David Roy

Affiliations:
  • STMicroelectronics, Crolles, France


According to our database1, David Roy authored at least 26 papers between 2001 and 2023.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of five.

Timeline

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Links

On csauthors.net:

Bibliography

2023
Characterization and modeling of DCR and DCR drift variability in SPADs.
Proceedings of the IEEE International Reliability Physics Symposium, 2023

Insight Into HCI Reliability on I/O Nitrided Devices.
Proceedings of the IEEE International Reliability Physics Symposium, 2023

Hot-Carrier Degradation modeling of DCR drift in SPADs.
Proceedings of the 53rd IEEE European Solid-State Device Research Conference, 2023

2022
Statistical measurements and Monte-Carlo simulations of DCR in SPADs.
Proceedings of the 48th IEEE European Solid State Circuits Conference, 2022

2021
BTI Arbitrary Stress Patterns Characterization & Machine-Learning optimized CET Maps Simulations.
Proceedings of the IEEE International Reliability Physics Symposium, 2021

Dark Count Rate in Single-Photon Avalanche Diodes: Characterization and Modeling study.
Proceedings of the 51st IEEE European Solid-State Device Research Conference, 2021

2019
Impact of Passive & Active Load Gate Impedance on Breakdown Hardness in 28nm FDSOI Technology.
Proceedings of the IEEE International Reliability Physics Symposium, 2019

Process Optimization for HCI Improvement in I/O Analog Devices.
Proceedings of the IEEE International Reliability Physics Symposium, 2019

2018
New NBTI models for degradation and relaxation kinetics valid over extended temperature and stress/recovery ranges.
Microelectron. Reliab., 2018

Performance & reliability of 3D architectures (πfet, Finfet, Ωfet).
Proceedings of the IEEE International Reliability Physics Symposium, 2018

2017
Physically-based evaluation of aging contributions in HC/FN-programmed 40 nm NOR Flash technology.
Microelectron. Reliab., 2017

2015
Physically-based extraction methodology for accurate MOSFET degradation assessment.
Microelectron. Reliab., 2015

Physical understanding of low frequency degradation of NMOS TDDB in High-k metal gate stack-based technology. Implication on lifetime assessment.
Proceedings of the IEEE International Reliability Physics Symposium, 2015

2012
Microscopic scale characterization and modeling of transistor degradation under HC stress.
Microelectron. Reliab., 2012

Reliability Characterization and Modeling Solution to Predict Aging of 40-nm MOSFET DC and RF Performances Induced by RF Stresses.
IEEE J. Solid State Circuits, 2012

2006
Designing in reliability in advanced CMOS technologies.
Microelectron. Reliab., 2006

2005
Evidence and modelling current dependence of defect generation probability and its impact on charge to breakdown.
Microelectron. Reliab., 2005

Multi-vibrational hydrogen release: Physical origin of T<sub>bd</sub>, Q<sub>bd</sub> power-law voltage dependence of oxide breakdown in ultra-thin gate oxides.
Microelectron. Reliab., 2005

2003
New insights into the change of voltage acceleration and temperature activation of oxide breakdown.
Microelectron. Reliab., 2003

On the role of holes in oxide breakdown mechanism in inverted nMOSFETs.
Microelectron. Reliab., 2003

2002
Series resistance and oxide thickness spread influence on Weibull breakdown distribution: New experimental correction for reliability projection improvement.
Microelectron. Reliab., 2002

Gate oxide Reliability assessment optimization.
Microelectron. Reliab., 2002

Validated 90nm CMOS Technology Platform with Low-k Copper Interconnects for Advanced System-on-Chip (SoC).
Proceedings of the 10th IEEE International Workshop on Memory Technology, 2002

2001
Determination of Dielectric Breakdown Weibull Distribution Parameters Confidence Bounds for Accurate Ultrathin Oxide Reliability Predictions.
Microelectron. Reliab., 2001

Body effect induced wear-out acceleration in ultra-thin oxides.
Microelectron. Reliab., 2001

Failures in ultrathin oxides: Stored energy or carrier energy driven?
Microelectron. Reliab., 2001


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