X. Federspiel

According to our database1, X. Federspiel authored at least 38 papers between 2006 and 2023.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

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On csauthors.net:

Bibliography

2023
Characterization and modeling of DCR and DCR drift variability in SPADs.
Proceedings of the IEEE International Reliability Physics Symposium, 2023

Integrated Test Circuit for Off-State Dynamic Drain Stress Evaluation.
Proceedings of the IEEE International Reliability Physics Symposium, 2023

Location of Oxide Breakdown Events under Off-state TDDB in 28nm N-MOSFETs dedicated to RF applications.
Proceedings of the IEEE International Reliability Physics Symposium, 2023

Effect of Frequency on Reliability Of High-K MIM Capacitors.
Proceedings of the IEEE International Reliability Physics Symposium, 2023

Insight Into HCI Reliability on I/O Nitrided Devices.
Proceedings of the IEEE International Reliability Physics Symposium, 2023

2022
New Modelling Off-state TDDB for 130nm to 28nm CMOS nodes.
Proceedings of the IEEE International Reliability Physics Symposium, 2022

Frequency dependant gate oxide TDDB model.
Proceedings of the IEEE International Reliability Physics Symposium, 2022

2021
BTI Arbitrary Stress Patterns Characterization & Machine-Learning optimized CET Maps Simulations.
Proceedings of the IEEE International Reliability Physics Symposium, 2021

Analysis of the interactions of HCD under "On" and "Off" state modes for 28nm FDSOI AC RF modelling.
Proceedings of the IEEE International Reliability Physics Symposium, 2021

HCI Temperature sense effect from 180nm to 28nm nodes.
Proceedings of the IEEE International Reliability Physics Symposium, 2021

Monitoring Setup and Hold Timing Limits.
Proceedings of the IEEE International Reliability Physics Symposium, 2021

2020
Comparison of variability of HCI induced drift for SiON and HKMG devices.
Proceedings of the 2020 IEEE International Reliability Physics Symposium, 2020

Hot-Carrier induced Breakdown events from Off to On mode in NEDMOS.
Proceedings of the 2020 IEEE International Reliability Physics Symposium, 2020

2019
Impact of Passive & Active Load Gate Impedance on Breakdown Hardness in 28nm FDSOI Technology.
Proceedings of the IEEE International Reliability Physics Symposium, 2019

Process Optimization for HCI Improvement in I/O Analog Devices.
Proceedings of the IEEE International Reliability Physics Symposium, 2019

Investigation of NBTI Dynamic Behavior with Ultra-Fast Measurement.
Proceedings of the IEEE International Reliability Physics Symposium, 2019

Global and Local Process Variation Simulations in Design for Reliability approach.
Proceedings of the 25th IEEE International Symposium on On-Line Testing and Robust System Design, 2019

2018
New NBTI models for degradation and relaxation kinetics valid over extended temperature and stress/recovery ranges.
Microelectron. Reliab., 2018

Characterization and modeling of dynamic variability induced by BTI in nano-scaled transistors.
Microelectron. Reliab., 2018

AC TDDB extensive study for an enlargement of its impact and benefit on circuit lifetime assessment.
Proceedings of the IEEE International Reliability Physics Symposium, 2018

Performance & reliability of 3D architectures (πfet, Finfet, Ωfet).
Proceedings of the IEEE International Reliability Physics Symposium, 2018

Key parameters driving transistor degradation in advanced strained SiGe channels.
Proceedings of the IEEE International Reliability Physics Symposium, 2018

A new method for quickly evaluating reversible and permanent components of the BTI degradation.
Proceedings of the IEEE International Reliability Physics Symposium, 2018

Modeling self-heating effects in advanced CMOS nodes.
Proceedings of the IEEE International Reliability Physics Symposium, 2018

Integrated Test Structures for Reliability Investigation under Dynamic Stimuli.
Proceedings of the 24th IEEE International Symposium on On-Line Testing And Robust System Design, 2018

2017
Characterization of Low Drop-Out during ageing and design for yield.
Microelectron. Reliab., 2017


2016
Performance vs. reliability adaptive body bias scheme in 28 nm & 14 nm UTBB FDSOI nodes.
Microelectron. Reliab., 2016

Potentiality of healing techniques in hot-carrier damaged 28 nm FDSOI CMOS nodes.
Microelectron. Reliab., 2016

Hot-carrier and BTI damage distinction for high performance digital application in 28nm FDSOI and 28nm LP CMOS nodes.
Proceedings of the 22nd IEEE International Symposium on On-Line Testing and Robust System Design, 2016

2015
28nm UTBB FDSOI product reliability/performance trade-off optimization through body bias operation.
Proceedings of the IEEE International Reliability Physics Symposium, 2015

Physical understanding of low frequency degradation of NMOS TDDB in High-k metal gate stack-based technology. Implication on lifetime assessment.
Proceedings of the IEEE International Reliability Physics Symposium, 2015

Performance and reliability of strained SOI transistors for advanced planar FDSOI technology.
Proceedings of the IEEE International Reliability Physics Symposium, 2015

Extended TDDB power-law validation for high-voltage applications such as OTP memories in High-k CMOS 28nm FDSOI technology.
Proceedings of the IEEE International Reliability Physics Symposium, 2015

Digital circuits reliability with in-situ monitors in 28nm fully depleted SOI.
Proceedings of the 2015 Design, Automation & Test in Europe Conference & Exhibition, 2015

2012
Microscopic scale characterization and modeling of transistor degradation under HC stress.
Microelectron. Reliab., 2012

2007
FEM-based method to determine mechanical stress evolution during process flow in microelectronics, application to stress-voiding.
Microelectron. Reliab., 2007

2006
Electron BackScattered Diffraction (EBSD) use and applications in newest technologies development.
Microelectron. Reliab., 2006


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