Willem D. van Driel

According to our database, Willem D. van Driel authored at least 70 papers between 2003 and 2025.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2025

Adaptive Bayesian Data-Driven Design of Reliable Solder Joints for Micro-electronic Devices.

Leo Guo, Adwait Inamdar, Willem D. van Driel, Guoqi Zhang

CoRR, July, 2025

A Fully Integrated Electrostatic Charge Boosting Rectifier for Triboelectric Energy Harvesting.

Wenyu Peng, Xinling Yue, Willem D. van Driel, Guoqi Zhang, Sijun Du

IEEE J. Solid State Circuits, June, 2025

Modeling Spectral LED Degradation Using an Unsupervised Machine Learning Approach.

Alexander Herzog, Benoit Hamon, Paul Myland, Peter Förster, Simon Benkner, Babak Zandi, Victor Guerra, Sebastian Schöps, Willem D. van Driel, Tran Quoc Khanh

IEEE Access, 2025

Long-Term Analysis of Temperature and Current-Dependent Degradation in Green High-Power Light-Emitting Diodes.

Alexander Herzog, Matteo Buffolo, Francesco Piva, Simon Benkner, Babak Zandi, Jens Balasus, Paul Myland, Felix Wirth, Willem D. van Driel, Matteo Meneghini, Tran Quoc Khanh

IEEE Access, 2025

2024

Uncertainty analysis and interval prediction of LEDs lifetimes.

Roberto Rocchetta, Zhouzhao Zhan, Willem D. van Driel, Alessandro Di Bucchianico

Reliab. Eng. Syst. Saf., February, 2024

Towards a digital twin architecture for the lighting industry.

Victor Guerra, Benoit Hamon, Benoit Bataillou, Adwait Inamdar, Willem D. van Driel

Future Gener. Comput. Syst., 2024

LED Degradation Monitoring Using a Multi-Channel Spectral Sensor.

Paul Myland, Alexander Herzog, Sebastian Babilon, Willem D. van Driel, Tran Quoc Khanh

IEEE Access, 2024

AI-Enabled Board Level Vibration Testing: Unveiling The Physics of Degradation.

Varun Thukral, Chen He, Rebecca Chen, Letian Zhang, Romuald Roucou, Michiel van Soestbergen, Jeroen J. M. Zaal, Rene Rongen, Willem D. van Driel, G. Q. Zhang

Proceedings of the IEEE International Test Conference, 2024

An Efficient Rectifier Hybridizing Synchronized Electric Charge Extraction and Bias-Flipping for Triboelectric Energy Harvesting.

Wenyu Peng, Willem D. van Driel, Guoqi Zhang, Sijun Du

Proceedings of the IEEE International Symposium on Circuits and Systems, 2024

Unveiling Hidden Anomalies: A Hybrid Approach for Surface Mounted Electronics.

Amir Ghorbani Ghezeljehmeidan, Willem Dirk van Driel, Justin Dauwels

Proceedings of the 22nd IEEE International Conference on Industrial Informatics, 2024

A MLOps Architecture for XAI in Industrial Applications.

Leonhard Faubel, Thomas Woudsma, Leila Methnani, Amir Ghorbani Ghezeljhemeidan, Fabian Bülow, Klaus Schmid, Willem D. van Driel, Benjamin Klöpper, Andreas Theodorou, Mohsen Nosratinia, Magnus Bång

Proceedings of the 29th IEEE International Conference on Emerging Technologies and Factory Automation, 2024

A 70-V Fully Integrated Dual-SSHC Rectifier for Triboelectric Energy Harvesting with Full-Digital Duty-Cycle-Based MPPT Achieving 598% Power Extraction Enhancement.

Wenyu Peng, Xinling Yue, Willem D. van Driel, Guoqi Zhang, Sijun Du

Proceedings of the IEEE Custom Integrated Circuits Conference, 2024

2023

Towards an MLOps Architecture for XAI in Industrial Applications.

Leonhard Faubel, Thomas Woudsma, Leila Methnani, Amir Ghorbani Ghezeljhemeidan, Fabian Bülow, Klaus Schmid, Willem D. van Driel, Benjamin Klöpper, Andreas Theodorou, Mohsen Nosratinia, Magnus Bång

CoRR, 2023

Lifetime Prediction of Current-and Temperature-Induced Degradation in Silicone-Encapsulated 365 nm High-Power Light-Emitting Diodes.

Alexander Herzog, Simon Benkner, Babak Zandi, Matteo Buffolo, Willem D. van Driel, Matteo Meneghini, Tran Quoc Khanh

IEEE Access, 2023

2022

Advancements in Spectral Power Distribution Modeling of Light-Emitting Diodes.

