Herman Oprins

According to our database1, Herman Oprins authored at least 12 papers between 2008 and 2019.

Collaborative distances:
  • Dijkstra number2 of four.
  • Erdős number3 of four.

Timeline

Legend:

Book 
In proceedings 
Article 
PhD thesis 
Other 

Links

On csauthors.net:

Bibliography

2019
Understanding EM-Degradation Mechanisms in Metal Heaters Used for Si Photonics Applications.
Proceedings of the IEEE International Reliability Physics Symposium, 2019

2016
New fast distributed thermal model for analysis of GaN based power devices.
Proceedings of the 46th European Solid-State Device Research Conference, 2016

2015
Thermal experimental and modeling analysis of high power 3D packages.
Proceedings of the 2015 International Conference on IC Design & Technology, 2015

2014
Fast convolution based thermal model for 3D-ICs: Methodology, accuracy analysis and package impact.
Microelectron. J., 2014

2012
Modeling and Control of Electrowetting Induced Droplet Motion.
Micromachines, 2012

2011
Fine grain thermal modeling and experimental validation of 3D-ICs.
Microelectron. J., 2011

Design Issues and Considerations for Low-Cost 3-D TSV IC Technology.
IEEE J. Solid State Circuits, 2011

DRAM-on-logic Stack - Calibrated thermal and mechanical models integrated into PathFinding flow.
Proceedings of the 2011 IEEE Custom Integrated Circuits Conference, 2011

2010

3D integration: Circuit design, test, and reliability challenges.
Proceedings of the 16th IEEE International On-Line Testing Symposium (IOLTS 2010), 2010

Verifying electrical/thermal/thermo-mechanical behavior of a 3D stack - Challenges and solutions.
Proceedings of the IEEE Custom Integrated Circuits Conference, 2010

2008
Convection heat transfer in electrostatic actuated liquid droplets for electronics cooling.
Microelectron. J., 2008


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