Dieter Claes

According to our database, Dieter Claes authored at least 5 papers between 2019 and 2022.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2022

Trap-polarization interaction during low-field trap characterization on hafnia-based ferroelectric gatestacks.

Brecht Truijen, Barry J. O'Sullivan, Md. Nurul Alam, Dieter Claes, M. Thesberg, Philippe Roussel, Adrian Vaisman Chasin, Geert Van den Bosch, Ben Kaczer, Jan Van Houdt

Proceedings of the IEEE International Reliability Physics Symposium, 2022

2021

Reliability and Variability-Aware DTCO Flow: Demonstration of Projections to N3 FinFET and Nanosheet Technologies.

Gerhard Rzepa, Markus Karner, Oskar Baumgartner, Georg Strof, Franz Schanovsky, Ferdinand Mitterbauer, Christian Kernstock, Hui-Wen Karner, Pieter Weckx, Geert Hellings, Dieter Claes, Zhicheng Wu, Yang Xiang, Thomas Chiarella, Bertrand Parvais, Jérôme Mitard, Jacopo Franco, Ben Kaczer, Dimitri Linten, Zlatan Stanojevic

Proceedings of the IEEE International Reliability Physics Symposium, 2021

Novel low thermal budget gate stack solutions for BTI reliability in future Logic Device technologies : Invited paper.

Jacopo Franco, Hiroaki Arimura, J.-F. de Marneffe, A. Vandooren, L.-Å. Ragnarsson, Zhicheng Wu, Dieter Claes, E. Dentoni Litta, N. Horiguchi, Kris Croes, Dimitri Linten, Tibor Grasser, Ben Kaczer

Proceedings of the International Conference on IC Design and Technology, 2021

2020

Quantum Mechanical Charge Trap Modeling to Explain BTI at Cryogenic Temperatures.

Jakob Michl, Alexander Grill, Dieter Claes, Gerhard Rzepa, Ben Kaczer, Dimitri Linten, Iuliana P. Radu, Tibor Grasser, Michael Waltl

Proceedings of the 2020 IEEE International Reliability Physics Symposium, 2020

2019

Accelerated Capture and Emission (ACE) Measurement Pattern for Efficient BTI Characterization and Modeling.

Zhicheng Wu, Jacopo Franco, Dieter Claes, Gerhard Rzepa, Philippe J. Roussel, Nadine Collaert, Guido Groeseneken, Dimitri Linten, Tibor Grasser, Ben Kaczer

Proceedings of the IEEE International Reliability Physics Symposium, 2019