Simon Benkner, Alexander Herzog, Stefan Klir, Willem D. van Driel, Tran Quoc Khanh

IEEE Access, 2022

Investigation of Potting Compounds on Thermal-Fatigue properties of Solder Interconnects.

Leiming Du, Xiujuan Zhao, Piet Watté, René Poelma, Willem D. van Driel, Guoqi Zhang

Proceedings of the IECON 2022, 2022

2021

The H2020-ECSEL Project "iRel40" (Intelligent Reliability 4.0).

Klaus Pressel, Josef Moser, Sven Rzepka, Klas Brinkfeldt, Susan Zhao, Willem D. van Driel, Paolo Giammatteo, Baris Bulut, Müjdat Soytürk, Luigi Pomante

Proceedings of the 24th Euromicro Conference on Digital System Design, 2021

2018

A stochastic process based reliability prediction method for LED driver.

Bo Sun, Xuejun Fan, Willem D. van Driel, Chengqiang Cui, Guoqi Zhang

Reliab. Eng. Syst. Saf., 2018

A review on discoloration and high accelerated testing of optical materials in LED based-products.

M. Yazdan Mehr, M. R. Toroghinejad, F. Karimzadeh, W. D. van Driel, G. Q. Zhang

Microelectron. Reliab., 2018

2017

A novel lifetime prediction for integrated LED lamps by electronic-thermal simulation.

Bo Sun, Xuejun Fan, Huaiyu Ye, Jiajie Fan, Cheng Qian, Willem D. van Driel, Guoqi Zhang

Reliab. Eng. Syst. Saf., 2017

Reliability and diffusion-controlled through thickness oxidation of optical materials in LED-based products.

M. Yazdan Mehr, M. R. Toroghinejad, F. Karimzadeh, W. D. van Driel, G. Q. Zhang

Microelectron. Reliab., 2017

Color shift acceleration on mid-power LED packages.

Guangjun Lu, W. D. van Driel, Xuejun Fan, Jiajie Fan, Cheng Qian, G. Q. Zhang

Microelectron. Reliab., 2017

2016

Creep fatigue models of solder joints: A critical review.

Ee-Hua Wong, W. D. van Driel, Abhijit Dasgupta, Michael G. Pecht

Microelectron. Reliab., 2016

LED degradation: From component to system.

B. Hamon, W. D. van Driel

Microelectron. Reliab., 2016

Lumen maintenance predictions for LED packages.

W. D. van Driel, M. Schuld, B. Jacobs, F. Commissaris, J. van der Eyden, B. Hamon

Microelectron. Reliab., 2016

2015

DEWI - Wirelessly into the Future.

Werner Rom, Peter Priller, Jani Koivusaari, Maarjana Komi, Ramiro Robles, Luis Dominguez, Javier Rivilla, Willem D. van Driel

Proceedings of the 2015 Euromicro Conference on Digital System Design, 2015

2014

Multi-physics reliability simulation for solid state lighting drivers.

S. Tarashioon, W. D. van Driel, G. Q. Zhang

Microelectron. Reliab., 2014

Accelerated life time testing and optical degradation of remote phosphor plates.

M. Yazdan Mehr, Willem D. van Driel, G. Q. Zhang

Microelectron. Reliab., 2014

Reliability and optical properties of LED lens plates under high temperature stress.

M. Yazdan Mehr, Willem D. van Driel, Sau Koh, Guoqi Zhang

Microelectron. Reliab., 2014

Lifetime assessment of Bisphenol-A Polycarbonate (BPA-PC) plastic lens, used in LED-based products.

M. Yazdan Mehr, W. D. van Driel, Kaspar M. B. Jansen, P. Deeben, G. Q. Zhang

Microelectron. Reliab., 2014

2012

Diagnosing Lumen Depreciation in LED Lighting Systems: An Estimation Approach.

Jianfei Dong, Ashish Pandharipande, Willem D. van Driel, Guoqi Zhang

IEEE Trans. Signal Process., 2012

An approach to "Design for Reliability" in solid state lighting systems at high temperatures.

S. Tarashioon, Alessandro Baiano, Henk W. van Zeijl, C. Guo, S. W. Koh, W. D. van Driel, G. Q. Zhang

Microelectron. Reliab., 2012

2011

Effect of high temperature aging on reliability of automotive electronics.

Dao-Guo Yang, F. F. Wan, Z. Y. Shou, Willem D. van Driel, H. Scholten, L. Goumans, Roberto Faria

Microelectron. Reliab., 2011

Local stress analysis on semiconductor devices by combined experimental-numerical procedure.

