Gerald Cibrario

According to our database1, Gerald Cibrario authored at least 13 papers between 2012 and 2021.

Collaborative distances:
  • Dijkstra number2 of four.
  • Erdős number3 of four.

Timeline

Legend:

Book 
In proceedings 
Article 
PhD thesis 
Dataset
Other 

Links

On csauthors.net:

Bibliography

2021
Area and Cost Analysis of the Mixed Signal Circuits in a Novel Monolithic 3D Process.
Proceedings of the 64th IEEE International Midwest Symposium on Circuits and Systems, 2021

2019
Merging PDKs to Build a Design Environment for 3D Circuits: Methodology, Challenges and Limitations.
Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019

2017
Transistor Temperature Deviation Analysis in Monolithic 3D Standard Cells.
Proceedings of the 2017 IEEE Computer Society Annual Symposium on VLSI, 2017

2016


Impact of intermediate BEOL technology on standard cell performances of 3D VLSI.
Proceedings of the 46th European Solid-State Device Research Conference, 2016

From 2D to monolithic 3D predictive design platform: An innovative migration methodology for benchmark purpose.
Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016

2015
From 2D to Monolithic 3D: Design Possibilities, Expectations and Challenges.
Proceedings of the 2015 Symposium on International Symposium on Physical Design, ISPD 2015, Monterey, CA, USA, March 29, 2015

A comprehensive study of monolithic 3D cell on cell design using commercial 2D tool.
Proceedings of the 2015 Design, Automation & Test in Europe Conference & Exhibition, 2015

2014
A high-level design rule library addressing CMOS and heterogeneous technologies.
Proceedings of the 2014 IEEE International Conference on IC Design & Technology, 2014

3D FPGA using high-density interconnect Monolithic Integration.
Proceedings of the Design, Automation & Test in Europe Conference & Exhibition, 2014

2013
A 3D Process Design Kit generator based on customizable 3D layout design environment.
Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

2012
Towards ultra-dense arrays of VHF NEMS with FDSOI-CMOS active pixels for sensing applications.
Proceedings of the 2012 IEEE International Solid-State Circuits Conference, 2012


  Loading...