Lennart Bamberg

Orcid: 0000-0003-4673-8310

According to our database1, Lennart Bamberg authored at least 33 papers between 2016 and 2023.

Collaborative distances:
  • Dijkstra number2 of four.
  • Erdős number3 of four.

Timeline

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Bibliography

2023
Synapse Compression for Event-Based Convolutional-Neural-Network Accelerators.
IEEE Trans. Parallel Distributed Syst., April, 2023

Exploiting Neural-Network Statistics for Low-Power DNN Inference.
CoRR, 2023

2022
Ratatoskr: An Open-Source Framework for In-Depth Power, Performance, and Area Analysis and Optimization in 3D NoCs.
ACM Trans. Model. Comput. Simul., 2022

ARTS: An adaptive regularization training schedule for activation sparsity exploration.
Proceedings of the 25th Euromicro Conference on Digital System Design, 2022

2021
High-Performance Logic-on-Memory Monolithic 3-D IC Designs for Arm Cortex-A Processors.
IEEE Trans. Very Large Scale Integr. Syst., 2021

NEWROMAP: mapping CNNs to NoC-interconnected self-contained data-flow accelerators for edge-AI.
Proceedings of the NOCS '21: International Symposium on Networks-on-Chip, 2021

Technology-aware Router Architectures for On-Chip-Networks in Heterogeneous Technologies.
Proceedings of the NANOCOM '21: The Eighth Annual ACM International Conference on Nanoscale Computing and Communication, Virtual Event, Italy, September 7, 2021

Bridging the Frequency Gap in Heterogeneous 3D SoCs through Technology-Specific NoC Router Architectures.
Proceedings of the ASPDAC '21: 26th Asia and South Pacific Design Automation Conference, 2021

2020
Misalignment-aware energy modeling of narrow buses for data encoding schemes.
Integr., 2020

Heterogeneous 3D Integration for a RISC-V System With STT-MRAM.
IEEE Comput. Archit. Lett., 2020

Macro-3D: A Physical Design Methodology for Face-to-Face-Stacked Heterogeneous 3D ICs.
Proceedings of the 2020 Design, Automation & Test in Europe Conference & Exhibition, 2020

2019
Coding-Based Low-Power Through-Silicon-Via Redundancy Schemes for Heterogeneous 3-D SoCs.
IEEE Trans. Very Large Scale Integr. Syst., 2019

A Logic-on-Memory Processor-System Design With Monolithic 3-D Technology.
IEEE Micro, 2019

Simulation environment for link energy estimation in networks-on-chip with virtual channels.
Integr., 2019

Edge effect aware low-power crosstalk avoidance technique for 3D integration.
Integr., 2019

Crosstalk optimization for through-silicon vias by exploiting temporal signal misalignment.
Integr., 2019

Ratatoskr: An open-source framework for in-depth power, performance and area analysis in 3D NoCs.
CoRR, 2019

Integer-Value Encoding for Approximate On-Chip Communication.
IEEE Access, 2019

NoCs in Heterogeneous 3D SoCs: Co-Design of Routing Strategies and Microarchitectures.
IEEE Access, 2019

A Coding Approach to Improve the Energy Efficiency of Approximate NoCs.
Proceedings of the 14th International Symposium on Reconfigurable Communication-centric Systems-on-Chip, 2019

Area Optimization with Non-Linear Models in Core Mapping for System-on-Chips.
Proceedings of the 8th International Conference on Modern Circuits and Systems Technologies, 2019

System-Level Optimization of Network-on-Chips for Heterogeneous 3D System-on-Chips.
Proceedings of the 37th IEEE International Conference on Computer Design, 2019

2018
Edge effects on the TSV array capacitances and their performance influence.
Integr., 2018

Specification of Simulation Models for NoCs in Heterogeneous 3D SoCs.
Proceedings of the 13th International Symposium on Reconfigurable Communication-centric Systems-on-Chip, 2018

Exploiting Temporal Misalignment to Optimize the Interconnect Performance for 3D Integration.
Proceedings of the 28th International Symposium on Power and Timing Modeling, 2018

Coding-aware Link Energy Estimation for 2D and 3D Networks-on-Chip with Virtual Channels.
Proceedings of the 28th International Symposium on Power and Timing Modeling, 2018

Misalignment-aware delay modeling of narrow on-chip interconnects considering variability.
Proceedings of the 7th International Conference on Modern Circuits and Systems Technologies, 2018

Coding approach for low-power 3D interconnects.
Proceedings of the 55th Annual Design Automation Conference, 2018

2017
High-Level Energy Estimation for Submicrometric TSV Arrays.
IEEE Trans. Very Large Scale Integr. Syst., 2017

Low-Power Coding: Trends and New Challenges.
J. Low Power Electron., 2017

Design method for asymmetric 3D interconnect architectures with high level models.
Proceedings of the 12th International Symposium on Reconfigurable Communication-centric Systems-on-Chip, 2017

Edge effect aware crosstalk avoidance technique for 3D integration.
Proceedings of the 27th International Symposium on Power and Timing Modeling, 2017

2016
Energy modeling of coupled interconnects including intrinsic misalignment effects.
Proceedings of the 26th International Workshop on Power and Timing Modeling, 2016


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