Alain Bravaix

Orcid: 0000-0002-2308-3537

According to our database1, Alain Bravaix authored at least 30 papers between 2001 and 2023.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

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Bibliography

2023
Location of Oxide Breakdown Events under Off-state TDDB in 28nm N-MOSFETs dedicated to RF applications.
Proceedings of the IEEE International Reliability Physics Symposium, 2023

2022
New Modelling Off-state TDDB for 130nm to 28nm CMOS nodes.
Proceedings of the IEEE International Reliability Physics Symposium, 2022

2021
Analysis of the interactions of HCD under "On" and "Off" state modes for 28nm FDSOI AC RF modelling.
Proceedings of the IEEE International Reliability Physics Symposium, 2021

2020
Hot-Carrier induced Breakdown events from Off to On mode in NEDMOS.
Proceedings of the 2020 IEEE International Reliability Physics Symposium, 2020

2019
Process Optimization for HCI Improvement in I/O Analog Devices.
Proceedings of the IEEE International Reliability Physics Symposium, 2019

2018
Resilient automotive products through process, temperature and aging compensation schemes.
Proceedings of the IEEE International Reliability Physics Symposium, 2018

Key parameters driving transistor degradation in advanced strained SiGe channels.
Proceedings of the IEEE International Reliability Physics Symposium, 2018

Managing electrical reliability in consumer systems for improved energy efficiency.
Proceedings of the IEEE International Reliability Physics Symposium, 2018

2017
Enabling robust automotive electronic components in advanced CMOS nodes.
Microelectron. Reliab., 2017

Cognitive approach to support dynamic aging compensation.
Proceedings of the IEEE International Test Conference, 2017

Dynamic aging compensation and Safety measures in Automotive environment.
Proceedings of the 23rd IEEE International Symposium on On-Line Testing and Robust System Design, 2017

2016
Performance vs. reliability adaptive body bias scheme in 28 nm & 14 nm UTBB FDSOI nodes.
Microelectron. Reliab., 2016

Potentiality of healing techniques in hot-carrier damaged 28 nm FDSOI CMOS nodes.
Microelectron. Reliab., 2016

Hot-carrier and BTI damage distinction for high performance digital application in 28nm FDSOI and 28nm LP CMOS nodes.
Proceedings of the 22nd IEEE International Symposium on On-Line Testing and Robust System Design, 2016

2015
Impact of gate oxide breakdown in logic gates from 28nm FDSOI CMOS technology.
Proceedings of the IEEE International Reliability Physics Symposium, 2015

Digital circuits reliability with in-situ monitors in 28nm fully depleted SOI.
Proceedings of the 2015 Design, Automation & Test in Europe Conference & Exhibition, 2015

2012
Microscopic scale characterization and modeling of transistor degradation under HC stress.
Microelectron. Reliab., 2012

2009
Analysis of deep submicron VLSI technological risks: A new qualification process for professional electronics.
Microelectron. Reliab., 2009

Reliability aspects of gate oxide under ESD pulse stress.
Microelectron. Reliab., 2009

2007
Degradation mechanism understanding of NLDEMOS SOI in RF applications.
Microelectron. Reliab., 2007

Design-In Reliability for 90-65nm CMOS Nodes Submitted to Hot-Carriers and NBTI Degradation.
Proceedings of the Integrated Circuit and System Design. Power and Timing Modeling, 2007

2006
Designing in reliability in advanced CMOS technologies.
Microelectron. Reliab., 2006

2005
Experimental extraction of degradation parameters after constant voltage stress and substrate hot electron injection on ultrathin oxides.
Microelectron. Reliab., 2005

Hot-carrier reliability of 20V MOS transistors in 0.13 mum CMOS technology.
Microelectron. Reliab., 2005

A thorough investigation of MOSFETs NBTI degradation.
Microelectron. Reliab., 2005

Impact of wafer charging on hot carrier reliability and optimization of latent damage detection methodology in advanced CMOS technologies.
Microelectron. Reliab., 2005

Impacts of the recovery phenomena on the worst-case of damage in DC/AC stressed ultra-thin NO gate-oxide MOSFETs.
Microelectron. Reliab., 2005

2004
Hole injection enhanced hot-carrier degradation in PMOSFETs used for systems on chip applications with 6.5-2 nm thick gate-oxides.
Microelectron. Reliab., 2004

2003
Carrier injection efficiency for the reliability study of 3.5-1.2 nm thick gate-oxide CMOS technologies.
Microelectron. Reliab., 2003

2001
Injection Mechanisms and Lifetime Prediction with the Substrate Voltage in 0.15mum Channel-Length N-MOSFETs.
Microelectron. Reliab., 2001


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