Paul S. Andry

According to our database, Paul S. Andry authored at least 10 papers between 2005 and 2015.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2015

An 82%-efficient multiphase voltage-regulator 3D interposer with on-chip magnetic inductors.

Kevin Tien, Noah Sturcken, Naigang Wang, Jae-Woong Nah, Bing Dang, Eugene J. O'Sullivan, Paul S. Andry, Michele Petracca, Luca P. Carloni, William J. Gallagher, Kenneth L. Shepard

Proceedings of the Symposium on VLSI Circuits, 2015

2012

An 8x 10-Gb/s Source-Synchronous I/O System Based on High-Density Silicon Carrier Interconnects.

Timothy O. Dickson, Yong Liu, Sergey V. Rylov, Bing Dang, Cornelia K. Tsang, Paul S. Andry, John F. Bulzacchelli, Herschel A. Ainspan, Xiaoxiong Gu, Lavanya Turlapati, Michael P. Beakes, Benjamin D. Parker, John U. Knickerbocker, Daniel J. Friedman

IEEE J. Solid State Circuits, 2012

2008

3D chip-stacking technology with through-silicon vias and low-volume lead-free interconnections.

Katsuyuki Sakuma, Paul S. Andry, Cornelia K. Tsang, Steven L. Wright, Bing Dang, Chirag S. Patel, Bucknell C. Webb, J. Maria, Edmund J. Sprogis, S. K. Kang, Robert J. Polastre, Raymond R. Horton, John U. Knickerbocker

IBM J. Res. Dev., 2008

Three-dimensional silicon integration.

John U. Knickerbocker, Paul S. Andry, Bing Dang, Raymond R. Horton, Mario J. Interrante, Chirag S. Patel, Robert J. Polastre, Katsuyuki Sakuma, Ranjani Sirdeshmukh, Edmund J. Sprogis, Sri M. Sri-Jayantha, Antonio M. Stephens, Anna W. Topol, Cornelia K. Tsang, Bucknell C. Webb, Steven L. Wright

IBM J. Res. Dev., 2008

3D chip stacking with C4 technology.

Bing Dang, Steven L. Wright, Paul S. Andry, Edmund J. Sprogis, Cornelia K. Tsang, M. John Interrante, Bucknell C. Webb, Robert J. Polastre, Raymond R. Horton, Chirag S. Patel, Arun Sharma, J. Zheng, Katsuyuki Sakuma, John U. Knickerbocker

IBM J. Res. Dev., 2008

Fabrication and characterization of robust through-silicon vias for silicon-carrier applications.

Paul S. Andry, Cornelia K. Tsang, Bucknell C. Webb, Edmund J. Sprogis, Steven L. Wright, Bing Dang, Dennis G. Manzer

IBM J. Res. Dev., 2008

2007

Interconnects in the Third Dimension: Design Challenges for 3D ICs.

Kerry Bernstein, Paul S. Andry, Jerome Cann, Philip G. Emma, David Greenberg, Wilfried Haensch, Mike Ignatowski, Steven J. Koester, John Magerlein, Ruchir Puri, Albert M. Young

Proceedings of the 44th Design Automation Conference, 2007

2006

3-D Silicon Integration and Silicon Packaging Technology Using Silicon Through-Vias.

John U. Knickerbocker, Chirag S. Patel, Paul S. Andry, Cornelia K. Tsang, L. Paivikki Buchwalter, Edmund J. Sprogis, Hua Gan, Raymond R. Horton, Robert J. Polastre, Steven L. Wright, John M. Cotte

IEEE J. Solid State Circuits, 2006

2005

Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection.

John U. Knickerbocker, Paul S. Andry, L. Paivikki Buchwalter, Alina Deutsch, Raymond R. Horton, Keith A. Jenkins, Young Hoon Kwark, Gerald McVicker, Chirag S. Patel, Robert J. Polastre, Christian D. Schuster, Arun Sharma, Sri M. Sri-Jayantha, Christopher W. Surovic, Cornelia K. Tsang, Bucknell C. Webb, Steven L. Wright, Samuel R. McKnight, Edmund J. Sprogis, Bing Dang

IBM J. Res. Dev., 2005

Three dimensional silicon integration using fine pitch interconnection, silicon processing and silicon carrier packaging technology.

John U. Knickerbocker, Chirag S. Patel, Paul S. Andry, Cornelia K. Tsang, L. Paivikki Buchwalter, Edmund J. Sprogis, Hua Gan, Raymond R. Horton, Robert J. Polastre, Steven L. Wright, Christian D. Schuster, Christian W. Baks, Fuad E. Doany, Joanna Rosner, Steven Cordes

Proceedings of the IEEE 2005 Custom Integrated Circuits Conference, 2005