Vidya A. Chhabria

CoRR, April, 2026

Evaluating Computing Platforms for Sustainability: A Comparative Analysis of FPGAs against ASICs, GPUs, and CPUs.

[BibT_eX]

[DOI]

CoRR, April, 2026

CHICO-Agent: An LLM Agent for the Cross-layer Optimization of 2.5D and 3D Chiplet-based Systems.

[BibT_eX]

[DOI]

Qihang Wu

CoRR, April, 2026

Understanding Inference-Time Token Allocation and Coverage Limits in Agentic Hardware Verification.

[BibT_eX]

[DOI]

Vihaan Patel

CoRR, April, 2026

Spec2Cov: An Agentic Framework for Code Coverage Closure of Digital Hardware Designs.

[BibT_eX]

[DOI]

CoRR, April, 2026

CarbonPATH: Carbon-aware pathfinding and architecture optimization for chiplet-based AI systems.

[BibT_eX]

[DOI]

Jiajun Hu

CoRR, March, 2026

Hybrid GCN-CNN Framework for Fast Timing-Driven Layer Assignment in Global Routing.

[BibT_eX]

[DOI]

Sai Harika Julakanti

Proceedings of the 27th International Symposium on Quality Electronic Design, 2026

Toward Sustainable Computing with FPGAs and Chiplets.

[BibT_eX]

[DOI]

Proceedings of the 16th ACM International Green and Sustainable Computing Conference, 2026

Focus Session: Large Language Models in Physical Design: From Data Generation to Intelligent Agents.

[BibT_eX]

[DOI]

Proceedings of the Design, Automation & Test in Europe Conference, 2026

MIMIC: Machine Intelligence for Scalable Generation of Synthetic Timing Cone Datasets.

[BibT_eX]

[DOI]

Ajay Yadav

Vinodh Kumar Ramasamy

Proceedings of the 31st Asia and South Pacific Design Automation Conference, 2026

DALI-PD: Diffusion-based Synthetic Layout Heatmap Generation for ML in Physical Design.

[BibT_eX]

[DOI]

Proceedings of the 31st Asia and South Pacific Design Automation Conference, 2026

2025

LUNA: LUT-Based Neural Architecture for Fast and Low-Cost Qubit Readout.

[BibT_eX]

[DOI]

CoRR, December, 2025

HISIM: Analytical Performance Modeling and Design Space Exploration of 2.5D/3D Integration for AI Computing.

[BibT_eX]

[DOI]

Zhenyu Wang

Pragnya Sudershan Nalla

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., August, 2025

An Analytical Solution for Transient Electromigration Stress in Multisegment Straight-line Interconnects Based on a Stress-wave Model.

[BibT_eX]

[DOI]

Nestoras E. Evmorfopoulos

ACM Trans. Design Autom. Electr. Syst., July, 2025

CarbonSet: A Dataset to Analyze Trends and Benchmark the Sustainability of CPUs and GPUs.

[BibT_eX]

[DOI]

Jiajun Hu

CoRR, June, 2025

Invited Paper: MLCAD 2025 Contest on ReSynthAI: Physical-aware Logic Resynthesis using AI.

[BibT_eX]

[DOI]

Proceedings of the 7th ACM/IEEE Symposium on Machine Learning for CAD, 2025

Invited: Toward an ML EDA Commons: Establishing Standards, Accessibility, and Reproducibility in ML-driven EDA Research.

[BibT_eX]

[DOI]

Proceedings of the 2025 International Symposium on Physical Design, 2025

Toward Lifelong-Sustainable Electronic-Photonic AI Systems via Extreme Efficiency, Reconfigurability, and Robustness.

[BibT_eX]

[DOI]

Ziang Yin

Hongjian Zhou

Jiaqi Gu

Proceedings of the 43rd IEEE International Conference on Computer Design, 2025

Adaptive Graph Learning for Efficient Thermal Analysis of Multi-Stacking Chiplet Systems under Interface Variations.

[BibT_eX]

[DOI]

Proceedings of the IEEE/ACM International Conference On Computer Aided Design, 2025

Invited: IEEE DATC RDF-2025: Enabling an EDA Research Ecosystem.

