X. Perpiñà

According to our database, X. Perpiñà authored at least 31 papers between 2004 and 2024.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2024

Physics-Based Strategies for Fast TDDB Testing and Lifetime Estimation in SiC Power MOSFETs.

Oriol Avino-Salvado, Cyril Buttay, Ferran Bonet, Christophe Raynaud, Pascal Bevilacqua, José Rebollo, Hervé Morel, Xavier Perpiñà

IEEE Trans. Ind. Electron., May, 2024

2023

Die-Level Transient Thermal Imaging Based on Fourier Series Reconstruction for Power Industrial Electronics.

Conrad Ferrer, Oriol Avino-Salvado, Miquel Vellvehí, Xavier Jordà, Xavier Perpiñà

IEEE Trans. Instrum. Meas., 2023

2021

Local Thermal Resistance Extraction in Monolithic Microwave Integrated Circuits.

Miquel Vellvehí, Xavier Perpiñà, Javier Leon, Oriol Avino-Salvado, Conrad Ferrer, Xavier Jordà

IEEE Trans. Ind. Electron., 2021

BPF-Based Thermal Sensor Circuit for On-Chip Testing of RF Circuits.

Josep Altet, Enrique Barajas, Diego Mateo, Alexandre Billong, Xavier Aragonès, Xavier Perpiñà, Ferran Reverter

Sensors, 2021

2019

Output Power and Gain Monitoring in RF CMOS Class A Power Amplifiers by Thermal Imaging.

Xavier Perpiñà, Ferran Reverter, Javier Leon, Enrique Barajas, Miquel Vellvehí, Xavier Jordà, Josep Altet

IEEE Trans. Instrum. Meas., 2019

Solid-State Relay Solutions for Induction Cooking Applications Based on Advanced Power Semiconductor Devices.

Manuel Fernandez, Xavier Perpiñà, José Rebollo, Miquel Vellvehí, David Sanchez, Tomás Cabeza, Sergio Llorente, Xavier Jordà

IEEE Trans. Ind. Electron., 2019

2017

Short-Circuit Study in Medium-Voltage GaN Cascodes, p-GaN HEMTs, and GaN MISHEMTs.

Manuel Fernandez, Xavier Perpiñà, Jaume Roig-Guitart, Miquel Vellvehí, Filip Bauwens, Marnix Tack, Xavier Jordà

IEEE Trans. Ind. Electron., 2017

2015

Functional and Consumption Analysis of Integrated Circuits Supplied by Inductive Power Transfer by Powering Modulation and Lock-In Infrared Imaging.

Javier Leon, Xavier Perpiñà, Jordi Sacristán, Miquel Vellvehí, Antoni Baldi, Xavier Jordà

IEEE Trans. Ind. Electron., 2015

Characterization of phase change material systems using a thermal test device.

Xavier Jordà, Jesús Esarte, Xavier Perpiñà, Miquel Vellvehí, Gorka Argandoña, Maite Aresti

Microelectron. J., 2015

2014

Comparison of temperature limits for Trench silicon IGBT technologies for medium power applications.

Xavier Perpiñà, Xavier Jordà, Javier Leon, Miquel Vellvehí, Daniel Antón, Sergio Llorente

Microelectron. Reliab., 2014

Temperature effects on the ruggedness of SiC Schottky diodes under surge current.

Javier Leon, Xavier Perpiñà, Viorel Banu, Josep Montserrat, Maxime Berthou, Miquel Vellvehí, Philippe Godignon, Xavier Jordà

Microelectron. Reliab., 2014

Electro-thermal characterization of a differential temperature sensor in a 65 nm CMOS IC: Applications to gain monitoring in RF amplifiers.

Josep Altet, José Luis González, Didac Gómez, Xavier Perpiñà, Wilfrid Claeys, Stéphane Grauby, Cédric Dufis, Miquel Vellvehí, Diego Mateo, Ferran Reverter, Stefan Dilhaire, Xavier Jordà

Microelectron. J., 2014

Review of temperature sensors as monitors for RF-MMW built-in testing and self-calibration schemes.

Josep Altet, Eduardo Aldrete-Vidrio, Ferran Reverter, Didac Gómez, José Luis González, Marvin Onabajo, José Silva-Martínez, B. Martineau, X. Perpiñà, Louay Abdallah, Haralampos-G. D. Stratigopoulos, Xavier Aragonès, Xavier Jordà, Miquel Vellvehí, Stefan Dilhaire, Salvador Mir, Diego Mateo

Proceedings of the IEEE 57th International Midwest Symposium on Circuits and Systems, 2014

Study of surface weak spots on SiC Schottky Diodes under specific operating regimes by Infrared Lock-in sensing.

