Wontae Kim
Affiliations:- Samsung Electronics, Hwasung, Korea
According to our database1,
Wontae Kim
authored at least 6 papers
between 2014 and 2025.
Collaborative distances:
Collaborative distances:
Timeline
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Bibliography
2025
30.1 A 28Gb/mm<sup>2</sup>4XX-Layer 1Tb 3b/Cell WF-Bonding 3D-NAND Flash with 5.6Gb/s/Pin IOs.
Proceedings of the IEEE International Solid-State Circuits Conference, 2025
2022
A 1Tb 3b/Cell 8th-Generation 3D-NAND Flash Memory with 164MB/s Write Throughput and a 2.4Gb/s Interface.
Proceedings of the IEEE International Solid-State Circuits Conference, 2022
2021
A 512Gb 3b/Cell 7<sup>th</sup> -Generation 3D-NAND Flash Memory with 184MB/s Write Throughput and 2.0Gb/s Interface.
Proceedings of the IEEE International Solid-State Circuits Conference, 2021
2019
A 512Gb 3-bit/Cell 3D 6<sup>th</sup>-Generation V-NAND Flash Memory with 82MB/s Write Throughput and 1.2Gb/s Interface.
Proceedings of the IEEE International Solid- State Circuits Conference, 2019
2017
Proceedings of the 2017 IEEE International Solid-State Circuits Conference, 2017
2014
19.5 Three-dimensional 128Gb MLC vertical NAND Flash-memory with 24-WL stacked layers and 50MB/s high-speed programming.
Proceedings of the 2014 IEEE International Conference on Solid-State Circuits Conference, 2014