Xavier Jordà

According to our database1, Xavier Jordà authored at least 28 papers between 1992 and 2019.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of five.



In proceedings 
PhD thesis 


On csauthors.net:


Solid-State Relay Solutions for Induction Cooking Applications Based on Advanced Power Semiconductor Devices.
IEEE Trans. Industrial Electronics, 2019

Short-Circuit Study in Medium-Voltage GaN Cascodes, p-GaN HEMTs, and GaN MISHEMTs.
IEEE Trans. Industrial Electronics, 2017

Functional and Consumption Analysis of Integrated Circuits Supplied by Inductive Power Transfer by Powering Modulation and Lock-In Infrared Imaging.
IEEE Trans. Industrial Electronics, 2015

SiC Integrated Circuit Control Electronics for High-Temperature Operation.
IEEE Trans. Industrial Electronics, 2015

Characterization of phase change material systems using a thermal test device.
Microelectronics Journal, 2015

Comparison of temperature limits for Trench silicon IGBT technologies for medium power applications.
Microelectronics Reliability, 2014

Temperature effects on the ruggedness of SiC Schottky diodes under surge current.
Microelectronics Reliability, 2014

Electro-thermal characterization of a differential temperature sensor in a 65 nm CMOS IC: Applications to gain monitoring in RF amplifiers.
Microelectronics Journal, 2014

Study of surface weak spots on SiC Schottky Diodes under specific operating regimes by Infrared Lock-in sensing.
Proceedings of the 44th European Solid State Device Research Conference, 2014

Thermal resistance investigations on new leadframe-based LED packages and boards.
Microelectronics Reliability, 2013

Design methodologies for reliability of SSL LED boards.
Microelectronics Reliability, 2013

Design for reliability of solid state lighting systems.
Microelectronics Reliability, 2012

Thermal cycling analysis of high temperature die-attach materials.
Microelectronics Reliability, 2012

Study of layout influence on ruggedness of NPT-IGBT devices by physical modelling.
Microelectronics Reliability, 2012

Enhanced power cycling capability of SiC Schottky diodes using press pack contacts.
Microelectronics Reliability, 2012

DC temperature measurements for power gain monitoring in RF power amplifiers.
Proceedings of the 2012 IEEE International Test Conference, 2012

Analysis of Clamped Inductive Turnoff Failure in Railway Traction IGBT Power Modules Under Overload Conditions.
IEEE Trans. Industrial Electronics, 2011

Long-Term Reliability of Railway Power Inverters Cooled by Heat-Pipe-Based Systems.
IEEE Trans. Industrial Electronics, 2011

SiC Schottky Diodes for Harsh Environment Space Applications.
IEEE Trans. Industrial Electronics, 2011

IGBT module failure analysis in railway applications.
Microelectronics Reliability, 2008

Behaviour of 1.2 kV SiC JBS diodes under repetitive high power stress.
Microelectronics Reliability, 2008

Coupled electro-thermal simulation of a DC/DC converter.
Microelectronics Reliability, 2007

Local thermal cycles determination in thermosyphon-cooled traction IGBT modules reproducing mission profiles.
Microelectronics Reliability, 2007

Design considerations for 6.5 kV IGBT devices.
Microelectronics Journal, 2004

Self-heating experimental study of 600V PT-IGBTs under low dissipation energies.
Microelectronics Journal, 2004

IGBT gate driver IC with full-bridge output stage using a modified standard CMOS process.
Microelectronics Journal, 2004

Smart Temperature Sensor for On-Line Monitoring in Automotive Applications.
Proceedings of the 7th IEEE International On-Line Testing Workshop (IOLTW 2001), 2001

Telematic Services in Catalan Schools: Working Environment and Achievements.
Proceedings of the Education and Society, 1992