Jincheng Zhang

Orcid: 0000-0001-7332-6704

Affiliations:
  • Xidian University, School of Microelectronics, Xi'an, China
  • Xidian Guangzhou Research Institute, Guangzhou, China


According to our database1, Jincheng Zhang authored at least 31 papers between 2008 and 2026.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

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Book  In proceedings  Article  PhD thesis  Dataset  Other 

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Online presence:

On csauthors.net:

Bibliography

2026
Design and Optimization of Fractional-Turn Transformer With Low Core Loss and Profile.
IEEE Trans. Ind. Electron., June, 2026

Coordinated B diffusion Gaussian distribution AlGaN/GaN HEMT device by quasi-van der Waals epitaxy.
Sci. China Inf. Sci., 2026

First demonstration of heterogeneous integrated limiter chip with breakdown-enhanced GaN SBDs.
Sci. China Inf. Sci., 2026

2.5 kV/674 MW/cm2 or 100 A/2 kV β-Ga2O3 heterojunction diodes with large surge current and small recovery time.
Sci. China Inf. Sci., 2026

2025
Symmetrical GaN-Based Vertical Module With Low Interference Integration and High Thermal Performance for PoL Converters.
IEEE Trans. Ind. Electron., December, 2025

1.56 kV/30 A vertical β-Ga2O3 Schottky barrier diodes with composite edge terminations.
Sci. China Inf. Sci., 2025

2024
A 12V-to-1V Outphase-Interleaved SC Hybrid Converter With Enhanced Inductor De-Energizing Slew Rate and Adaptive Deadtime Control.
IEEE Trans. Circuits Syst. II Express Briefs, May, 2024

Two-dimensional materials for future information technology: status and prospects.
Sci. China Inf. Sci., 2024

High-Al-composition AlGaN/GaN MISHEMT on Si with fT of 320 GHz.
Sci. China Inf. Sci., 2024

Current collapse suppressed GaN diodes with 38 Watts high RF power rectifier capability.
Sci. China Inf. Sci., 2024

Cascade and Extensible In-Memory Arithmetic Computing in 2T1R ReRAM Arrays Using Time-Sum-Logic Design.
IEEE Access, 2024

71 GHz-fmax β-Ga2O3-on-SiC RF Power MOSFETs with Record Pout=3.1 W/mm and PAE=50.8% at 2 GHz, Pout= 2.3 W/mm at 4 GHz, and Low Microwave Noise Figure.
Proceedings of the IEEE Symposium on VLSI Technology and Circuits 2024, 2024

$\beta$-Ga2O3-on-SiC RF MOSFETs $\beta$.
Proceedings of the IEEE Region 10 Conference, 2024

2023
2.29-kV GaN-based double-channel Schottky barrier diodes on Si substrates with high VON uniformity.
Sci. China Inf. Sci., June, 2023

1.7 kV normally-off p-GaN gate high-electron-mobility transistors on a semi-insulating SiC substrate.
Sci. China Inf. Sci., February, 2023

Ga2O3 Heterojunction PN Diodes with Suppressed Background Carrier Concentration for Improved Breakdown Voltage.
Proceedings of the Device Research Conference, 2023

2022
Design and simulation of reverse-blocking Schottky-drain AlN/AlGaN HEMTs with drain field plate.
Sci. China Inf. Sci., 2022

Investigation of heavy ion irradiation effects on 650-V p-GaN normally-off HEMTs.
Sci. China Inf. Sci., 2022

Unidirectional p-GaN gate HEMT with composite source-drain field plates.
Sci. China Inf. Sci., 2022

Controlling Memristance and Negative Differential Resistance in Point-Contacted Metal-Oxides-Metal Heterojunctions: Role of Oxygen Vacancy Electromigration and Electron Hopping.
Adv. Intell. Syst., 2022

2021
Recent progress of integrated circuits and optoelectronic chips.
Sci. China Inf. Sci., 2021

All-Inorganic Two-Dimensional Ruddlesden-Popper Perovskite Cs2PbI2Cl2 Nanosheet Films for Self-Powered, Visible-Blind UV Photodetectors.
Proceedings of the 14th IEEE International Conference on ASIC, 2021

2020
Lateral GaN Schottky Barrier Diode for Wireless High-Power Transfer Application With High RF/DC Conversion Efficiency: From Circuit Construction and Device Technologies to System Demonstration.
IEEE Trans. Ind. Electron., 2020

Normally-Off Hydrogen-Terminated Diamond Field Effect Transistor With Ferroelectric HfZrO<sub>x</sub>/Al<sub>2</sub>O<sub>3</sub> Gate Dielectrics.
IEEE Access, 2020

Low On-Resistance H-Diamond MOSFETs With 300 °C ALD-Al<sub>2</sub>O<sub>3</sub> Gate Dielectric.
IEEE Access, 2020

Comprehensive Design of Device Parameters for GaN Vertical Trench MOSFETs.
IEEE Access, 2020

Evolution of Defect in AlGaN-based Deep Ultraviolet Light Emitting Diodes During Electrical Stress.
Proceedings of the 2020 IEEE International Reliability Physics Symposium, 2020

2015
AlGaN channel MIS-HEMTs with a very high breakdown electric field and excellent high-temperature performance.
IEICE Electron. Express, 2015

2014
Reliability investigation of AlGaN/GaN high electron mobility transistors under reverse-bias stress.
Microelectron. Reliab., 2014

2010
Finite element analysis and optimization of temperature field in GaN-MOCVD reactor.
Sci. China Inf. Sci., 2010

2008
The mobility of two-dimensional electron gas in AlGaN/GaN heterostructures with varied Al content.
Sci. China Ser. F Inf. Sci., 2008


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