According to our database1, Miro Cupac authored at least 4 papers between 2006 and 2011.
Legend:Book In proceedings Article PhD thesis Other
Design Issues and Considerations for Low-Cost 3-D TSV IC Technology.
J. Solid-State Circuits, 2011
Design issues and considerations for low-cost 3D TSV IC technology.
Proceedings of the IEEE International Solid-State Circuits Conference, 2010
Verifying electrical/thermal/thermo-mechanical behavior of a 3D stack - Challenges and solutions.
Proceedings of the IEEE Custom Integrated Circuits Conference, 2010
Hardware and a Tool Chain for ADRES.
Proceedings of the Reconfigurable Computing: Architectures and Applications, 2006