Kang Wook Lee

According to our database, Kang Wook Lee authored at least 31 papers between 1998 and 2016.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2016

Oxide-Oxide Thermocompression Direct Bonding Technologies with Capillary Self-Assembly for Multichip-to-Wafer Heterogeneous 3D System Integration.

Takafumi Fukushima, Hideto Hashiguchi, Hiroshi Yonekura, Hisashi Kino, Mariappan Murugesan, Ji Chel Bea, Kang Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi

Micromachines, 2016

Nano-scale Cu direct bonding using ultra-high density Cu nano-pillar (CNP) for high yield exascale 2.5/3D integration applications.

Kang Wook Lee, Ai Nakamura, Jicheol Bea, Takafumi Fukushima, Suresh Ramalingam, Xin Wu, Tanaka Tanaka, Mitsumasa Koyanagi

Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016

New concept of TSV formation methodology using Directed Self-Assembly (DSA).

Takafumi Fukushima, Mariappan Murugesan, Shin Ohsaki, Hiroyuki Hashimoto, Jichoel Bea, Kang Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi

Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016

2015

Impacts of 3-D integration processes on device reliabilities in thinned DRAM chip for 3-D DRAM.

Kang Wook Lee, Ji Chel Bea, Mariappan Murugesan, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

Proceedings of the IEEE International Reliability Physics Symposium, 2015

Vacuum-assisted-spin-coating of polyimide liner for high-aspect-ratio TSVs applications.

Yangyang Yan, Yingtao Ding, Qianwen Chen, Kang Wook Lee, Takafumi Fukushima, Mitsumasa Koyanagi

Proceedings of the 2015 International 3D Systems Integration Conference, 2015

Transfer and non-transfer stacking technologies based on chip-to-wafer self-asembly for high-throughput and high-precision alignment and microbump bonding.

Takafumi Fukushima, Taku Suzuki, Hideto Hashiguchi, Chisato Nagai, Jichoel Bea, Hiroyuki Hashimoto, Mariappan Murugesan, Kang Wook Lee, Tetsu Tanaka, Kazushi Asami, Yasuhiro Kitamura, Mitsumasa Koyanagi

Proceedings of the 2015 International 3D Systems Integration Conference, 2015

2014

Tiny VCSEL chip self-assembly for advanced chip-to-wafer 3D and hetero integration.

Takafumi Fukushima, Yuka Ito, Mariappan Murugesan, Jicheol Bea, Kang Wook Lee, Koji Choki, Tetsu Tanaka, Mitsumasa Koyanagi

Proceedings of the 2014 International 3D Systems Integration Conference, 2014

2013

Effect of CVD Mn oxide layer as Cu diffusion barrier for TSV.

Mariappan Murugesan, Jichoel Bea, Kang Wook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi, Yuji Sutou, H. Wang, J. Koike

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

Impact of 3-D integration process on memory retention characteristics in thinned DRAM chip for 3-D memory.

Kang Wook Lee, Seiya Tanikawa, Mariappan Murugesan, H. Naganuma, Jichoel Bea, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

A block-parallel ADC with digital noise cancelling for 3-D stacked CMOS image sensor.

Kouji Kiyoyama, Y. Sato, Hiroyuki Hashimoto, Kang Wook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

Highly efficient TSV repair technology for resilient 3-D stacked multicore processor system.

Hiroyuki Hashimoto, Takafumi Fukushima, Kang Wook Lee, Mitsumasa Koyanagi, Tetsu Tanaka

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

3D memory chip stacking by multi-layer self-assembly technology.

Takafumi Fukushima, Jichoel Bea, Mariappan Murugesan, Ho-Young Son, M.-S. Suh, K.-Y. Byun, N.-S. Kim, Kang Wook Lee, Mitsumasa Koyanagi

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

Development of via-last 3D integration technologies using a new temporary adhesive system.

Takafumi Fukushima, Jichoel Bea, Mariappan Murugesan, Kang Wook Lee, Mitsumasa Koyanagi

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

2011

Self-Assembly of Chip-Size Components with Cavity Structures: High-Precision Alignment and Direct Bonding without Thermal Compression for Hetero Integration.

Takafumi Fukushima, Takayuki Konno, Eiji Iwata, Risato Kobayashi, Toshiya Kojima, Mariappan Murugesan, Ji Chel Bea, Kang Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi

Micromachines, 2011

Novel detachable bonding process with wettability control of bonding surface for versatile chip-level 3D integration.

