Pruek Vanna-Iampikul

According to our database, Pruek Vanna-Iampikul authored at least 17 papers between 2020 and 2025.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2025

Glass Interposer Integration of Logic and Memory Chiplets: PPA and Power/Signal Integrity Benefits.

Pruek Vanna-Iampikul, Seungmin Woo, Serhat Erdogan, Lingjun Zhu, Mohanalingam Kathaperumal, Ravi Agarwal, Ram Gupta, Kevin Rinebold, Madhavan Swaminathan, Sung Kyu Lim

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., May, 2025

Placement-Aware 3D Net-to-Pad Assignment for Array-Style Hybrid Bonding 3D ICs.

Pruek Vanna-Iampikul, Jun-Sik Yoon, Chaeryung Park, Gary Yeap, Sung Kyu Lim

Proceedings of the 2025 International Symposium on Physical Design, 2025

2024

Towards 3D Acceleration for low-power Mixture-of-Experts and Multi-Head Attention Spiking Transformers.

Boxun Xu, Junyoung Hwang, Pruek Vanna-Iampikul, Yuxuan Yin, Sung Kyu Lim, Peng Li

CoRR, 2024

Back-side Design Methodology for Power Delivery Network and Clock Routing.

Pruek Vanna-Iampikul, Hang Yang, Jungyoun Kwak, Joyce X. Hu, Amaan Rahman, Nesara Eranna Bethur, Callie Hao, Shimeng Yu, Sung Kyu Lim

Proceedings of the IEEE Symposium on VLSI Technology and Circuits 2024, 2024

FastTuner: Transferable Physical Design Parameter Optimization using Fast Reinforcement Learning.

Hao-Hsiang Hsiao, Yi-Chen Lu, Pruek Vanna-Iampikul, Sung Kyu Lim

Proceedings of the 2024 International Symposium on Physical Design, 2024

Spiking Transformer Hardware Accelerators in 3D Integration.

Boxun Xu, Junyoung Hwang, Pruek Vanna-Iampikul, Sung Kyu Lim, Peng Li

Proceedings of the 43rd IEEE/ACM International Conference on Computer-Aided Design, 2024

AI-Driven Evaluation and Optimization of Bump Pitch Effects on Chiplet and Interposer Design Quality.

Seungmin Woo, Pruek Vanna-Iampikul, Sung Kyu Lim

Proceedings of the 43rd IEEE/ACM International Conference on Computer-Aided Design, 2024

ML-based Physical Design Parameter Optimization for 3D ICs: From Parameter Selection to Optimization.

Hao-Hsiang Hsiao, Pruek Vanna-Iampikul, Yi-Chen Lu, Sung Kyu Lim

Proceedings of the 61st ACM/IEEE Design Automation Conference, 2024

GNN-assisted Back-side Clock Routing Methodology for Advance Technologies.

Nesara Eranna Bethur, Pruek Vanna-Iampikul, Odysseas Zografos, Lingjun Zhu, Giuliano Sisto, Dragomir Milojevic, Alberto García Ortiz, Geert Hellings, Julien Ryckaert, Francky Catthoor, Sung Kyu Lim

Proceedings of the 61st ACM/IEEE Design Automation Conference, 2024

2023

GNN-based Multi-bit Flip-flop Clustering and Post-clustering Design Optimization for Energy-efficient 3D ICs.

Pruek Vanna-Iampikul, Yi-Chen Lu, Da Eun Shim, Sung Kyu Lim

ACM Trans. Design Autom. Electr. Syst., September, 2023

Snap-3D: A Constrained Placement-Driven Physical Design Methodology for High Performance 3-D ICs.

Pruek Vanna-Iampikul, Chengjia Shao, Yi-Chen Lu, Sai Pentapati, Yun Heo, Jae-Seung Choi, Sung Kyu Lim

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., July, 2023

Abisko: Deep codesign of an architecture for spiking neural networks using novel neuromorphic materials.

Jeffrey S. Vetter, Prasanna Date, Farah Fahim, Shruti R. Kulkarni, Petro Maksymovych, A. Alec Talin, Marc González Tallada, Pruek Vanna-Iampikul, Aaron R. Young, David Brooks, Yu Cao, Gu-Yeon Wei, Sung Kyu Lim, Frank Liu, Matthew J. Marinella, Bobby G. Sumpter, Narasinga Rao Miniskar

Int. J. High Perform. Comput. Appl., July, 2023

A 3D Implementation of Convolutional Neural Network for Fast Inference.

Narasinga Rao Miniskar, Pruek Vanna-Iampikul, Aaron R. Young, Sung Kyu Lim, Frank Liu, Jieun Yoo, Corrinne Mills, Nhan Tran, Farah Fahim, Jeffrey S. Vetter

Proceedings of the IEEE International Symposium on Circuits and Systems, 2023

Glass Interposer Integration of Logic and Memory Chiplets: PPA and Power/Signal Integrity Benefits.

Pruek Vanna-Iampikul, Lingjun Zhu, Serhat Erdogan, Mohanalingam Kathaperumal, Ravi Agarwal, Ram Gupta, Kevin Rinebold, Sung Kyu Lim

Proceedings of the 60th ACM/IEEE Design Automation Conference, 2023

2022

Design Automation and Test Solutions for Monolithic 3D ICs.

Lingjun Zhu, Arjun Chaudhuri, Sanmitra Banerjee, Gauthaman Murali, Pruek Vanna-Iampikul, Krishnendu Chakrabarty, Sung Kyu Lim

ACM J. Emerg. Technol. Comput. Syst., 2022

2021

Snap-3D: A Constrained Placement-Driven Physical Design Methodology for Face-to-Face-Bonded 3D ICs.

Pruek Vanna-Iampikul, Chengjia Shao, Yi-Chen Lu, Sai Pentapati, Sung Kyu Lim

Proceedings of the ISPD '21: International Symposium on Physical Design, 2021

2020

RTL-to-GDS Design Tools for Monolithic 3D ICs.

Jinwoo Kim, Gauthaman Murali, Pruek Vanna-Iampikul, Edward Lee, Daehyun Kim, Arjun Chaudhuri, Sanmitra Banerjee, Krishnendu Chakrabarty, Saibal Mukhopadhyay, Sung Kyu Lim

Proceedings of the IEEE/ACM International Conference On Computer Aided Design, 2020