Siting Liu
Orcid: 0000-0002-2454-5561Affiliations:
- Chinese University of Hong Kong, Hong Kong, SAR, China
According to our database1,
Siting Liu
authored at least 19 papers
between 2021 and 2025.
Collaborative distances:
Collaborative distances:
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on orcid.org
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Bibliography
2025
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., July, 2025
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., May, 2025
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., February, 2025
Proceedings of the 30th Asia and South Pacific Design Automation Conference, 2025
2024
Routing-aware Legal Hybrid Bonding Terminal Assignment for 3D Face-to-Face Stacked ICs.
Proceedings of the 2024 International Symposium on Physical Design, 2024
2023
DREAMPlace 4.0: Timing-Driven Placement With Momentum-Based Net Weighting and Lagrangian-Based Refinement.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., October, 2023
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., July, 2023
FastGR: Global Routing on CPU-GPU with Heterogeneous Task Graph Scheduler (Extended Abstract).
Proceedings of the Thirty-Second International Joint Conference on Artificial Intelligence, 2023
Proceedings of the 60th ACM/IEEE Design Automation Conference, 2023
Proceedings of the 60th ACM/IEEE Design Automation Conference, 2023
Proceedings of the 60th ACM/IEEE Design Automation Conference, 2023
2022
ACM Trans. Design Autom. Electr. Syst., 2022
Proceedings of the 2022 Design, Automation & Test in Europe Conference & Exhibition, 2022
Proceedings of the 2022 Design, Automation & Test in Europe Conference & Exhibition, 2022
2021
Proceedings of the Design, Automation & Test in Europe Conference & Exhibition, 2021
Proceedings of the Design, Automation & Test in Europe Conference & Exhibition, 2021
Proceedings of the ASPDAC '21: 26th Asia and South Pacific Design Automation Conference, 2021
Proceedings of the ASPDAC '21: 26th Asia and South Pacific Design Automation Conference, 2021