Pruek Vanna-Iampikul
Orcid: 0000-0002-2897-7142
According to our database1,
Pruek Vanna-Iampikul authored at least 23 papers
between 2020 and 2026.
Collaborative distances:
Collaborative distances:
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Bibliography
2026
A Hybrid Reinforcement Learning Framework for Efficient Physical Design Parameter Tuning.
ACM Trans. Design Autom. Electr. Syst., May, 2026
Boosting Scalability and Performance: Macro Placement for Flexible 3D-Stacked ML Accelerators.
Proceedings of the 31st Asia and South Pacific Design Automation Conference, 2026
2025
Glass Interposer Integration of Logic and Memory Chiplets: PPA and Power/Signal Integrity Benefits.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., May, 2025
Proceedings of the 2025 International Symposium on Physical Design, 2025
3D Acceleration for Mixture-of-Experts and Multi-Head Attention Spiking Transformers with Dynamic Head Pruning.
Proceedings of the IEEE/ACM International Conference On Computer Aided Design, 2025
Closing the Gap: Advantages of Block-Level over Gate-Level in 3D IC Design for Advanced Nodes.
Proceedings of the IEEE/ACM International Conference On Computer Aided Design, 2025
GNN-MLS: Signal Routing in Mixed-Node 3D ICs through GNN-Assisted Metal Layer Sharing.
Proceedings of the 62nd ACM/IEEE Design Automation Conference, 2025
Proceedings of the 62nd ACM/IEEE Design Automation Conference, 2025
2024
Towards 3D Acceleration for low-power Mixture-of-Experts and Multi-Head Attention Spiking Transformers.
CoRR, 2024
Proceedings of the IEEE Symposium on VLSI Technology and Circuits 2024, 2024
FastTuner: Transferable Physical Design Parameter Optimization using Fast Reinforcement Learning.
Proceedings of the 2024 International Symposium on Physical Design, 2024
Proceedings of the 43rd IEEE/ACM International Conference on Computer-Aided Design, 2024
AI-Driven Evaluation and Optimization of Bump Pitch Effects on Chiplet and Interposer Design Quality.
Proceedings of the 43rd IEEE/ACM International Conference on Computer-Aided Design, 2024
ML-based Physical Design Parameter Optimization for 3D ICs: From Parameter Selection to Optimization.
Proceedings of the 61st ACM/IEEE Design Automation Conference, 2024
Proceedings of the 61st ACM/IEEE Design Automation Conference, 2024
2023
GNN-based Multi-bit Flip-flop Clustering and Post-clustering Design Optimization for Energy-efficient 3D ICs.
ACM Trans. Design Autom. Electr. Syst., September, 2023
Snap-3D: A Constrained Placement-Driven Physical Design Methodology for High Performance 3-D ICs.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., July, 2023
Abisko: Deep codesign of an architecture for spiking neural networks using novel neuromorphic materials.
Int. J. High Perform. Comput. Appl., July, 2023
Proceedings of the IEEE International Symposium on Circuits and Systems, 2023
Glass Interposer Integration of Logic and Memory Chiplets: PPA and Power/Signal Integrity Benefits.
Proceedings of the 60th ACM/IEEE Design Automation Conference, 2023
2022
ACM J. Emerg. Technol. Comput. Syst., 2022
2021
Snap-3D: A Constrained Placement-Driven Physical Design Methodology for Face-to-Face-Bonded 3D ICs.
Proceedings of the ISPD '21: International Symposium on Physical Design, 2021
2020
Proceedings of the IEEE/ACM International Conference On Computer Aided Design, 2020