Zhiyong Li
Orcid: 0000-0002-0436-6670Affiliations:
- Korea Advanced Institute of Science and Technology, KAIST, School of Electrical Engineering, Korea
According to our database1,
Zhiyong Li
authored at least 25 papers
between 2021 and 2025.
Collaborative distances:
Collaborative distances:
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Bibliography
2025
IEEE Trans. Circuits Syst. Video Technol., May, 2025
NeuGPU: An Energy-Efficient Neural Graphics Processing Unit for Instant Modeling and Real-Time Rendering on Mobile Devices.
IEEE J. Solid State Circuits, January, 2025
2024
Scaling-CIM: eDRAM In-Memory-Computing Accelerator With Dynamic-Scaling ADC and Adaptive Analog Operation.
IEEE J. Solid State Circuits, August, 2024
A 92 fps and 2.56 mJ/Frame Computing-In-Memory-Based Human Pose Estimation Accelerator With Resource-Efficient Macro for Mobile Devices.
IEEE Trans. Circuits Syst. II Express Briefs, June, 2024
DynaPlasia: An eDRAM In-Memory Computing-Based Reconfigurable Spatial Accelerator With Triple-Mode Cell.
IEEE J. Solid State Circuits, January, 2024
20.7 NeuGPU: A 18.5mJ/Iter Neural-Graphics Processing Unit for Instant-Modeling and Real-Time Rendering with Segmented-Hashing Architecture.
Proceedings of the IEEE International Solid-State Circuits Conference, 2024
NeuGPU: A Neural Graphics Processing Unit for Instant Modeling and Real-Time Rendering on Mobile AR/VR Devices.
Proceedings of the 36th IEEE Hot Chips Symposium, 2024
Proceedings of the IEEE/CVF Conference on Computer Vision and Pattern Recognition, 2024
A Low-Power Neural Graphics System for Instant 3D Modeling and Real-Time Rendering on Mobile AR/VR Devices.
Proceedings of the IEEE Symposium in Low-Power and High-Speed Chips, 2024
NoPIM: Functional Network-on-Chip Architecture for Scalable High-Density Processing-in-Memory-based Accelerator.
Proceedings of the IEEE Symposium in Low-Power and High-Speed Chips, 2024
2023
An Efficient Deep-Learning-Based Super-Resolution Accelerating SoC With Heterogeneous Accelerating and Hierarchical Cache.
IEEE J. Solid State Circuits, March, 2023
A Mobile 3-D Object Recognition Processor With Deep-Learning-Based Monocular Depth Estimation.
IEEE Micro, 2023
DSPU: An Efficient Deep Learning-Based Dense RGB-D Data Acquisition With Sensor Fusion and 3-D Perception SoC.
IEEE J. Solid State Circuits, 2023
Scaling-CIM: An eDRAM-based In-Memory-Computing Accelerator with Dynamic-Scaling ADC for SQNR-Boosting and Layer-wise Adaptive Bit-Truncation.
Proceedings of the 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), 2023
DynaPlasia: An eDRAM In-Memory-Computing-Based Reconfigurable Spatial Accelerator with Triple-Mode Cell for Dynamic Resource Switching.
Proceedings of the IEEE International Solid- State Circuits Conference, 2023
A Reconfigurable 1T1C eDRAM-based Spiking Neural Network Computing-In-Memory Processor for High System-Level Efficiency.
Proceedings of the IEEE International Symposium on Circuits and Systems, 2023
Sibia: Signed Bit-slice Architecture for Dense DNN Acceleration with Slice-level Sparsity Exploitation.
Proceedings of the IEEE International Symposium on High-Performance Computer Architecture, 2023
2022
CoRR, 2022
DSPU: A 281.6mW Real-Time Depth Signal Processing Unit for Deep Learning-Based Dense RGB-D Data Acquisition with Depth Fusion and 3D Bounding Box Extraction in Mobile Platforms.
Proceedings of the IEEE International Solid-State Circuits Conference, 2022
A 161.6 TOPS/W Mixed-mode Computing-in-Memory Processor for Energy-Efficient Mixed-Precision Deep Neural Networks.
Proceedings of the IEEE International Symposium on Circuits and Systems, 2022
An Efficient High-quality FHD Super-resolution Mobile Accelerator SoC with Hybrid-precision and Energy-efficient Cache.
Proceedings of the 2022 IEEE Hot Chips 34 Symposium, 2022
DSPU: A 281.6mW Real-Time Deep Learning-Based Dense RGB-D Data Acquisition with Sensor Fusion and 3D Perception System-on-Chip.
Proceedings of the 2022 IEEE Hot Chips 34 Symposium, 2022
A Low-power and Real-time 3D Object Recognition Processor with Dense RGB-D Data Acquisition in Mobile Platforms.
Proceedings of the IEEE Symposium in Low-Power and High-Speed Chips, 2022
An 0.92 mJ/frame High-quality FHD Super-resolution Mobile Accelerator SoC with Hybrid-precision and Energy-efficient Cache.
Proceedings of the IEEE Custom Integrated Circuits Conference, 2022
2021
A 3.6 TOPS/W Hybrid FP-FXP Deep Learning Processor with Outlier Compensation for Image-to-Image Application.
Proceedings of the IEEE International Symposium on Circuits and Systems, 2021