Moritz Brunion
Orcid: 0000-0001-7842-7774
According to our database1,
Moritz Brunion
authored at least 8 papers
between 2021 and 2023.
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Bibliography
2023
IEEE Trans. Very Large Scale Integr. Syst., December, 2023
Proceedings of the 2023 International Symposium on Physical Design, 2023
Towards Chip-Package-System Co-optimization of Thermally-limited System-On-Chips (SOCs).
Proceedings of the IEEE International Reliability Physics Symposium, 2023
Proceedings of the IEEE International 3D Systems Integration Conference, 2023
2022
IEEE Trans. Very Large Scale Integr. Syst., 2022
Proceedings of the ISLPED '22: ACM/IEEE International Symposium on Low Power Electronics and Design, Boston, MA, USA, August 1, 2022
MemPool-3D: Boosting Performance and Efficiency of Shared-L1 Memory Many-Core Clusters with 3D Integration.
Proceedings of the 2022 Design, Automation & Test in Europe Conference & Exhibition, 2022
2021
Power, Performance, Area and Cost Analysis of Memory-on-Logic Face-to-Face Bonded 3D Processor Designs.
Proceedings of the IEEE/ACM International Symposium on Low Power Electronics and Design, 2021