harsh Environment Space Applications.
IEEE Trans. Industrial Electronics, 2011

IGBT module failure analysis in railway applications.
Microelectronics Reliability, 2008

Local thermal cycles determination in thermosyphon-cooled traction IGBT modules reproducing mission profiles.
Microelectronics Reliability, 2007

Failure-relevant abnormal events in power inverters considering measured IGBT module temperature inhomogeneities.
Microelectronics Reliability, 2007

Revisiting power cycling test for better life-time prediction in traction.
Microelectronics Reliability, 2007

Thermal fatigue effects on the temperature distribution inside IGBT modules for zone engine aeronautical applications.
Microelectronics Reliability, 2007

Temperature measurement on series resistance and devices in power packs based on on-state voltage drop monitoring at high current.
Microelectronics Reliability, 2006

Self-heating experimental study of 600V PT-IGBTs under low dissipation energies.
Microelectronics Journal, 2004