Bart De Wachter

According to our database, Bart De Wachter authored at least 8 papers between 2010 and 2017.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of three.

2017

A fully automatic test system for characterizing large-array fine-pitch micro-bump probe cards.

Erik Jan Marinissen, Ferenc Fodor, Bart De Wachter, Jorg Kiesewetter, Eric Hill, Ken Smith

Proceedings of the International Test Conference in Asia, 2017

2015

Automated testing of bare die-to-die stacks.

Erik Jan Marinissen, Bart De Wachter, Teng Wang, Jens Fiedler, Jorg Kiesewetter, Karsten Stoll

Proceedings of the 2015 IEEE International Test Conference, 2015

2014

Direct probing on large-array fine-pitch micro-bumps of a wide-I/O logic-memory interface.

Erik Jan Marinissen, Bart De Wachter, Ken Smith, Jorg Kiesewetter, Mottaqiallah Taouil, Said Hamdioui

Proceedings of the 2014 International Test Conference, 2014

Vesuvius-3D: A 3D-DfT demonstrator.

Erik Jan Marinissen, Bart De Wachter, Stephen O'Loughlin, Sergej Deutsch, Christos Papameletis, Tobias Burgherr

Proceedings of the 2014 International Test Conference, 2014

2012

3D chip package interaction thermo-mechanical challenges: Proximity effects of Through Silicon vias and μ-bumps.

Wei Guo, Geert Van der Plas, Andrej Ivankovic, Geert Eneman, Vladimir Cherman, Bart De Wachter, Abdelkarim Mercha, Mario Gonzalez, Yann Civale, Augusto Redolfi, Thibault Buisson, A. Jourdan, Bart Vandevelde, Kenneth J. Rebibis, Ingrid De Wolf, Antonio La Manna, Gerald Beyer, Eric Beyne, Bart Swinnen

Proceedings of the IEEE International Conference on IC Design & Technology, 2012

2011

Design Issues and Considerations for Low-Cost 3-D TSV IC Technology.

Geert Van der Plas, Paresh Limaye, Igor Loi, Abdelkarim Mercha, Herman Oprins, Cristina Torregiani, Steven Thijs, Dimitri Linten, Michele Stucchi, Guruprasad Katti, Dimitrios Velenis, Vladimir Cherman, Bart Vandevelde, Veerle Simons, Ingrid De Wolf, Riet Labie, Dan Perry, Stephane Bronckers, Nikolaos Minas, Miro Cupac, Wouter Ruythooren, Jan Van Olmen, Alain Phommahaxay, Muriel de Potter de ten Broeck, Ann Opdebeeck, Michal Rakowski, Bart De Wachter, Morin Dehan, Marc Nelis, Rahul Agarwal, Antonio Pullini, Federico Angiolini, Luca Benini, Wim Dehaene, Youssef Travaly, Eric Beyne, Paul Marchal

IEEE J. Solid State Circuits, 2011

2010

Circuit Design for Bias Compatibility in Novel FinFET-Based Floating-Body RAM.

Pavel Poliakov, Ankur Anchlia, Marie Garcia Bardon, Bram Rooseleer, Bart De Wachter, Nadine Collaert, Koen van der Zanden, Wim Dehaene, Diederik Verkest, Miguel Corbalan Miranda

IEEE Trans. Circuits Syst. II Express Briefs, 2010

Design issues and considerations for low-cost 3D TSV IC technology.

Geert Van der Plas, Paresh Limaye, Abdelkarim Mercha, Herman Oprins, Cristina Torregiani, Steven Thijs, Dimitri Linten, Michele Stucchi, Guruprasad Katti, Dimitrios Velenis, Domae Shinichi, Vladimir Cherman, Bart Vandevelde, Veerle Simons, Ingrid De Wolf, Riet Labie, Dan Perry, Stephane Bronckers, Nikolaos Minas, Miro Cupac, Wouter Ruythooren, Jan Van Olmen, Alain Phommahaxay, Muriel de Potter de ten Broeck, Ann Opdebeeck, Michal Rakowski, Bart De Wachter, Morin Dehan, Marc Nelis, Rahul Agarwal, Wim Dehaene, Youssef Travaly, Pol Marchal, Eric Beyne

Proceedings of the IEEE International Solid-State Circuits Conference, 2010