Bon Woong Ku

According to our database, Bon Woong Ku authored at least 20 papers between 2015 and 2022.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2022

Unsupervised Digit Recognition Using Cosine Similarity In A Neuromemristive Competitive Learning System.

Bon Woong Ku, Catherine D. Schuman, Md Musabbir Adnan, Tiffany M. Mintz, Raphael C. Pooser, Kathleen E. Hamilton, Garrett S. Rose, Sung Kyu Lim

ACM J. Emerg. Technol. Comput. Syst., 2022

Built-in Self-Test and Fault Localization for Inter-Layer Vias in Monolithic 3D ICs.

Arjun Chaudhuri, Sanmitra Banerjee, Jinwoo Kim, Heechun Park, Bon Woong Ku, Sukeshwar Kannan, Krishnendu Chakrabarty, Sung Kyu Lim

ACM J. Emerg. Technol. Comput. Syst., 2022

2021

Pseudo-3D Physical Design Flow for Monolithic 3D ICs: Comparisons and Enhancements.

Heechun Park, Bon Woong Ku, Kyungwook Chang, Da Eun Shim, Sung Kyu Lim

ACM Trans. Design Autom. Electr. Syst., 2021

ML-Based Wire RC Prediction in Monolithic 3D ICs with an Application to Full-Chip Optimization.

Sai Surya Kiran Pentapati, Bon Woong Ku, Sung Kyu Lim

Proceedings of the ISPD '21: International Symposium on Physical Design, 2021

2020

Compact-2D: A Physical Design Methodology to Build Two-Tier Gate-Level 3-D ICs.

Bon Woong Ku, Kyungwook Chang, Sung Kyu Lim

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2020

Pseudo-3D Approaches for Commercial-Grade RTL-to-GDS Tool Flow Targeting Monolithic 3D ICs.

Heechun Park, Bon Woong Ku, Kyungwook Chang, Da Eun Shim, Sung Kyu Lim

Proceedings of the ISPD 2020: International Symposium on Physical Design, Taipei, Taiwan, March 29, 2020

Pin-in-the-middle: an efficient block pin assignment methodology for block-level monolithic 3D ICs.

Bon Woong Ku, Sung Kyu Lim

Proceedings of the ISLPED '20: ACM/IEEE International Symposium on Low Power Electronics and Design, 2020

2019

Built-in Self-Test for Inter-Layer Vias in Monolithic 3D ICs.

Arjun Chaudhuri, Sanmitra Banerjee, Heechun Park, Bon Woong Ku, Krishnendu Chakrabarty, Sung Kyu Lim

Proceedings of the 24th IEEE European Test Symposium, 2019

RTL-to-GDS Tool Flow and Design-for-Test Solutions for Monolithic 3D ICs.

Heechun Park, Kyungwook Chang, Bon Woong Ku, Jinwoo Kim, Edward Lee, Daehyun Kim, Arjun Chaudhuri, Sanmitra Banerjee, Saibal Mukhopadhyay, Krishnendu Chakrabarty, Sung Kyu Lim

Proceedings of the 56th Annual Design Automation Conference 2019, 2019

2018

A Twin Memristor Synapse for Spike Timing Dependent Learning in Neuromorphic Systems.

Md Musabbir Adnan, Sagarvarma Sayyaparaju, Garrett S. Rose, Catherine D. Schuman, Bon Woong Ku, Sung Kyu Lim

Proceedings of the 31st IEEE International System-on-Chip Conference, 2018

Compact-2D: A Physical Design Methodology to Build Commercial-Quality Face-to-Face-Bonded 3D ICs.

Bon Woong Ku, Kyungwook Chang, Sung Kyu Lim

Proceedings of the 2018 International Symposium on Physical Design, 2018

Area-efficient and low-power face-to-face-bonded 3D liquid state machine design.

Bon Woong Ku, Yu Liu, Yingyezhe Jin, Peng Li, Sung Kyu Lim

Proceedings of the International Conference on Computer-Aided Design, 2018

Design and architectural co-optimization of monolithic 3D liquid state machine-based neuromorphic processor.

Bon Woong Ku, Yu Liu, Yingyezhe Jin, Sandeep Kumar Samal, Peng Li, Sung Kyu Lim

Proceedings of the 55th Annual Design Automation Conference, 2018

2017

Evaluating online-learning in memristive neuromorphic circuits.

Austin Wyer, Md Musabbir Adnan, Bon Woong Ku, Sung Kyu Lim, Catherine D. Schuman, Raphael C. Pooser, Garrett S. Rose

Proceedings of the Neuromorphic Computing Symposium, 2017

Transistor-level monolithic 3D standard cell layout optimization for full-chip static power integrity.

Bon Woong Ku, Taigon Song, Arthur Nieuwoudt, Sung Kyu Lim

Proceedings of the 2017 IEEE/ACM International Symposium on Low Power Electronics and Design, 2017

Full-chip monolithic 3D IC design and power performance analysis with ASAP7 library: (Invited Paper).

Kyungwook Chang, Bon Woong Ku, Saurabh Sinha, Sung Kyu Lim

Proceedings of the 2017 IEEE/ACM International Conference on Computer-Aided Design, 2017

2016

Monolithic 3D IC design: Power, performance, and area impact at 7nm.

Kartik Acharya, Kyungwook Chang, Bon Woong Ku, Shreepad Panth, Saurabh Sinha, Brian Cline, Greg Yeric, Sung Kyu Lim

Proceedings of the 17th International Symposium on Quality Electronic Design, 2016

Physical Design Solutions to Tackle FEOL/BEOL Degradation in Gate-level Monolithic 3D ICs.

Bon Woong Ku, Peter Debacker, Dragomir Milojevic, Praveen Raghavan, Diederik Verkest, Aaron Thean, Sung Kyu Lim

Proceedings of the 2016 International Symposium on Low Power Electronics and Design, 2016

How much cost reduction justifies the adoption of monolithic 3D ICs at 7nm node?

Bon Woong Ku, Peter Debacker, Dragomir Milojevic, Praveen Raghavan, Sung Kyu Lim

Proceedings of the 35th International Conference on Computer-Aided Design, 2016

2015

Design, packaging, and architectural policy co-optimization for DC power integrity in 3D DRAM.

Yarui Peng, Bon Woong Ku, Youn-Sik Park, Kwang-Il Park, Seong-Jin Jang, Joo-Sun Choi, Sung Kyu Lim

Proceedings of the 52nd Annual Design Automation Conference, 2015