Steffen Lehmann

Orcid: 0000-0003-2453-662X

According to our database1, Steffen Lehmann authored at least 11 papers between 2019 and 2024.

Collaborative distances:
  • Dijkstra number2 of four.
  • Erdős number3 of four.

Timeline

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Bibliography

2024
Reimaging the Library of the Future. From Social Condenser and Community Hub to Regenerative Design.
Public Libr. Q., March, 2024

2023
Novel Approach to FDSOI Threshold Voltage Model Validated at Cryogenic Temperatures.
IEEE Access, 2023

2022
Cryogenic RF Characterization and Simple Modeling of a 22 nm FDSOI Technology.
Proceedings of the 52nd IEEE European Solid-State Device Research Conference, 2022

2021
Reliability-Conscious MOSFET Compact Modeling with Focus on the Defect-Screening Effect of Hot-Carrier Injection.
Proceedings of the IEEE International Reliability Physics Symposium, 2021

IC Design & Technology Co-Development: e-NVM & mmWave enablement of 22FDX™ Technology.
Proceedings of the International Conference on IC Design and Technology, 2021

Effect of Continuous and Discrete Feedback on Agency and Frustration in a Brain-Computer Interface Virtual Reality Interaction.
Proceedings of the 21st IEEE International Conference on Bioinformatics and Bioengineering, 2021

22FDSOI device towards RF and mmWave applications.
Proceedings of the IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium, 2021

2019
22FDX<sup>®</sup> fMAX Optimization through Parasitics Reduction and GM Boost.
Proceedings of the 49th European Solid-State Device Research Conference, 2019

DC-110 GHz Characterization of 22FDX<sup>®</sup> FDSOI Transistors for 5G Transmitter Front-End.
Proceedings of the 49th European Solid-State Device Research Conference, 2019

IPCEI subcontracts contributing to 22-FDX Add-On Functionalities at GF.
Proceedings of the 49th European Solid-State Device Research Conference, 2019

Assessment of a Thick-Oxide Transistor from the 22FDX® Platform for 5G NR sub-6 GHz FEMs.
Proceedings of the 2nd IEEE 5G World Forum, 5GWF 2019, Dresden, Germany, September 30, 2019


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