Pruek Vanna-Iampikul

According to our database, Pruek Vanna-Iampikul authored at least 9 papers between 2020 and 2024.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2024

FastTuner: Transferable Physical Design Parameter Optimization using Fast Reinforcement Learning.

Hao-Hsiang Hsiao, Yi-Chen Lu, Pruek Vanna-Iampikul, Sung Kyu Lim

Proceedings of the 2024 International Symposium on Physical Design, 2024

2023

GNN-based Multi-bit Flip-flop Clustering and Post-clustering Design Optimization for Energy-efficient 3D ICs.

Pruek Vanna-Iampikul, Yi-Chen Lu, Da Eun Shim, Sung Kyu Lim

ACM Trans. Design Autom. Electr. Syst., September, 2023

Snap-3D: A Constrained Placement-Driven Physical Design Methodology for High Performance 3-D ICs.

Pruek Vanna-Iampikul, Chengjia Shao, Yi-Chen Lu, Sai Pentapati, Yun Heo, Jae-Seung Choi, Sung Kyu Lim

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., July, 2023

Abisko: Deep codesign of an architecture for spiking neural networks using novel neuromorphic materials.

Jeffrey S. Vetter, Prasanna Date, Farah Fahim, Shruti R. Kulkarni, Petro Maksymovych, A. Alec Talin, Marc González Tallada, Pruek Vanna-Iampikul, Aaron R. Young, David Brooks, Yu Cao, Gu-Yeon Wei, Sung Kyu Lim, Frank Liu, Matthew J. Marinella, Bobby G. Sumpter, Narasinga Rao Miniskar

Int. J. High Perform. Comput. Appl., July, 2023

A 3D Implementation of Convolutional Neural Network for Fast Inference.

Narasinga Rao Miniskar, Pruek Vanna-Iampikul, Aaron R. Young, Sung Kyu Lim, Frank Liu, Jieun Yoo, Corrinne Mills, Nhan Tran, Farah Fahim, Jeffrey S. Vetter

Proceedings of the IEEE International Symposium on Circuits and Systems, 2023

Glass Interposer Integration of Logic and Memory Chiplets: PPA and Power/Signal Integrity Benefits.

Pruek Vanna-Iampikul, Lingjun Zhu, Serhat Erdogan, Mohanalingam Kathaperumal, Ravi Agarwal, Ram Gupta, Kevin Rinebold, Sung Kyu Lim

Proceedings of the 60th ACM/IEEE Design Automation Conference, 2023

2022

Design Automation and Test Solutions for Monolithic 3D ICs.

Lingjun Zhu, Arjun Chaudhuri, Sanmitra Banerjee, Gauthaman Murali, Pruek Vanna-Iampikul, Krishnendu Chakrabarty, Sung Kyu Lim

ACM J. Emerg. Technol. Comput. Syst., 2022

2021

Snap-3D: A Constrained Placement-Driven Physical Design Methodology for Face-to-Face-Bonded 3D ICs.

Pruek Vanna-Iampikul, Chengjia Shao, Yi-Chen Lu, Sai Pentapati, Sung Kyu Lim

Proceedings of the ISPD '21: International Symposium on Physical Design, 2021

2020

RTL-to-GDS Design Tools for Monolithic 3D ICs.

Jinwoo Kim, Gauthaman Murali, Pruek Vanna-Iampikul, Edward Lee, Daehyun Kim, Arjun Chaudhuri, Sanmitra Banerjee, Krishnendu Chakrabarty, Saibal Mukhopadhyay, Sung Kyu Lim

Proceedings of the IEEE/ACM International Conference On Computer Aided Design, 2020