Gary W. Maier

According to our database, Gary W. Maier authored at least 8 papers between 2000 and 2020.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2020

Efficient AI System Design With Cross-Layer Approximate Computing.

Swagath Venkataramani, Xiao Sun, Naigang Wang, Chia-Yu Chen, Jungwook Choi, Mingu Kang, Ankur Agarwal, Jinwook Oh, Shubham Jain, Tina Babinsky, Nianzheng Cao, Thomas W. Fox, Bruce M. Fleischer, George Gristede, Michael Guillorn, Howard Haynie, Hiroshi Inoue, Kazuaki Ishizaki, Michael J. Klaiber, Shih-Hsien Lo, Gary W. Maier, Silvia M. Mueller, Michael Scheuermann, Eri Ogawa, Marcel Schaal, Mauricio J. Serrano, Joel Silberman, Christos Vezyrtzis, Wei Wang, Fanchieh Yee, Jintao Zhang, Matthew M. Ziegler, Ching Zhou, Moriyoshi Ohara, Pong-Fei Lu, Brian W. Curran, Sunil Shukla, Vijayalakshmi Srinivasan, Leland Chang, Kailash Gopalakrishnan

Proc. IEEE, 2020

A 3.0 TFLOPS 0.62V Scalable Processor Core for High Compute Utilization AI Training and Inference.

Jinwook Oh, Sae Kyu Lee, Mingu Kang, Matthew M. Ziegler, Joel Silberman, Ankur Agrawal, Swagath Venkataramani, Bruce M. Fleischer, Michael Guillorn, Jungwook Choi, Wei Wang, Silvia M. Mueller, Shimon Ben-Yehuda, James Bonanno, Nianzheng Cao, Robert Casatuta, Chia-Yu Chen, Matt Cohen, Ophir Erez, Thomas W. Fox, George Gristede, Howard Haynie, Vicktoria Ivanov, Siyu Koswatta, Shih-Hsien Lo, Martin Lutz, Gary W. Maier, Alex Mesh, Yevgeny Nustov, Scot Rider, Marcel Schaal, Michael Scheuermann, Xiao Sun, Naigang Wang, Fanchieh Yee, Ching Zhou, Vinay Shah, Brian W. Curran, Vijayalakshmi Srinivasan, Pong-Fei Lu, Sunil Shukla, Kailash Gopalakrishnan, Leland Chang

Proceedings of the IEEE Symposium on VLSI Circuits, 2020

2018

A Scalable Multi- TeraOPS Deep Learning Processor Core for AI Trainina and Inference.

Bruce M. Fleischer, Sunil Shukla, Matthew M. Ziegler, Joel Silberman, Jinwook Oh, Vijayalakshmi Srinivasan, Jungwook Choi, Silvia M. Mueller, Ankur Agrawal, Tina Babinsky, Nianzheng Cao, Chia-Yu Chen, Pierce Chuang, Thomas W. Fox, George Gristede, Michael Guillorn, Howard Haynie, Michael J. Klaiber, Dongsoo Lee, Shih-Hsien Lo, Gary W. Maier, Michael Scheuermann, Swagath Venkataramani, Christos Vezyrtzis, Naigang Wang, Fanchieh Yee, Ching Zhou, Pong-Fei Lu, Brian W. Curran, Leland Chang, Kailash Gopalakrishnan

Proceedings of the 2018 IEEE Symposium on VLSI Circuits, 2018

Across the Stack Opportunities for Deep Learning Acceleration.

Vijayalakshmi Srinivasan, Bruce M. Fleischer, Sunil Shukla, Matthew M. Ziegler, Joel Silberman, Jinwook Oh, Jungwook Choi, Silvia M. Mueller, Ankur Agrawal, Tina Babinsky, Nianzheng Cao, Chia-Yu Chen, Pierce Chuang, Thomas W. Fox, George Gristede, Michael Guillorn, Howard Haynie, Michael J. Klaiber, Dongsoo Lee, Shih-Hsien Lo, Gary W. Maier, Michael Scheuermann, Swagath Venkataramani, Christos Vezyrtzis, Naigang Wang, Fanchieh Yee, Ching Zhou, Pong-Fei Lu, Brian W. Curran, Leland Chang, Kailash Gopalakrishnan

Proceedings of the International Symposium on Low Power Electronics and Design, 2018

2016

Three-Dimensional Dynamic Random Access Memories Using Through-Silicon-Vias.

Toshiaki Kirihata, John Golz, Matthew R. Wordeman, Pooja Batra, Gary W. Maier, Norman Robson, Troy L. Graves-abe, Daniel Berger, Subramanian S. Iyer

IEEE J. Emerg. Sel. Topics Circuits Syst., 2016

2012

A shorted global clock design for multi-GHz 3D stacked chips.

Liang-Teck Pang, Phillip J. Restle, Matthew R. Wordeman, Joel A. Silberman, Robert L. Franch, Gary W. Maier

Proceedings of the Symposium on VLSI Circuits, 2012

A 3D system prototype of an eDRAM cache stacked over processor-like logic using through-silicon vias.

Matt Wordeman, Joel Silberman, Gary W. Maier, Michael Scheuermann

Proceedings of the 2012 IEEE International Solid-State Circuits Conference, 2012

2000

Electronic Process Limited Yield.

Gary W. Maier, Shawn Smith

Proceedings of the 1st Latin American Test Workshop, 2000