Chia-Tung Ho

Orcid: 0000-0002-6479-7552

According to our database1, Chia-Tung Ho authored at least 13 papers between 2013 and 2024.

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Bibliography

2024
Novel Transformer Model Based Clustering Method for Standard Cell Design Automation.
Proceedings of the 2024 International Symposium on Physical Design, 2024

2023
NVCell 2: Routability-Driven Standard Cell Layout in Advanced Nodes with Lattice Graph Routability Model.
Proceedings of the 2023 International Symposium on Physical Design, 2023

2022
Machine Learning Prediction for Design and System Technology Co-Optimization Sensitivity Analysis.
IEEE Trans. Very Large Scale Integr. Syst., 2022

Monolithic 3D Semiconductor Footprint Scaling Exploration Based on VFET Standard Cell Layout Methodology, Design Flow, and EDA Platform.
IEEE Access, 2022

Net Separation-Oriented Printed Circuit Board Placement via Margin Maximization.
Proceedings of the 27th Asia and South Pacific Design Automation Conference, 2022

2021
Complementary-FET (CFET) Standard Cell Synthesis Framework for Design and System Technology Co-Optimization Using SMT.
IEEE Trans. Very Large Scale Integr. Syst., 2021

SP&R: SMT-Based Simultaneous Place-and-Route for Standard Cell Synthesis of Advanced Nodes.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2021

Design and System Technology Co-Optimization Sensitivity Prediction for VLSI Technology Development using Machine Learning.
Proceedings of the ACM/IEEE International Workshop on System Level Interconnect Prediction, 2021

2020
A Routability-Driven Complimentary-FET (CFET) Standard Cell Synthesis Framework using SMT.
Proceedings of the IEEE/ACM International Conference On Computer Aided Design, 2020

2019
IncPIRD: Fast Learning-Based Prediction of Incremental IR Drop.
Proceedings of the International Conference on Computer-Aided Design, 2019

2017
InTraSim: Incremental Transient Simulation of Power Grids.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2017

2014
Incremental transient simulation of power grid.
Proceedings of the International Symposium on Physical Design, 2014

2013
Power delivery network design for wiring and TSV resource minimization in TSV-based 3-D ICs.
Proceedings of the 2013 International Symposium on VLSI Design, Automation, and Test, 2013


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