Mikael Detalle

According to our database, Mikael Detalle authored at least 9 papers between 2011 and 2016.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2016

High-density and low-leakage novel embedded 3D MIM capacitor on Si interposer.

C. Roda Neve, Mikael Detalle, Philip Nolmans, Yunlong Li, Joeri De Vos, Geert Van der Plas, Gerald Beyer, Eric Beyne

Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016

2015

Active-lite interposer for 2.5 & 3D integration.

Geert Hellings, Mirko Scholz, Mikael Detalle, Dimitrios Velenis, Muriel de Potter de ten Broeck, C. Roda Neve, Y. Li, Stefaan Van Huylenbroeck, Shih-Hung Chen, Erik Jan Marinissen, Antonio La Manna, Geert Van der Plas, Dimitri Linten, Eric Beyne, Aaron Thean

Proceedings of the Symposium on VLSI Circuits, 2015

Processing active devices on Si interposer and impact on cost.

Dimitrios Velenis, Mikael Detalle, Geert Hellings, Mirko Scholz, Erik Jan Marinissen, Geert Van der Plas, Antonio La Manna, Andy Miller, Dimitri Linten, Eric Beyne

Proceedings of the 2015 International 3D Systems Integration Conference, 2015

2014

Comparative study of 3D stacked IC and 3D interposer integration: Processing and assembly challenges.

Joeri De Vos, Vladimir Cherman, Mikael Detalle, Teng Wang, Abdellah Salahouelhadj, Robert Daily, Geert Van der Plas, Eric Beyne

Proceedings of the 2014 International 3D Systems Integration Conference, 2014

Analysis of 3D interconnect performance: Effect of the Si substrate resistivity.

X. Sun, Geert Van der Plas, Mikael Detalle, Eric Beyne

Proceedings of the 2014 International 3D Systems Integration Conference, 2014

2013

Si interposer build-up options and impact on 3D system cost.

Dimitrios Velenis, Mikael Detalle, Erik Jan Marinissen, Eric Beyne

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

2012

A calibrated pathfinding model for signal integrity analysis on interposer.

Jaemin Kim, Sunyoung Kim, Julien Ryckaert, Mikael Detalle, Nele Van Hoovels, Pol Marchal

Proceedings of the IEEE 2012 Custom Integrated Circuits Conference, 2012

2011

3D stacking using ultra thin dies.

Antonio La Manna, Dimitrios Velenis, Thibault Buisson, Mikael Detalle, Kenneth J. Rebibis, Wenqi Zhang, Eric Beyne

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

Analysis of microbump induced stress effects in 3D stacked IC technologies.

Andrej Ivankovic, Geert Van der Plas, V. Moroz, M. Choi, Vladimir Cherman, Abdelkarim Mercha, Paul Marchal, Marcel Gonzalez, Geert Eneman, Wenqi Zhang, Thibault Buisson, Mikael Detalle, Antonio La Manna, Diederik Verkest, Gerald Beyer, Eric Beyne, Bart Vandevelde, Ingrid De Wolf, Dirk Vandepitte

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011