Ioannis A. Papistas

According to our database, Ioannis A. Papistas authored at least 17 papers between 2015 and 2024.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2024

11.3 Metis AIPU: A 12nm 15TOPS/W 209.6TOPS SoC for Cost- and Energy-Efficient Inference at the Edge.

Pascal Alexander Hager, Bert Moons, Stefan Cosemans, Ioannis A. Papistas, Bram Rooseleer, Jeroen Van Loon, Roel Uytterhoeven, Florian Zaruba, Spyridoula Koumousi, Milos Stanisavljevic, Stefan Mach, Sebastiaan Mutsaards, Riduan Khaddam Aljameh, Gua Hao Khov, Brecht Machiels, Cristian Olar, Anastasios Psarras, Sander Geursen, Jeroen Vermeeren, Yi Lu, Abhishek Maringanti, Deepak Ameta, Leonidas Katselas, Noah Hütter, Manuel Schmuck, Swetha Sivadas, Karishma Sharma, Manuel Oliveira, Ramon Aerne, Nitish Sharma, Timir Soni, Beatrice Bussolino, Djordje Pesut, Michele Pallaro, Andrei Podlesnii, Alexios Lyrakis, Yannick Ruffiner, Martino Dazzi, Johannes Thiele, Koen Goetschalckx, Nazareno Bruschi, Jonas Doevenspeck, Bram Verhoef, Stefan Linz, Giuseppe Garcea, Jonathan Ferguson, Ioannis Koltsidas, Evangelos Eleftheriou

Proceedings of the IEEE International Solid-State Circuits Conference, 2024

2023

DIANA: An End-to-End Hybrid DIgital and ANAlog Neural Network SoC for the Edge.

Pouya Houshmand, Giuseppe Maria Sarda, Vikram Jain, Kodai Ueyoshi, Ioannis A. Papistas, Man Shi, Qilin Zheng, Debjyoti Bhattacharjee, Arindam Mallik, Peter Debacker, Diederik Verkest, Marian Verhelst

IEEE J. Solid State Circuits, 2023

2022

Dynamic Quantization Range Control for Analog-in-Memory Neural Networks Acceleration.

Nathan Laubeuf, Jonas Doevenspeck, Ioannis A. Papistas, Michele Caselli, Stefan Cosemans, Peter Vrancx, Debjyoti Bhattacharjee, Arindam Mallik, Peter Debacker, Diederik Verkest, Francky Catthoor, Rudy Lauwereins

ACM Trans. Design Autom. Electr. Syst., 2022

DIANA: An End-to-End Energy-Efficient Digital and ANAlog Hybrid Neural Network SoC.

Kodai Ueyoshi, Ioannis A. Papistas, Pouya Houshmand, Giuseppe Maria Sarda, Vikram Jain, Man Shi, Qilin Zheng, Juan Sebastian Piedrahita Giraldo, Peter Vrancx, Jonas Doevenspeck, Debjyoti Bhattacharjee, Stefan Cosemans, Arindam Mallik, Peter Debacker, Diederik Verkest, Marian Verhelst

Proceedings of the IEEE International Solid-State Circuits Conference, 2022

2021

Charge Sharing and Charge Injection A/D Converters for Analog In-Memory Computing.

Michele Caselli, Ioannis A. Papistas, Stefan Cosemans, Arindam Mallik, Peter Debacker, Diederik Verkest

Proceedings of the 19th IEEE International New Circuits and Systems Conference, 2021

Design-Technology Space Exploration for Energy Efficient AiMC-Based Inference Acceleration.

Debjyoti Bhattacharjee, Nathan Laubeuf, Stefan Cosemans, Ioannis A. Papistas, Arindam Mallik, Peter Debacker, Myung Hee Na, Diederik Verkest

Proceedings of the IEEE International Symposium on Circuits and Systems, 2021

A 22 nm, 1540 TOP/s/W, 12.1 TOP/s/mm² in-Memory Analog Matrix-Vector-Multiplier for DNN Acceleration.

Ioannis A. Papistas, Stefan Cosemans, Bram Rooseleer, Jonas Doevenspeck, Myung Hee Na, Arindam Mallik, Peter Debacker, Diederik Verkest

Proceedings of the IEEE Custom Integrated Circuits Conference, 2021

2020

Cost Modeling and Analysis of TSV and Contactless 3D-ICs.

Minmin Jiang, Ioannis A. Papistas, Vasilis F. Pavlidis

Proceedings of the GLSVLSI '20: Great Lakes Symposium on VLSI 2020, 2020

2019

Fabrication Cost Analysis for Contactless 3-D ICs.

Ioannis A. Papistas, Vasilis F. Pavlidis, Dimitrios Velenis

IEEE Trans. Circuits Syst. II Express Briefs, 2019

FQ-Conv: Fully Quantized Convolution for Efficient and Accurate Inference.

Bram-Ernst Verhoef, Nathan Laubeuf, Stefan Cosemans, Peter Debacker, Ioannis A. Papistas, Arindam Mallik, Diederik Verkest

CoRR, 2019

2018

Design methodologies for heterogeneous 3-D integrated systems.

Ioannis A. Papistas

PhD thesis, 2018

Efficient Modeling of Crosstalk Noise on Power Distribution Networks for Contactless 3-D ICs.

Ioannis A. Papistas, Vasilis F. Pavlidis

IEEE Trans. Circuits Syst. I Regul. Pap., 2018

Contactless Heterogeneous 3-D ICs for Smart Sensing Systems.

Ioannis A. Papistas, Vasilis F. Pavlidis

Integr., 2018

2017

Contactless inter-tier communication for heterogeneous 3-D ICs.

Ioannis A. Papistas, Vasilis F. Pavlidis

Proceedings of the IEEE International Symposium on Circuits and Systems, 2017

2016

Crosstalk noise effects of on-chip inductive links on power delivery networks.

Ioannis A. Papistas, Vasilis F. Pavlidis

Proceedings of the IEEE International Symposium on Circuits and Systems, 2016

Inter-Tier Crosstalk Noise On Power Delivery Networks For 3-D ICs With Inductively-Coupled Interconnects.

Ioannis A. Papistas, Vasilis F. Pavlidis

Proceedings of the 26th edition on Great Lakes Symposium on VLSI, 2016

2015

Bandwidth-to-area comparison of through silicon vias and inductive links for 3-D ICs.

Ioannis A. Papistas, Vasilis F. Pavlidis

Proceedings of the European Conference on Circuit Theory and Design, 2015