Rene Kregting, Sander Gielen, Willem D. van Driel, Paul Alkemade, Hozan Miro, Jan-Dirk Kamminga

Microelectron. Reliab., 2011

2010

Challenges in the Assembly and Handling of Thin Film Capped MEMS Devices.

Jeroen J. M. Zaal, Willem D. van Driel, G. Q. Zhang

Sensors, 2010

Reliability modeling on a MOSFET power package based on embedded die technology.

Dao-Guo Yang, Martien Kengen, W. G. M. Peels, David Heyes, W. D. van Driel

Microelectron. Reliab., 2010

Predictive modeling of board level shock-impact reliability of the HVQFN-family.

J. de Vries, W. Balemans, W. D. van Driel

Microelectron. Reliab., 2010

A fast moisture sensitivity level qualification method.

Xiaosong Ma, Kaspar M. B. Jansen, G. Q. Zhang, Willem D. van Driel, Olaf van der Sluis, Leo J. Ernst, C. Regards, Christian Gautier, Hélène Frémont

Microelectron. Reliab., 2010

Designing for reliability using a new Wafer Level Package structure.

Hendrik Pieter Hochstenbach, Willem D. van Driel, Dao-Guo Yang, Jeroen J. M. Zaal, E. Bagerman

Microelectron. Reliab., 2010

2009

Solder interconnect reliability under drop impact loading conditions using High-speed Cold Bump Pull.

Jeroen J. M. Zaal, Hendrik Pieter Hochstenbach, Willem D. van Driel, G. Q. Zhang

Microelectron. Reliab., 2009

Advances in the drop-impact reliability of solder joints for mobile applications.

Ee-Hua Wong, S. K. W. Seah, W. D. van Driel, J. F. J. M. Caers, N. Owens, Y.-S. Lai

Microelectron. Reliab., 2009

Solder-joint reliability of HVQFN-packages subjected to thermal cycling.

J. de Vries, M. Jansen, Willem D. van Driel

Microelectron. Reliab., 2009

Comparing drop impact test method using strain gauge measurements.

Y. Liu, F. J. H. G. Kessels, Willem D. van Driel, J. A. S. van Driel, F. L. Sun, G. Q. Zhang

Microelectron. Reliab., 2009

2008

Packaging influences on the reliability of MEMS resonators.

Jeroen J. M. Zaal, W. D. van Driel, S. Bendida, Q. Li, J. T. M. van Beek, G. Q. Zhang

Microelectron. Reliab., 2008

The need for multi-scale approaches in Cu/low-k reliability issues.

Cadmus A. Yuan, Olaf van der Sluis, Willem D. van Driel, G. Q. (Kouchi) Zhang

Microelectron. Reliab., 2008

Correlation studies for component level ball impact shear test and board level drop test.

Ee-Hua Wong, Ranjan Rajoo, S. K. W. Seah, C. S. Selvanayagam, W. D. van Driel, J. F. J. M. Caers, X. J. Zhao, N. Owens, L. C. Tan, M. Leoni, P. L. Eu, Y.-S. Lai, C.-L. Yeh

Microelectron. Reliab., 2008

Characterization of semiconductor interfaces using a modified mixed mode bending apparatus.

J. Thijsse, Olaf van der Sluis, J. A. W. van Dommelen, Willem D. van Driel, Marc G. D. Geers

Microelectron. Reliab., 2008

Fracture morphology and mechanism of IMC in Low-Ag SAC Solder/UBM (Ni(P)-Au) for WLCSP.

Fenglian Sun, Hendrik Pieter Hochstenbach, Willem D. van Driel, G. Q. (Kouchi) Zhang

Microelectron. Reliab., 2008

On chip-package stress interaction.

W. D. van Driel, Dao-Guo Yang, G. Q. Zhang

Microelectron. Reliab., 2008

2007

Molecular simulation on the material/interfacial strength of the low-dielectric materials.

Cadmus A. Yuan, Olaf van der Sluis, G. Q. (Kouchi) Zhang, Leo J. Ernst, Willem D. van Driel, Richard B. R. van Silfhout

Microelectron. Reliab., 2007

Numerical modeling of warpage induced in QFN array molding process.

Dao-Guo Yang, Kaspar M. B. Jansen, Leo J. Ernst, G. Q. Zhang, W. D. van Driel, H. J. L. Bressers, J. H. J. Janssen

Microelectron. Reliab., 2007

Advanced numerical prototyping methods in modern engineering applications - Optimisation for micro-electronic package reliability.