[BibT_eX]

[DOI]

Amur Ghose

Proceedings of the IEEE/ACM International Conference On Computer Aided Design, 2025

CarbonSet: A Dataset to Analyze Trends and Benchmark the Sustainability of CPUs and GPUs.

[BibT_eX]

[DOI]

Jiajun Hu

Maxwell Clifford

Chetal Choppali Sudarshan

Proceedings of the Great Lakes Symposium on VLSI 2025, GLSVLSI 2025, New Orleans, LA, USA, 30 June 2025, 2025

Invited: EDA for Heterogeneous Integration.

[BibT_eX]

[DOI]

Emad Haque

Pragnya Sudershan Nalla

Proceedings of the 62nd ACM/IEEE Design Automation Conference, 2025

2024

A Machine Learning Approach to Improving Timing Consistency between Global Route and Detailed Route.

[BibT_eX]

[DOI]

ACM Trans. Design Autom. Electr. Syst., January, 2024

EDA Corpus: A Large Language Model Dataset for Enhanced Interaction with OpenROAD.

[BibT_eX]

[DOI]

Sai Rahul Dhanvi Kankipati

Utsav Sharma

Ajay Yadav

Bintu Kappil George

Sai Ritish Guntupalli

Austin Rovinski

CoRR, 2024

OpenROAD and CircuitOps: Infrastructure for ML EDA Research and Education.

[BibT_eX]

[DOI]

Proceedings of the 42nd IEEE VLSI Test Symposium, 2024

OpenROAD-Assistant: An Open-Source Large Language Model for Physical Design Tasks.

[BibT_eX]

[DOI]

Utsav Sharma

Sai Rahul Dhanvi Kankipati

Austin Rovinski

Proceedings of the 2024 ACM/IEEE International Symposium on Machine Learning for CAD, 2024

IR-Aware ECO Timing Optimization Using Reinforcement Learning.

[BibT_eX]

[DOI]

Wenjing Jiang

Proceedings of the 2024 ACM/IEEE International Symposium on Machine Learning for CAD, 2024

ML-INSIGHT: Machine Learning for Inrush Current Prediction and Power Switch Network Improvement.

[BibT_eX]

[DOI]

Vidya Ashok Chhabria

Proceedings of the 29th ACM/IEEE International Symposium on Low Power Electronics and Design, 2024

2024 ICCAD CAD Contest Problem C: Scalable Logic Gate Sizing Using ML Techniques and GPU Acceleration.

[BibT_eX]

[DOI]

Proceedings of the 43rd IEEE/ACM International Conference on Computer-Aided Design, 2024

Analyzing the Impact of FinFET Self-Heating on the Performance of RF Power Amplifiers.

[BibT_eX]

[DOI]

Proceedings of the 43rd IEEE/ACM International Conference on Computer-Aided Design, 2024

Generative Methods in EDA: Innovations in Dataset Generation and EDA Tool Assistants.

[BibT_eX]

[DOI]

Proceedings of the 43rd IEEE/ACM International Conference on Computer-Aided Design, 2024

Strengthening the Foundations for IC Physical Design and ML EDA Research.

[BibT_eX]

[DOI]

Proceedings of the 43rd IEEE/ACM International Conference on Computer-Aided Design, 2024

ECO-CHIP: Estimation of Carbon Footprint of Chiplet-based Architectures for Sustainable VLSI.

[BibT_eX]

[DOI]

Proceedings of the IEEE International Symposium on High-Performance Computer Architecture, 2024

Beyond the Surface: The Necessity for Detailed Metrics in Corporate Sustainability Reports.

[BibT_eX]

[DOI]

Proceedings of the 15th IEEE International Green and Sustainable Computing Conference, 2024

GreenFPGA: Evaluating FPGAs as Environmentally Sustainable Computing Solutions.

[BibT_eX]

[DOI]

Proceedings of the 61st ACM/IEEE Design Automation Conference, 2024

Exploiting 2.5D/3D Heterogeneous Integration for AI Computing.

[BibT_eX]

[DOI]

Proceedings of the 29th Asia and South Pacific Design Automation Conference, 2024

2023

Encoder-Decoder Networks for Analyzing Thermal and Power Delivery Networks.

