Xiangyu Dong

Affiliations:
  • Qualcomm Technology, Inc., San Diego, CA, USA


According to our database1, Xiangyu Dong authored at least 36 papers between 2008 and 2014.

Collaborative distances:
  • Dijkstra number2 of four.
  • Erdős number3 of four.

Timeline

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Links

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Bibliography

2014
Endurance-aware cache line management for non-volatile caches.
ACM Trans. Archit. Code Optim., 2014

Building and Optimizing MRAM-Based Commodity Memories.
ACM Trans. Archit. Code Optim., 2014

Preventing STT-RAM Last-Level Caches from Port Obstruction.
ACM Trans. Archit. Code Optim., 2014

Enabling high-performance LPDDRx-compatible MRAM.
Proceedings of the International Symposium on Low Power Electronics and Design, 2014

ProactiveDRAM: A DRAM-initiated retention management scheme.
Proceedings of the 32nd IEEE International Conference on Computer Design, 2014

Using multi-level cell STT-RAM for fast and energy-efficient local checkpointing.
Proceedings of the IEEE/ACM International Conference on Computer-Aided Design, 2014

2013
A circuit-architecture co-optimization framework for exploring nonvolatile memory hierarchies.
ACM Trans. Archit. Code Optim., 2013

A circuit-architecture co-optimization framework for evaluating emerging memory hierarchies.
Proceedings of the 2012 IEEE International Symposium on Performance Analysis of Systems & Software, 2013

Low-current probabilistic writes for power-efficient STT-RAM caches.
Proceedings of the 2013 IEEE 31st International Conference on Computer Design, 2013

i<sup>2</sup>WAP: Improving non-volatile cache lifetime by reducing inter- and intra-set write variations.
Proceedings of the 19th IEEE International Symposium on High Performance Computer Architecture, 2013

OAP: an obstruction-aware cache management policy for STT-RAM last-level caches.
Proceedings of the Design, Automation and Test in Europe, 2013

2012
NVSim: A Circuit-Level Performance, Energy, and Area Model for Emerging Nonvolatile Memory.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2012

Point and discard: a hard-error-tolerant architecture for non-volatile last level caches.
Proceedings of the 49th Annual Design Automation Conference 2012, 2012

2011
Influence of Stacked 3D Memory/Cache Architectures on GPUs.
Proceedings of the 3D Integration for NoC-based SoC Architectures, 2011

Hybrid checkpointing using emerging nonvolatile memories for future exascale systems.
ACM Trans. Archit. Code Optim., 2011

Stacking magnetic random access memory atop microprocessors: an architecture-level evaluation.
IET Comput. Digit. Tech., 2011

Three-dimensional Integrated Circuits: Design, EDA, and Architecture.
Found. Trends Electron. Des. Autom., 2011

Architecting on-chip interconnects for stacked 3D STT-RAM caches in CMPs.
Proceedings of the 38th International Symposium on Computer Architecture (ISCA 2011), 2011

Energy-efficient multi-level cell phase-change memory system with data encoding.
Proceedings of the IEEE 29th International Conference on Computer Design, 2011

An energy-efficient 3D CMP design with fine-grained voltage scaling.
Proceedings of the Design, Automation and Test in Europe, 2011

Design implications of memristor-based RRAM cross-point structures.
Proceedings of the Design, Automation and Test in Europe, 2011

AdaMS: Adaptive MLC/SLC phase-change memory design for file storage.
Proceedings of the 16th Asia South Pacific Design Automation Conference, 2011

2010
Fabrication Cost Analysis and Cost-Aware Design Space Exploration for 3-D ICs.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2010

Simple but Effective Heterogeneous Main Memory with On-Chip Memory Controller Support.
Proceedings of the Conference on High Performance Computing Networking, 2010

Energy- and endurance-aware design of phase change memory caches.
Proceedings of the Design, Automation and Test in Europe, 2010

Cost-aware three-dimensional (3D) many-core multiprocessor design.
Proceedings of the 47th Design Automation Conference, 2010

Cost-driven 3D integration with interconnect layers.
Proceedings of the 47th Design Automation Conference, 2010

Energy and performance driven circuit design for emerging phase-change memory.
Proceedings of the 15th Asia South Pacific Design Automation Conference, 2010

Architectural benefits and design challenges for three-dimensional integrated circuits.
Proceedings of the IEEE Asia Pacific Conference on Circuits and Systems, 2010

3D memory stacking for fast checkpointing/restore applications.
Proceedings of the IEEE International Conference on 3D System Integration, 2010

2009
Leveraging 3D PCRAM technologies to reduce checkpoint overhead for future exascale systems.
Proceedings of the ACM/IEEE Conference on High Performance Computing, 2009

3D GPU architecture using cache stacking: Performance, cost, power and thermal analysis.
Proceedings of the 27th International Conference on Computer Design, 2009

PCRAMsim: System-level performance, energy, and area modeling for Phase-Change RAM.
Proceedings of the 2009 International Conference on Computer-Aided Design, 2009

A novel architecture of the 3D stacked MRAM L2 cache for CMPs.
Proceedings of the 15th International Conference on High-Performance Computer Architecture (HPCA-15 2009), 2009

System-level cost analysis and design exploration for three-dimensional integrated circuits (3D ICs).
Proceedings of the 14th Asia South Pacific Design Automation Conference, 2009

2008
Circuit and microarchitecture evaluation of 3D stacking magnetic RAM (MRAM) as a universal memory replacement.
Proceedings of the 45th Design Automation Conference, 2008


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