Miquel Vellvehí

Orcid: 0000-0002-0127-4690

According to our database1, Miquel Vellvehí authored at least 28 papers between 2001 and 2023.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

Legend:

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Online presence:

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Bibliography

2023
Die-Level Transient Thermal Imaging Based on Fourier Series Reconstruction for Power Industrial Electronics.
IEEE Trans. Instrum. Meas., 2023

2021
Local Thermal Resistance Extraction in Monolithic Microwave Integrated Circuits.
IEEE Trans. Ind. Electron., 2021

2019
Output Power and Gain Monitoring in RF CMOS Class A Power Amplifiers by Thermal Imaging.
IEEE Trans. Instrum. Meas., 2019

Solid-State Relay Solutions for Induction Cooking Applications Based on Advanced Power Semiconductor Devices.
IEEE Trans. Ind. Electron., 2019

2017
Short-Circuit Study in Medium-Voltage GaN Cascodes, p-GaN HEMTs, and GaN MISHEMTs.
IEEE Trans. Ind. Electron., 2017

2015
Functional and Consumption Analysis of Integrated Circuits Supplied by Inductive Power Transfer by Powering Modulation and Lock-In Infrared Imaging.
IEEE Trans. Ind. Electron., 2015

SiC Integrated Circuit Control Electronics for High-Temperature Operation.
IEEE Trans. Ind. Electron., 2015

Characterization of phase change material systems using a thermal test device.
Microelectron. J., 2015

2014
Comparison of temperature limits for Trench silicon IGBT technologies for medium power applications.
Microelectron. Reliab., 2014

Temperature effects on the ruggedness of SiC Schottky diodes under surge current.
Microelectron. Reliab., 2014

Electro-thermal characterization of a differential temperature sensor in a 65 nm CMOS IC: Applications to gain monitoring in RF amplifiers.
Microelectron. J., 2014

Review of temperature sensors as monitors for RF-MMW built-in testing and self-calibration schemes.
Proceedings of the IEEE 57th International Midwest Symposium on Circuits and Systems, 2014

Study of surface weak spots on SiC Schottky Diodes under specific operating regimes by Infrared Lock-in sensing.
Proceedings of the 44th European Solid State Device Research Conference, 2014

2013
Thermal resistance investigations on new leadframe-based LED packages and boards.
Microelectron. Reliab., 2013

Design methodologies for reliability of SSL LED boards.
Microelectron. Reliab., 2013

4H-SiC MESFET specially designed and fabricated for high temperature integrated circuits.
Proceedings of the European Solid-State Device Research Conference, 2013

High temperature-low temperature coefficient analog voltage reference integrated circuit implemented with SiC MESFETs.
Proceedings of the ESSCIRC 2013, 2013

2012
Design for reliability of solid state lighting systems.
Microelectron. Reliab., 2012

Thermal cycling analysis of high temperature die-attach materials.
Microelectron. Reliab., 2012

DC temperature measurements for power gain monitoring in RF power amplifiers.
Proceedings of the 2012 IEEE International Test Conference, 2012

2011
Long-Term Reliability of Railway Power Inverters Cooled by Heat-Pipe-Based Systems.
IEEE Trans. Ind. Electron., 2011

SiC Schottky Diodes for Harsh Environment Space Applications.
IEEE Trans. Ind. Electron., 2011

2007
Coupled electro-thermal simulation of a DC/DC converter.
Microelectron. Reliab., 2007

2004
Design considerations for 6.5 kV IGBT devices.
Microelectron. J., 2004

Self-heating experimental study of 600V PT-IGBTs under low dissipation energies.
Microelectron. J., 2004

IGBT gate driver IC with full-bridge output stage using a modified standard CMOS process.
Microelectron. J., 2004

2002
Reduction of self-heating effect on SOIM devices.
Microelectron. Reliab., 2002

2001
Smart Temperature Sensor for On-Line Monitoring in Automotive Applications.
Proceedings of the 7th IEEE International On-Line Testing Workshop (IOLTW 2001), 2001


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