[BibT_eX]

[DOI]

ACM Trans. Design Autom. Electr. Syst., January, 2023

Towards Sustainable Computing: Assessing the Carbon Footprint of Heterogeneous Systems.

[BibT_eX]

[DOI]

Sarma B. K. Vrudhula

CoRR, 2023

Analysis of Pattern-dependent Rapid Thermal Annealing Effects on SRAM Design.

[BibT_eX]

[DOI]

Proceedings of the 24th International Symposium on Quality Electronic Design, 2023

Recent Progress in the Analysis of Electromigration and Stress Migration in Large Multisegment Interconnects.

[BibT_eX]

[DOI]

Nestor E. Evmorfopoulos

Proceedings of the 2023 International Symposium on Physical Design, 2023

Frequency-Domain Transient Electromigration Analysis Using Circuit Theory.

[BibT_eX]

[DOI]

Nestoras E. Evmorfopoulos

Gana Surya Prakash Kadagala

Proceedings of the IEEE/ACM International Conference on Computer Aided Design, 2023

Invited Paper: CircuitOps: An ML Infrastructure Enabling Generative AI for VLSI Circuit Optimization.

[BibT_eX]

[DOI]

Proceedings of the IEEE/ACM International Conference on Computer Aided Design, 2023

Invited Paper: 2023 ICCAD CAD Contest Problem C: Static IR Drop Estimation Using Machine Learning.

[BibT_eX]

[DOI]

Proceedings of the IEEE/ACM International Conference on Computer Aided Design, 2023

Benchmarking Heterogeneous Integration with 2.5D/3D Interconnect Modeling.

[BibT_eX]

[DOI]

Proceedings of the 15th IEEE International Conference on ASIC, 2023

2022

OpeNPDN: A Neural-Network-Based Framework for Power Delivery Network Synthesis.

[BibT_eX]

[DOI]

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2022

XT-PRAGGMA: Crosstalk Pessimism Reduction Achieved with GPU Gate-level Simulations and Machine Learning.

[BibT_eX]

[DOI]

Proceedings of the 2022 ACM/IEEE Workshop on Machine Learning for CAD, 2022

From Global Route to Detailed Route: ML for Fast and Accurate Wire Parasitics and Timing Prediction.

[BibT_eX]

[DOI]

Proceedings of the 2022 ACM/IEEE Workshop on Machine Learning for CAD, 2022

2021

A Linear-Time Algorithm for Steady-State Analysis of Electromigration in General Interconnects.

[BibT_eX]

[DOI]

CoRR, 2021

Analytical Modeling of Transient Electromigration Stress based on Boundary Reflections.

[BibT_eX]

[DOI]

Nestor E. Evmorfopoulos

Proceedings of the IEEE/ACM International Conference On Computer Aided Design, 2021

BeGAN: Power Grid Benchmark Generation Using a Process-portable GAN-based Methodology.

[BibT_eX]

[DOI]

Proceedings of the IEEE/ACM International Conference On Computer Aided Design, 2021

MAVIREC: ML-Aided Vectored IR-Drop Estimation and Classification.

[BibT_eX]

[DOI]

Proceedings of the Design, Automation & Test in Europe Conference & Exhibition, 2021

A New, Computationally Efficient "Blech Criterion" for Immortality in General Interconnects.

[BibT_eX]

[DOI]

Proceedings of the 58th ACM/IEEE Design Automation Conference, 2021

Thermal and IR Drop Analysis Using Convolutional Encoder-Decoder Networks.

[BibT_eX]

[DOI]

Proceedings of the ASPDAC '21: 26th Asia and South Pacific Design Automation Conference, 2021

2020

MAVIREC: ML-Aided Vectored IR-DropEstimation and Classification.

[BibT_eX]

[DOI]

CoRR, 2020

Template-based PDN Synthesis in Floorplan and Placement Using Classifier and CNN Techniques.

[BibT_eX]

[DOI]

Proceedings of the 25th Asia and South Pacific Design Automation Conference, 2020

2019

Impact of Self-heating on Performance and Reliability in FinFET and GAAFET Designs.

[BibT_eX]

[DOI]