Yuki Ohara, Kang Wook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

Fabrication tolerance evaluation of high efficient unidirectional optical coupler for though silicon photonic via in optoelectronic 3D-LSI.

Akihiro Noriki, Kang Wook Lee, Jichoel Bea, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

High reliable and fine size of 5-μm diameter backside Cu through-silicon Via(TSV) for high reliability and high-end 3-D LSIs.

Kang Wook Lee, Jichoel Bea, Takafumi Fukushima, Yuki Ohara, Tetsu Tanaka, Mitsumasa Koyanagi

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

A very low area ADC for 3-D stacked CMOS image processing system.

Kouji Kiyoyama, Kang Wook Lee, Takafumi Fukushima, H. Naganuma, H. Kobayashi, Tetsu Tanaka, Mitsumasa Koyanagi

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

Chip-level TSV integration for rapid prototyping of 3D system LSIs.

Kazuyuki Hozawa, Futoshi Furuta, Yuko Hanaoka, Mayu Aoki, Kenichi Takeda, Katsuyuki Sakuma, Kang Wook Lee, Takafumi Fukushima, Mitsumasa Koyanagi

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

Temporary bonding strength control for self-assembly-based 3D integration.

Takafumi Fukushima, Yuki Ohara, Jichoel Bea, Mariappan Murugesan, Kang Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

2010

Through Silicon photonic via (TSPV) with Si core for low loss and high-speed data transmission in opto-electronic 3-D LSI.

Akihiro Noriki, Kang Wook Lee, Jichoel Bea, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

Proceedings of the IEEE International Conference on 3D System Integration, 2010

Impact of microbump induced stress in thinned 3D-LSIs after wafer bonding.

Mariappan Murugesan, Yuki Ohara, Jichoel Bea, Kang Wook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

Proceedings of the IEEE International Conference on 3D System Integration, 2010

A block-parallel signal processing system for CMOS image sensor with three-dimensional structure.

Kouji Kiyoyama, Kang Wook Lee, Takafumi Fukushima, H. Naganuma, Hiroaki Kobayashi, Tetsu Tanaka, Mitsumasa Koyanagi

Proceedings of the IEEE International Conference on 3D System Integration, 2010

Evaluation of alignment accuracy on chip-to-wafer self-assembly and mechanism on the direct chip bonding at room temperature.

Takafumi Fukushima, Eiji Iwata, Jichoel Bea, Mariappan Murugesan, Kang Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi

Proceedings of the IEEE International Conference on 3D System Integration, 2010

2009

10 µm fine pitch Cu/Sn micro-bumps for 3-D super-chip stack.

Yuki Ohara, Akihiro Noriki, Katsuyuki Sakuma, Kang Wook Lee, Mariappan Murugesan, Jichoel Bea, Fumiaki Yamada, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

Proceedings of the IEEE International Conference on 3D System Integration, 2009

Heterogeneous integration technology for MEMS-LSI multi-chip module.

Kang Wook Lee, Shigeyuki Kanno, Yuki Ohara, Kouji Kiyoyama, Ji Chel Bea, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

Proceedings of the IEEE International Conference on 3D System Integration, 2009

A parallel ADC for high-speed CMOS image processing system with 3D structure.

Kouji Kiyoyama, Yuki Ohara, Kang Wook Lee, Y. Yang, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

Proceedings of the IEEE International Conference on 3D System Integration, 2009

3D integration technology for 3D stacked retinal chip.

Yoshiyuki Kaiho, Yuki Ohara, Hirotaka Takeshita, Kouji Kiyoyama, Kang Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi

Proceedings of the IEEE International Conference on 3D System Integration, 2009

Micro-Raman spectroscopy analysis and capacitance - time (C-t) measurement of thinned silicon substrates for 3D integration.

Ji Chel Bea, Mariappan Murugesan, Yuki Ohara, Akihiro Noriki, Hisashi Kino, Kang Wook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

Proceedings of the IEEE International Conference on 3D System Integration, 2009

2000

Smart Vision Chip Fabricated Using Three Dimensional Integration Technology.

Hiroyuki Kurino, Masaki Nakagawa, Kang Wook Lee, Tomonori Nakamura, Yuusuke Yamada, Ki Tae Park, Mitsumasa Koyanagi

Proceedings of the Advances in Neural Information Processing Systems 13, 2000

1998

Future system-on-silicon LSI chips.

Mitsumasa Koyanagi, Hiroyuki Kurino, Kang Wook Lee, Katsuyuki Sakuma, Nobuaki Miyakawa, Hikotaro Itani

IEEE Micro, 1998