Javier Leon, Xavier Perpiñà, Miquel Vellvehí, Xavier Jordà, Philippe Godignon

Proceedings of the 44th European Solid State Device Research Conference, 2014

2013

Thermal resistance investigations on new leadframe-based LED packages and boards.

B. Pardo, A. Gasse, A. Fargeix, Jiri Jakovenko, Robert J. Werkhoven, Xavier Perpiñà, Xavier Jordà, Miquel Vellvehí, T. Van Weelden, P. Bancken

Microelectron. Reliab., 2013

Design methodologies for reliability of SSL LED boards.

Jiri Jakovenko, J. Formánek, X. Perpiñà, Xavier Jordà, Miquel Vellvehí, Robert J. Werkhoven, Miroslav Husák, J. M. G. Kunen, P. Bancken, P. J. Bolt, A. Gasse

Microelectron. Reliab., 2013

2012

Design for reliability of solid state lighting systems.

Xavier Perpiñà, Robert J. Werkhoven, Jiri Jakovenko, J. Formánek, Miquel Vellvehí, Xavier Jordà, Jos M. G. Kunen, Peter Bancken, Pieter Jan Bolt

Microelectron. Reliab., 2012

Thermal cycling analysis of high temperature die-attach materials.

Luis A. Navarro, Xavier Perpiñà, Miquel Vellvehí, Viorel Banu, Xavier Jordà

Microelectron. Reliab., 2012

Study of layout influence on ruggedness of NPT-IGBT devices by physical modelling.

Ignasi Cortés, Xavier Perpiñà, Jesús Urresti, Xavier Jordà, José Rebollo

Microelectron. Reliab., 2012

Enhanced power cycling capability of SiC Schottky diodes using press pack contacts.

Viorel Banu, Philippe Godignon, Xavier Perpiñà, Xavier Jordà, José Millán

Microelectron. Reliab., 2012

DC temperature measurements for power gain monitoring in RF power amplifiers.

Josep Altet, Diego Mateo, Didac Gómez, Xavier Perpiñà, Miquel Vellvehí, Xavier Jordà

Proceedings of the 2012 IEEE International Test Conference, 2012

2011

Analysis of Clamped Inductive Turnoff Failure in Railway Traction IGBT Power Modules Under Overload Conditions.

Xavier Perpiñà, Jean-François Serviere, Jesús Urresti-Ibañez, Ignasi Cortés, Xavier Jordà, Salvador Hidalgo, José Rebollo, Michel Mermet-Guyennet

IEEE Trans. Ind. Electron., 2011

Long-Term Reliability of Railway Power Inverters Cooled by Heat-Pipe-Based Systems.

Xavier Perpiñà, Xavier Jordà, Miquel Vellvehí, José Rebollo, Michel Mermet-Guyennet

IEEE Trans. Ind. Electron., 2011

SiC Schottky Diodes for Harsh Environment Space Applications.

Philippe Godignon, Xavier Jordà, Miquel Vellvehí, Xavier Perpiñà, Viorel Banu, Demetrio López, Juan Barbero, Pierre Brosselard, Silvia Massetti

IEEE Trans. Ind. Electron., 2011

2008

IGBT module failure analysis in railway applications.

X. Perpiñà, Jean-François Serviere, Xavier Jordà, A. Fauquet, Salvador Hidalgo, Jesús Urresti-Ibañez, José Rebollo, Michel Mermet-Guyennet

Microelectron. Reliab., 2008

2007

Local thermal cycles determination in thermosyphon-cooled traction IGBT modules reproducing mission profiles.

X. Perpiñà, M. Piton, Michel Mermet-Guyennet, Xavier Jordà, José Millán

Microelectron. Reliab., 2007

Failure-relevant abnormal events in power inverters considering measured IGBT module temperature inhomogeneities.

X. Perpiñà, Alberto Castellazzi, M. Piton, Michel Mermet-Guyennet, José Millán

Microelectron. Reliab., 2007

Revisiting power cycling test for better life-time prediction in traction.

Michel Mermet-Guyennet, X. Perpiñà, M. Piton

Microelectron. Reliab., 2007

Thermal fatigue effects on the temperature distribution inside IGBT modules for zone engine aeronautical applications.

T. Lhommeau, Xavier Perpiñà, C. Martin, Régis Meuret, Michel Mermet-Guyennet, Moussa Karama

Microelectron. Reliab., 2007

2006

Temperature measurement on series resistance and devices in power packs based on on-state voltage drop monitoring at high current.

X. Perpiñà, Jean-François Serviere, J. Saiz, Davide Barlini, Michel Mermet-Guyennet, José Millán

Microelectron. Reliab., 2006

2004

Self-heating experimental study of 600V PT-IGBTs under low dissipation energies.

Xavier Perpiñà, Xavier Jordà, N. Mestres, Miquel Vellvehí, Philippe Godignon, José Millán

Microelectron. J., 2004