Artur Wymyslowski, W. D. van Driel, J. van de Peer, N. Tzannetakis, G. Q. Zhang

Microelectron. Reliab., 2007

On the difference between thermal cycling and thermal shock testing for board level reliability of soldered interconnections.

J. W. C. de Vries, M. Y. Jansen, W. D. van Driel

Microelectron. Reliab., 2007

Measuring the through-plane elastic modulus of thin polymer films in situ.

M. van Soestbergen, Leo J. Ernst, Kaspar M. B. Jansen, W. D. van Driel

Microelectron. Reliab., 2007

Efficient damage sensitivity analysis of advanced Cu/low-k bond pad structures by means of the area release energy criterion.

Olaf van der Sluis, R. A. B. Engelen, Richard B. R. van Silfhout, W. D. van Driel, Marcel A. J. van Gils

Microelectron. Reliab., 2007

Characterization of moisture properties of polymers for IC packaging.

Xiaosong Ma, Kaspar M. B. Jansen, Leo J. Ernst, W. D. van Driel, Olaf van der Sluis, G. Q. Zhang

Microelectron. Reliab., 2007

Virtual qualification of moisture induced failures of advanced packages.

Marcel A. J. van Gils, W. D. van Driel, G. Q. Zhang, H. J. L. Bressers, Richard B. R. van Silfhout, X. J. Fan, J. H. J. Janssen

Microelectron. Reliab., 2007

Mechanical reliability challenges for MEMS packages: Capping.

Willem D. van Driel, Dao-Guo Yang, Cadmus A. Yuan, M. van Kleef, G. Q. (Kouchi) Zhang

Microelectron. Reliab., 2007

Advanced structural similarity rules for the BGA package family.

W. D. van Driel, A. Mavinkurve, Marcel A. J. van Gils, G. Q. Zhang

Microelectron. Reliab., 2007

Facing the challenge of designing for Cu/low-k reliability.

W. D. van Driel

Microelectron. Reliab., 2007

Correlation between chemistry of polymer building blocks and microelectronics reliability.

H. J. L. Bressers, W. D. van Driel, Kaspar M. B. Jansen, Leo J. Ernst, G. Q. Zhang

Microelectron. Reliab., 2007

2006

Delamination analysis of Cu/low-k technology subjected to chemical-mechanical polishing process conditions.

Cadmus A. Yuan, Willem D. van Driel, Richard B. R. van Silfhout, Olaf van der Sluis, Roy A. B. Engelen, Leo J. Ernst, Fred van Keulen, G. Q. Zhang

Microelectron. Reliab., 2006

Multiscale modelling of multilayer substrates.

R. L. J. M. Ubachs, Olaf van der Sluis, W. D. van Driel, G. Q. Zhang

Microelectron. Reliab., 2006

Reliability modelling for packages in flexible end-products.

W. D. van Driel, Olaf van der Sluis, Dao-Guo Yang, R. L. J. M. Ubachs, C. Zenz, G. Aflenzer, G. Q. Zhang

Microelectron. Reliab., 2006

2005

Prediction of Delamination Related IC & Packaging Reliability Problems.

W. D. van Driel, Marcel A. J. van Gils, Richard B. R. van Silfhout, G. Q. Zhang

Microelectron. Reliab., 2005

2004

Prediction of crack growth in IC passivation layers.

Y. T. He, Marcel A. J. van Gils, Willem D. van Driel, G. Q. Zhang, Richard B. R. van Silfhout, Leo J. Ernst

Microelectron. Reliab., 2004

Prediction of thermo-mechanical integrity of wafer backend processes.

Viktor Gonda, Jaap M. J. den Toonder, Johan Beijer, G. Q. Zhang, Willem D. van Driel, Romano J. O. M. Hoofman, Leo J. Ernst

Microelectron. Reliab., 2004

Characterization and Modelling of Moisture Driven Interface Failures.

Marcel A. J. van Gils, P. J. J. H. A. Habets, G. Q. Zhang, Willem D. van Driel, Piet J. G. Schreurs

Microelectron. Reliab., 2004

Prediction of interfacial delamination in stacked IC structures using combined experimental and simulation methods.

Willem D. van Driel, C. J. Liu, G. Q. Zhang, J. H. J. Janssen, Richard B. R. van Silfhout, Marcel A. J. van Gils, Leo J. Ernst

Microelectron. Reliab., 2004

2003

Prediction and verification of process induced warpage of electronic packages.

W. D. van Driel, G. Q. Zhang, J. H. J. Janssen, Leo J. Ernst, Fei Su, Kerm Sin Chian, Sung Yi

Microelectron. Reliab., 2003